JPWO2025032956A1 - - Google Patents

Info

Publication number
JPWO2025032956A1
JPWO2025032956A1 JP2025539157A JP2025539157A JPWO2025032956A1 JP WO2025032956 A1 JPWO2025032956 A1 JP WO2025032956A1 JP 2025539157 A JP2025539157 A JP 2025539157A JP 2025539157 A JP2025539157 A JP 2025539157A JP WO2025032956 A1 JPWO2025032956 A1 JP WO2025032956A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025539157A
Other languages
Japanese (ja)
Other versions
JPWO2025032956A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025032956A1 publication Critical patent/JPWO2025032956A1/ja
Publication of JPWO2025032956A5 publication Critical patent/JPWO2025032956A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C09J125/10—Copolymers of styrene with conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
JP2025539157A 2023-08-10 2024-06-11 Pending JPWO2025032956A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023130949 2023-08-10
PCT/JP2024/021198 WO2025032956A1 (ja) 2023-08-10 2024-06-11 熱硬化型接着シート及びプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2025032956A1 true JPWO2025032956A1 (https=) 2025-02-13
JPWO2025032956A5 JPWO2025032956A5 (https=) 2025-09-10

Family

ID=94534190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025539157A Pending JPWO2025032956A1 (https=) 2023-08-10 2024-06-11

Country Status (5)

Country Link
JP (1) JPWO2025032956A1 (https=)
KR (1) KR20260049120A (https=)
CN (1) CN121368620A (https=)
TW (1) TW202506937A (https=)
WO (1) WO2025032956A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025220699A1 (ja) * 2024-04-17 2025-10-23 株式会社レゾナック 硬化物及び半導体装置の製造方法、並びに組成物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277135A (ja) * 2004-03-25 2005-10-06 Toray Ind Inc 半導体用接着剤組成物およびそれを用いた半導体用接着剤シート、半導体集積回路接続用基板、半導体装置
JP2013145840A (ja) * 2012-01-16 2013-07-25 Mitsubishi Chemicals Corp 三次元集積回路の層間充填層形成用塗布液、及び三次元集積回路の製造方法
JP2022089494A (ja) * 2020-12-04 2022-06-16 東洋インキＳｃホールディングス株式会社 絶縁性組成物、熱硬化性接着シート、熱伝導性接着層および複合部材
WO2022255078A1 (ja) * 2021-06-02 2022-12-08 ナミックス株式会社 樹脂組成物及びその製造方法、並びに接着フィルム及び層間接着用ボンディングシート

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277135A (ja) * 2004-03-25 2005-10-06 Toray Ind Inc 半導体用接着剤組成物およびそれを用いた半導体用接着剤シート、半導体集積回路接続用基板、半導体装置
JP2013145840A (ja) * 2012-01-16 2013-07-25 Mitsubishi Chemicals Corp 三次元集積回路の層間充填層形成用塗布液、及び三次元集積回路の製造方法
JP2022089494A (ja) * 2020-12-04 2022-06-16 東洋インキＳｃホールディングス株式会社 絶縁性組成物、熱硬化性接着シート、熱伝導性接着層および複合部材
WO2022255078A1 (ja) * 2021-06-02 2022-12-08 ナミックス株式会社 樹脂組成物及びその製造方法、並びに接着フィルム及び層間接着用ボンディングシート

Also Published As

Publication number Publication date
TW202506937A (zh) 2025-02-16
KR20260049120A (ko) 2026-04-13
WO2025032956A1 (ja) 2025-02-13
CN121368620A (zh) 2026-01-20

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