KR20260049120A - 열경화형 접착 시트 및 프린트 배선판 - Google Patents
열경화형 접착 시트 및 프린트 배선판Info
- Publication number
- KR20260049120A KR20260049120A KR1020257043589A KR20257043589A KR20260049120A KR 20260049120 A KR20260049120 A KR 20260049120A KR 1020257043589 A KR1020257043589 A KR 1020257043589A KR 20257043589 A KR20257043589 A KR 20257043589A KR 20260049120 A KR20260049120 A KR 20260049120A
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive sheet
- thermosetting adhesive
- resin
- mass
- styrene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/06—Copolymers with styrene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
- C09J125/02—Homopolymers or copolymers of hydrocarbons
- C09J125/04—Homopolymers or copolymers of styrene
- C09J125/08—Copolymers of styrene
- C09J125/10—Copolymers of styrene with conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023130949 | 2023-08-10 | ||
| JPJP-P-2023-130949 | 2023-08-10 | ||
| PCT/JP2024/021198 WO2025032956A1 (ja) | 2023-08-10 | 2024-06-11 | 熱硬化型接着シート及びプリント配線板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20260049120A true KR20260049120A (ko) | 2026-04-13 |
Family
ID=94534190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257043589A Pending KR20260049120A (ko) | 2023-08-10 | 2024-06-11 | 열경화형 접착 시트 및 프린트 배선판 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2025032956A1 (https=) |
| KR (1) | KR20260049120A (https=) |
| CN (1) | CN121368620A (https=) |
| TW (1) | TW202506937A (https=) |
| WO (1) | WO2025032956A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025220699A1 (ja) * | 2024-04-17 | 2025-10-23 | 株式会社レゾナック | 硬化物及び半導体装置の製造方法、並びに組成物 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005277135A (ja) * | 2004-03-25 | 2005-10-06 | Toray Ind Inc | 半導体用接着剤組成物およびそれを用いた半導体用接着剤シート、半導体集積回路接続用基板、半導体装置 |
| JP2013145840A (ja) * | 2012-01-16 | 2013-07-25 | Mitsubishi Chemicals Corp | 三次元集積回路の層間充填層形成用塗布液、及び三次元集積回路の製造方法 |
| JP7676761B2 (ja) * | 2020-12-04 | 2025-05-15 | artience株式会社 | 絶縁性組成物、熱硬化性接着シート、熱伝導性接着層および複合部材 |
| JPWO2022255078A1 (https=) * | 2021-06-02 | 2022-12-08 |
-
2024
- 2024-05-29 TW TW113119758A patent/TW202506937A/zh unknown
- 2024-06-11 JP JP2025539157A patent/JPWO2025032956A1/ja active Pending
- 2024-06-11 KR KR1020257043589A patent/KR20260049120A/ko active Pending
- 2024-06-11 WO PCT/JP2024/021198 patent/WO2025032956A1/ja active Pending
- 2024-06-11 CN CN202480042577.0A patent/CN121368620A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202506937A (zh) | 2025-02-16 |
| JPWO2025032956A1 (https=) | 2025-02-13 |
| WO2025032956A1 (ja) | 2025-02-13 |
| CN121368620A (zh) | 2026-01-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106459704B (zh) | 低介电性粘合剂组合物 | |
| CN109476124B (zh) | 含有低介电粘合剂层的层叠体 | |
| JPWO2016185956A1 (ja) | 低誘電接着剤層を含有する積層体 | |
| TW202003760A (zh) | 低介電黏接劑組成物 | |
| CN107849429A (zh) | 低介电粘合剂组合物 | |
| CN114514300B (zh) | 粘接剂组合物、粘接片、层叠体以及印刷线路板 | |
| TW202216891A (zh) | 樹脂組成物、樹脂組成物的用途、接著片及積層板 | |
| CN115135715A (zh) | 热固性树脂组合物、树脂片、具有树脂的金属箔、覆金属层压体和印刷线路板 | |
| KR20260049120A (ko) | 열경화형 접착 시트 및 프린트 배선판 | |
| CN115768626A (zh) | 粘接剂组合物、粘接片、层叠体及印刷线路板 | |
| CN114555740B (zh) | 粘接膜、层叠体以及印刷线路板 | |
| KR20250070597A (ko) | 경화성 필름 조성물, 경화성 필름 및 이의 경화물 | |
| KR20260049119A (ko) | 열경화형 접착 시트 및 프린트 배선판 | |
| TW202337949A (zh) | 黏接劑組成物、黏接片、電磁波屏蔽薄膜、疊層體及印刷配線板 | |
| JP7794360B2 (ja) | 熱硬化型接着シート及びプリント配線板 | |
| CN114341300A (zh) | 聚烯烃系粘合剂组合物 | |
| TW202528501A (zh) | 黏接劑組成物及含有其之黏接片、覆金屬疊層板、印刷配線板 | |
| TWI921950B (zh) | 硬化性樹脂組成物、硬化物、清漆、預浸漬物及電路基板 | |
| JP7569954B1 (ja) | 熱硬化性接着剤組成物、熱硬化性接着シート及びプリント配線板 | |
| TW202607107A (zh) | 熱硬化性接著劑組合物、熱硬化性接著片及印刷佈線板 | |
| CN121219381A (zh) | 粘合剂组合物以及含有其的粘合片材、层叠体和印刷线路板 | |
| TW202540241A (zh) | 電絕緣性樹脂組成物、層間絕緣用片狀未硬化物、電路基板用積層體、電路基板及電路基板之製造方法 | |
| CN116997627A (zh) | 粘接剂组合物及含有其的粘接片材、层叠体和印刷线路板 | |
| CN120813661A (zh) | 粘合剂组合物及含有其的粘合片、层叠体及印刷线路板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| Q12 | Application published |
Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE) |