TW202506937A - 熱硬化型黏著片及印刷配線板 - Google Patents

熱硬化型黏著片及印刷配線板 Download PDF

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Publication number
TW202506937A
TW202506937A TW113119758A TW113119758A TW202506937A TW 202506937 A TW202506937 A TW 202506937A TW 113119758 A TW113119758 A TW 113119758A TW 113119758 A TW113119758 A TW 113119758A TW 202506937 A TW202506937 A TW 202506937A
Authority
TW
Taiwan
Prior art keywords
adhesive sheet
thermosetting adhesive
mass
styrene
resin
Prior art date
Application number
TW113119758A
Other languages
English (en)
Chinese (zh)
Inventor
伊原恵
大旗亮平
谷井翔太
Original Assignee
日商Ｄｉｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司
Publication of TW202506937A publication Critical patent/TW202506937A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C09J125/10—Copolymers of styrene with conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
TW113119758A 2023-08-10 2024-05-29 熱硬化型黏著片及印刷配線板 TW202506937A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023130949 2023-08-10
JP2023-130949 2023-08-10

Publications (1)

Publication Number Publication Date
TW202506937A true TW202506937A (zh) 2025-02-16

Family

ID=94534190

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113119758A TW202506937A (zh) 2023-08-10 2024-05-29 熱硬化型黏著片及印刷配線板

Country Status (5)

Country Link
JP (1) JPWO2025032956A1 (https=)
KR (1) KR20260049120A (https=)
CN (1) CN121368620A (https=)
TW (1) TW202506937A (https=)
WO (1) WO2025032956A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025220699A1 (ja) * 2024-04-17 2025-10-23 株式会社レゾナック 硬化物及び半導体装置の製造方法、並びに組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277135A (ja) * 2004-03-25 2005-10-06 Toray Ind Inc 半導体用接着剤組成物およびそれを用いた半導体用接着剤シート、半導体集積回路接続用基板、半導体装置
JP2013145840A (ja) * 2012-01-16 2013-07-25 Mitsubishi Chemicals Corp 三次元集積回路の層間充填層形成用塗布液、及び三次元集積回路の製造方法
JP7676761B2 (ja) * 2020-12-04 2025-05-15 ａｒｔｉｅｎｃｅ株式会社 絶縁性組成物、熱硬化性接着シート、熱伝導性接着層および複合部材
JPWO2022255078A1 (https=) * 2021-06-02 2022-12-08

Also Published As

Publication number Publication date
KR20260049120A (ko) 2026-04-13
JPWO2025032956A1 (https=) 2025-02-13
WO2025032956A1 (ja) 2025-02-13
CN121368620A (zh) 2026-01-20

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