JP7078215B2 - 金属箔積層板用熱硬化性樹脂複合体および金属箔積層板 - Google Patents
金属箔積層板用熱硬化性樹脂複合体および金属箔積層板 Download PDFInfo
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- JP7078215B2 JP7078215B2 JP2020526329A JP2020526329A JP7078215B2 JP 7078215 B2 JP7078215 B2 JP 7078215B2 JP 2020526329 A JP2020526329 A JP 2020526329A JP 2020526329 A JP2020526329 A JP 2020526329A JP 7078215 B2 JP7078215 B2 JP 7078215B2
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- thermosetting resin
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- metal foil
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
Description
熱応力因子(Thermal Stress Factor)
=∫[貯蔵弾性率(Storage Modulus)*熱膨張係数]dT
熱応力因子(Thermal Stress Factor)
=∫[貯蔵弾性率(Storage Modulus)*熱膨張係数]dT
当量比=前記アミン硬化剤に含有された総活性水素当量/前記熱硬化性樹脂に含有された総硬化性官能基当量
RはHまたはCH3であり、
nは0または1~50の整数である。
nは0または1~50の整数である。
R1およびR2はそれぞれ独立して、H、CH3またはC2H5である。
nは0または1~50の整数である。
nは0または1~50の整数である。
nは0または1~50の整数である。
○:Void発生なし
X:Void発生
○:反りの最大値と最小値差が170um以下
X:反りの最大値と最小値差が170um以上
熱応力因子(Thermal Stress Factor、単位:MPa)
=∫[貯蔵弾性率(Storage Modulus)*熱膨張係数]dT
実施例の半導体パッケージ用熱硬化性樹脂組成物の組成および金属箔積層板用熱硬化性樹脂複合体の物性確認(単位:g)
比較例の半導体パッケージ用熱硬化性樹脂組成物の組成および金属箔積層板用熱硬化性樹脂複合体の物性確認(単位:g)
[数式1]
熱硬化性樹脂に対するアミン化合物当量比
=(DDSの総活性水素当量+TFBの総活性水素当量+DDMの総活性水素当量)/{(XD-1000の総エポキシ当量+NC-3000Hの総エポキシ当量+HP-6000の総エポキシ当量)+(BMI-2300の総マレイミド当量)}
TFBの総活性水素当量はTFBの総重量(g)をTFBの活性水素単位当量(80g/eq)で除した値であり、
DDMの総活性水素当量はDDMの総重量(g)をDDMの活性水素単位当量(49.5g/eq)で除した値であり、
XD-1000の総エポキシ当量はXD-1000の総重量(g)をXD-1000のエポキシ単位当量(253g/eq)で除した値であり、
NC-3000Hの総エポキシ当量はNC-3000Hの総重量(g)をNC-3000Hのエポキシ単位当量(290g/eq)で除した値であり、
HP-6000の総エポキシ当量はHP-6000の総重量(g)をHP-6000のエポキシ単位当量(250g/eq)で除した値であり、
BMI-2300の総マレイミド当量はBMI-2300の総重量(g)をBMI-2300のマレイミド単位当量(179g/eq)で除した値である。
Claims (8)
- 下記一般式1の熱応力因子が25Mpa以下である金属箔積層板用熱硬化性樹脂複合体であり、
前記金属箔積層板用熱硬化性樹脂複合体が熱硬化性樹脂組成物および繊維基材を含み、
前記熱硬化性樹脂組成物は、アミン化合物、熱硬化性樹脂、熱可塑性樹脂および無機充填剤を含み、
前記アミン化合物は、芳香環に、
スルホン基;および
ハロゲン基で置換された炭素数1~20のアルキル基;
からなる群より選ばれた1種以上の官能基を1以上含む芳香環ジアミン化合物を含み、
前記熱硬化性樹脂は、エポキシ樹脂およびビスマレイミド樹脂を含み、
前記熱可塑性樹脂は、アクリルゴムを含み、
前記無機充填剤は、平均粒径が相異する2種以上の無機充填剤を含み、
前記2種以上の無機充填剤のうち少なくとも1種が平均粒径が0.1μm~100μmであるシリカであり、
他の1種が平均粒径が1nm~90nmであるシリカであり、
前記熱硬化性樹脂組成物は、前記アミン化合物100重量部に対して前記熱硬化性樹脂400重量部以下で含み、
前記熱硬化性樹脂組成物は、下記数式1により計算される当量比が1.4以上を満たしており、
前記熱硬化性樹脂組成物は、前記熱硬化性樹脂、熱可塑性樹脂およびアミン化合物の総和100重量部に対して前記無機充填剤50重量部~150重量部を含む、金属箔積層板用熱硬化性樹脂複合体。
[一般式1]
熱応力因子(Thermal Stress Factor)
=∫[貯蔵弾性率(Storage Modulus)*熱膨張係数]dT
前記一般式1において、
前記熱応力因子、貯蔵弾性率および熱膨張係数は、それぞれ30℃~260℃の範囲で定義されるか測定される値である。
[数式1]
当量比=前記アミン化合物に含有された総活性水素当量/前記熱硬化性樹脂に含有された総硬化性官能基当量。 - 前記金属箔積層板用熱硬化性樹脂複合体が有する前記一般式1の熱応力因子の範囲が10~25Mpaである、
請求項1に記載の金属箔積層板用熱硬化性樹脂複合体。 - 前記熱硬化性樹脂組成物は、230℃以下のガラス転移温度を有する、
請求項1又は2に記載の金属箔積層板用熱硬化性樹脂複合体。 - 前記アミン化合物は、2~5個のアミン基を含む芳香族アミン化合物を含む、
請求項1から3のいずれか1項に記載の金属箔積層板用熱硬化性樹脂複合体。 - 前記金属箔積層板用熱硬化性樹脂複合体の30℃および180℃における貯蔵弾性率が、それぞれ16Gpa以下である、
請求項1から4のいずれか1項に記載の金属箔積層板用熱硬化性樹脂複合体。 - 前記金属箔積層板用熱硬化性樹脂複合体の260℃における貯蔵弾性率が、8Gpa以下である、
請求項5に記載の金属箔積層板用熱硬化性樹脂複合体。 - 前記金属箔積層板用熱硬化性樹脂複合体の熱膨張係数が5~12ppm/℃である、
請求項1から6のいずれか1項に記載の金属箔積層板用熱硬化性樹脂複合体。 - シート形状を有する請求項1から7のいずれか1項に記載の金属箔積層板用熱硬化性樹脂複合体;および
前記金属箔積層板用熱硬化性樹脂複合体の少なくとも一面に形成された金属箔;
を含む
金属箔積層板。
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KR1020190036078A KR102245724B1 (ko) | 2018-06-20 | 2019-03-28 | 금속박 적층판용 열경화성 수지 복합체 및 금속박 적층판 |
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JP2017193614A (ja) | 2016-04-19 | 2017-10-26 | パナソニックIpマネジメント株式会社 | プリプレグ、金属張積層板及びプリント配線板 |
Cited By (1)
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US8728232B2 (en) | 2005-05-27 | 2014-05-20 | Hitachi Chemical Co., Ltd. | Single crystal heat treatment method |
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