JP6852249B2 - 半導体パッケージ用樹脂組成物とこれを用いたプリプレグおよび金属箔積層板 - Google Patents
半導体パッケージ用樹脂組成物とこれを用いたプリプレグおよび金属箔積層板 Download PDFInfo
- Publication number
- JP6852249B2 JP6852249B2 JP2019506370A JP2019506370A JP6852249B2 JP 6852249 B2 JP6852249 B2 JP 6852249B2 JP 2019506370 A JP2019506370 A JP 2019506370A JP 2019506370 A JP2019506370 A JP 2019506370A JP 6852249 B2 JP6852249 B2 JP 6852249B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- carbon atoms
- groups
- resin
- semiconductor package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011342 resin composition Substances 0.000 title claims description 88
- 239000004065 semiconductor Substances 0.000 title claims description 86
- 229910052751 metal Inorganic materials 0.000 title claims description 27
- 239000002184 metal Substances 0.000 title claims description 27
- 238000004806 packaging method and process Methods 0.000 title description 10
- 229920005989 resin Polymers 0.000 claims description 106
- 239000011347 resin Substances 0.000 claims description 106
- 125000004432 carbon atom Chemical group C* 0.000 claims description 96
- 239000000126 substance Substances 0.000 claims description 81
- 239000003795 chemical substances by application Substances 0.000 claims description 54
- 229920001187 thermosetting polymer Polymers 0.000 claims description 50
- 150000001412 amines Chemical class 0.000 claims description 48
- 239000011256 inorganic filler Substances 0.000 claims description 45
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 45
- 125000003118 aryl group Chemical group 0.000 claims description 38
- 239000003822 epoxy resin Substances 0.000 claims description 38
- 125000000524 functional group Chemical group 0.000 claims description 38
- 229920000647 polyepoxide Polymers 0.000 claims description 38
- 125000005843 halogen group Chemical group 0.000 claims description 34
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 31
- 125000000217 alkyl group Chemical group 0.000 claims description 30
- 125000001072 heteroaryl group Chemical group 0.000 claims description 28
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 22
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 20
- 239000002245 particle Substances 0.000 claims description 20
- 239000000835 fiber Substances 0.000 claims description 17
- 239000011888 foil Substances 0.000 claims description 17
- 229910052739 hydrogen Inorganic materials 0.000 claims description 17
- 239000001257 hydrogen Substances 0.000 claims description 17
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 16
- 125000002947 alkylene group Chemical group 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 12
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 12
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 10
- -1 silane compound Chemical group 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 9
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 8
- 239000007822 coupling agent Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical group O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 claims description 6
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 5
- 229910000077 silane Inorganic materials 0.000 claims description 4
- 125000001174 sulfone group Chemical group 0.000 claims description 4
- 125000002091 cationic group Chemical group 0.000 claims description 2
- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical compound [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 claims description 2
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 3
- 229910052799 carbon Inorganic materials 0.000 claims 3
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical group N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims 2
- 238000000034 method Methods 0.000 description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 26
- 239000011889 copper foil Substances 0.000 description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 15
- 239000000945 filler Substances 0.000 description 15
- 239000011521 glass Substances 0.000 description 15
- 125000006575 electron-withdrawing group Chemical group 0.000 description 12
- 239000003365 glass fiber Substances 0.000 description 11
- 239000002966 varnish Substances 0.000 description 11
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 8
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 8
- 238000000926 separation method Methods 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 125000001424 substituent group Chemical group 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910001128 Sn alloy Inorganic materials 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 229920001225 polyester resin Polymers 0.000 description 4
- 239000004645 polyester resin Substances 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- 125000000547 substituted alkyl group Chemical group 0.000 description 4
- 0 *c(cc(*c(cc1*)cc(*)c1N(C(C=C1)=O)C1=O)cc1*)c1N(C(C=C1)=O)C1=O Chemical compound *c(cc(*c(cc1*)cc(*)c1N(C(C=C1)=O)C1=O)cc1*)c1N(C(C=C1)=O)C1=O 0.000 description 3
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 3
- 239000004643 cyanate ester Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- KGSFMPRFQVLGTJ-UHFFFAOYSA-N 1,1,2-triphenylethylbenzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 KGSFMPRFQVLGTJ-UHFFFAOYSA-N 0.000 description 2
- ZPQAUEDTKNBRNG-UHFFFAOYSA-N 2-methylprop-2-enoylsilicon Chemical compound CC(=C)C([Si])=O ZPQAUEDTKNBRNG-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- JPZRPCNEISCANI-UHFFFAOYSA-N 4-(4-aminophenyl)-3-(trifluoromethyl)aniline Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F JPZRPCNEISCANI-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- PVFQHGDIOXNKIC-UHFFFAOYSA-N 4-[2-[3-[2-(4-hydroxyphenyl)propan-2-yl]phenyl]propan-2-yl]phenol Chemical compound C=1C=CC(C(C)(C)C=2C=CC(O)=CC=2)=CC=1C(C)(C)C1=CC=C(O)C=C1 PVFQHGDIOXNKIC-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- IPJGAEWUPXWFPL-UHFFFAOYSA-N O=C(C=CC1=O)N1c1cccc(N(C(C=C2)=O)C2=O)c1 Chemical compound O=C(C=CC1=O)N1c1cccc(N(C(C=C2)=O)C2=O)c1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000002950 monocyclic group Chemical group 0.000 description 2
- GLTDLAUASUFHNK-UHFFFAOYSA-N n-silylaniline Chemical compound [SiH3]NC1=CC=CC=C1 GLTDLAUASUFHNK-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 125000003367 polycyclic group Chemical group 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229910021487 silica fume Inorganic materials 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- 125000000355 1,3-benzoxazolyl group Chemical group O1C(=NC2=C1C=CC=C2)* 0.000 description 1
- FCEHBMOGCRZNNI-UHFFFAOYSA-N 1-benzothiophene Chemical group C1=CC=C2SC=CC2=C1 FCEHBMOGCRZNNI-UHFFFAOYSA-N 0.000 description 1
- MYKQKWIPLZEVOW-UHFFFAOYSA-N 11h-benzo[a]carbazole Chemical group C1=CC2=CC=CC=C2C2=C1C1=CC=CC=C1N2 MYKQKWIPLZEVOW-UHFFFAOYSA-N 0.000 description 1
- NFBOSXCHMVQCGV-UHFFFAOYSA-N 2,2,2-trifluoro-1-N,1-N'-diphenylethane-1,1-diamine Chemical compound FC(C(NC1=CC=CC=C1)NC1=CC=CC=C1)(F)F NFBOSXCHMVQCGV-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical class N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- FWOLORXQTIGHFX-UHFFFAOYSA-N 4-(4-amino-2,3,5,6-tetrafluorophenyl)-2,3,5,6-tetrafluoroaniline Chemical compound FC1=C(F)C(N)=C(F)C(F)=C1C1=C(F)C(F)=C(N)C(F)=C1F FWOLORXQTIGHFX-UHFFFAOYSA-N 0.000 description 1
- QGMGHALXLXKCBD-UHFFFAOYSA-N 4-amino-n-(2-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC1=CC=CC=C1N QGMGHALXLXKCBD-UHFFFAOYSA-N 0.000 description 1
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 1
- ABOVWMLOEOKJJS-GQCTYLIASA-N C/C(/OC#N)=C\C=C Chemical compound C/C(/OC#N)=C\C=C ABOVWMLOEOKJJS-GQCTYLIASA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical group C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical group C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical group C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical group C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000005428 anthryl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C3C(*)=C([H])C([H])=C([H])C3=C([H])C2=C1[H] 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 125000003785 benzimidazolyl group Chemical group N1=C(NC2=C1C=CC=C2)* 0.000 description 1
- 125000000499 benzofuranyl group Chemical group O1C(=CC2=C1C=CC=C2)* 0.000 description 1
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical group C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 125000000609 carbazolyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3NC12)* 0.000 description 1
- 125000002676 chrysenyl group Chemical group C1(=CC=CC=2C3=CC=C4C=CC=CC4=C3C=CC12)* 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- TXCDCPKCNAJMEE-UHFFFAOYSA-N dibenzofuran Chemical group C1=CC=C2C3=CC=CC=C3OC2=C1 TXCDCPKCNAJMEE-UHFFFAOYSA-N 0.000 description 1
- IYYZUPMFVPLQIF-ALWQSETLSA-N dibenzothiophene Chemical group C1=CC=CC=2[34S]C3=C(C=21)C=CC=C3 IYYZUPMFVPLQIF-ALWQSETLSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000002183 isoquinolinyl group Chemical group C1(=NC=CC2=CC=CC=C12)* 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- WCPAKWJPBJAGKN-UHFFFAOYSA-N oxadiazole Chemical group C1=CON=N1 WCPAKWJPBJAGKN-UHFFFAOYSA-N 0.000 description 1
- 125000002971 oxazolyl group Chemical group 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000005561 phenanthryl group Chemical group 0.000 description 1
- NAKOELLGRBLZOF-UHFFFAOYSA-N phenoxybenzene;pyrrole-2,5-dione Chemical compound O=C1NC(=O)C=C1.O=C1NC(=O)C=C1.C=1C=CC=CC=1OC1=CC=CC=C1 NAKOELLGRBLZOF-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 125000001725 pyrenyl group Chemical group 0.000 description 1
- PBMFSQRYOILNGV-UHFFFAOYSA-N pyridazine Chemical group C1=CC=NN=C1 PBMFSQRYOILNGV-UHFFFAOYSA-N 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 125000000168 pyrrolyl group Chemical group 0.000 description 1
- 125000002943 quinolinyl group Chemical group N1=C(C=CC2=CC=CC=C12)* 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 125000005156 substituted alkylene group Chemical group 0.000 description 1
- 125000003107 substituted aryl group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 125000001425 triazolyl group Chemical group 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L79/085—Unsaturated polyimide precursors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/02—Polyglycidyl ethers of bis-phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
本出願は2017年3月22日付韓国特許出願第10−2017−0036105号および2018年2月13日付韓国特許出願第10−2018−0018019号に基づいた優先権の利益を主張し、当該韓国特許出願の文献に開示されたすべての内容は本明細書の一部として含まれている。
[化学式1]
前記炭素数1〜10のアルキレン基、炭素数1〜6のアルキル基、炭素数6〜15のアリール基、および炭素数2〜20のヘテロアリール基は、それぞれ独立してニトロ基、シアノ基およびハロゲン基からなる群より選ばれた1種以上の官能基に置換され、
[化学式2]
[化学式3]
[化学式1−1]
[化学式2−1]
[化学式3−1]
[数学式1]
当量比=前記アミン硬化剤に含有された総活性水素当量/前記熱硬化性樹脂に含有された総硬化性官能基当量
より具体的には、前記数学式1において、前記アミン硬化剤に含有された総活性水素当量は、前記アミン硬化剤の総重量(単位:g)を前記アミン硬化剤の活性水素単位当量(g/eq)で割った値を意味する。
[化学式5]
Rは、
nは、0または1〜50の整数である。
[化学式6]
Rは、HまたはCH3であり、
nは、0または1〜50の整数である。
[化学式7]
nは、0または1〜50の整数である。
[化学式13]
R1およびR2は、それぞれ独立して、H,CH3またはC2H5である。
[化学式14]
nは、0または1〜50の整数である。
[化学式17]
nは、0または1〜50の整数である。
下記の表1および表2の組成に従い、各成分をメチルエチルケトンに固形分65%に合わせて投入して混合した後、400rpm速度で一日間常温撹はんして実施例1〜5、比較例1〜4の半導体パッケージ用樹脂組成物(樹脂ワニス)を製造した。具体的には、前記実施例1〜5で製造した樹脂組成物の具体的な組成は、下記の表1に記載されたとおりであり、前記比較例1〜4で製造された樹脂組成物の具体的な組成は、下記の表2に記載されたとおりである。
前記製造された半導体パッケージ用樹脂組成物(樹脂ワニス)を厚さ15μmのガラス繊維(Nittobo社製、T−glass #1017)に含浸させた後、170℃の温度で2〜5分間熱風乾燥して25μmのプリプレグを製造した。
*TFB:2,2'−bis(trifluoromethyl)benzidine;2,2'−Bis(trifluoromethyl)−4,4'−biphenyldiamine
*DDM:4,4'−diaminodiphenyl methane
*DDE:4,4'−diaminodiphenyl ether
*XD−1000:エポキシ樹脂(Nippon kayaku社)
*NC−3000H:エポキシ樹脂(Nippon kayaku社)
*HP−6000:ナフタレン系エポキシ樹脂(DIC社)
*BMI−2300:ビスマレイミド樹脂(DAIWA社)
*SC2050MTO:フェニルアミノシラン処理したスラリータイプのマイクロシリカ、平均粒径0.5μm(Admantechs社)
*AC4130Y:メタクリルシラン処理したスラリータイプのナノシリカ、平均粒径50nm(Nissan chemical社)
*当量比:下記の数学式1により計算される
[数学式1]
熱硬化性樹脂に対するアミン硬化剤の当量比=(DDSの総活性水素当量+TFBの総活性水素当量+DDMの総活性水素当量+DDEの総活性水素当量)/{(XD−1000の総エポキシ当量+NC−3000Hの総エポキシ当量+HP−6000の総エポキシ当量)+(BMI−2300の総マレイミド当量)}
前記数学式1において、DDSの総活性水素当量は、DDSの総重量(g)をDDSの活性水素単位当量(62g/eq)で割った値であり、
TFBの総活性水素当量は、TFBの総重量(g)をTFBの活性水素単位当量(80g/eq)で割った値であり、
DDMの総活性水素当量は、DDMの総重量(g)をDDMの活性水素単位当量(49.5g/eq)で割った値であり、
DDEの総活性水素当量は、DDEの総重量(g)をDDEの活性水素単位当量(50g/eq)で割った値であり、
XD−1000の総エポキシ当量は、XD−1000の総重量(g)をXD−1000のエポキシ単位当量(253g/eq)で割った値であり、
NC−3000Hの総エポキシ当量は、NC−3000Hの総重量(g)をNC−3000Hのエポキシ単位当量(290g/eq)で割った値であり、
HP−6000の総エポキシ当量は、HP−6000の総重量(g)をHP−6000のエポキシ単位当量(250g/eq)で割った値であり、
BMI−2300の総マレイミド当量は、BMI−2300の総重量(g)をBMI−2300のマレイミド単位当量(179g/eq)で割った値である。
*TFB:2,2'−bis(trifluoromethyl)benzidine;2,2'−Bis(trifluoromethyl)−4,4'−biphenyldiamine
*DDM:4,4'−diaminodiphenyl methane
*DDE:4,4'−diaminodiphenyl ether
*XD−1000:エポキシ樹脂(Nippon kayaku社)
*NC−3000H:エポキシ樹脂(Nippon kayaku社)
*HP−6000:エポキシ樹脂(DIC社)
*BMI−2300:ビスマレイミド系樹脂(DAIWA社)
*SC2050MTO:フェニルアミノシラン処理したスラリータイプのマイクロシリカ、平均粒径0.5μm(Admantechs社)
*AC4130Y:メタクリルシラン処理したスラリータイプのナノシリカ、平均粒径50nm(Nissan chemical社)
*当量比:前記表1と同様の数学式1により計算
前記実施例および比較例で得られた半導体パッケージ用樹脂組成物、プリプレグおよび銅箔積層板の物性を下記方法で測定し、その結果を表3に示した。
前記実施例および比較例で得られた銅箔積層板の銅箔層をエッチングして除去した後、MD方向に試験片を製作し、TMA(TA Instruments,Q400)を用いて、30℃から260℃まで、昇温速度10℃/min条件で測定した後、50℃から150℃範囲の測定値を熱膨張係数として記録した。
IPC−TM−650(2.3.17)に準拠し、前記実施例および比較例で得られたプリプレグ状態でカーバープレス(Carver社、#3893.4NE0000)を用いてRFを測定した。
IPC−TM−650(2.3.17)に準拠し、前記実施例および比較例で得られたプリプレグを常温で1月間保管した後の状態でカーバープレス(Carver社、#3893.4NE0000)を用いてRFを測定した。
前記実施例および比較例で得られた銅箔積層板で片面の銅箔層をエッチングして除去した後、光学顕微鏡を用いてプリプレグ面を観察して樹脂と無機充填剤との間の分離発生の有無を確認し、次の基準下で混和性を評価した。
○:樹脂と無機充填剤との間の分離未発生
X:樹脂と無機充填剤との間の分離発生
前記実施例および比較例で得られたプリプレグに対して、レオメータ(Anton Paar社、Modular compact Rheometer MCR 302)を用いて、50℃から200℃まで、昇温速度5℃/min、Normal Force 5N、Frequency 10Hz,amplitude 0.5%の条件で測定して粘度を評価し、最小粘度および最小粘度を現わす温度を記録した。
前記実施例および比較例で得られたプリプレグをガラス繊維のMDおよびTD方向が一致するように10枚を積層し、220℃および35kg/cm2の条件で100分間プレスした後、IPC−TM−650(2.4.18.3)に準拠し、Universal Testing Machine(Instron 3365)装備を用いてMD方向の引張伸び率を測定した。
Claims (12)
- スルホン基、カルボニル基、ハロゲン基、炭素数1〜20のアルキル基、炭素数6〜20のアリール基、炭素数2〜30のヘテロアリール基および炭素数1〜20のアルキレン基からなる群より選ばれた1種以上の官能基を含むアミン硬化剤;
エポキシ樹脂およびビスマレイミド樹脂を含む熱硬化性樹脂;
平均粒径が0.1μm〜100μmの第1無機充填剤および平均粒径が1nm〜90nmの第2無機充填剤を含有した無機充填剤を含み、
前記アミン硬化剤100重量部に対して前記熱硬化性樹脂の含有量が400重量部以下であり、
前記アミン硬化剤に含まれた炭素数1〜20のアルキル基、炭素数6〜20のアリール基、炭素数2〜30のヘテロアリール基および炭素数1〜20のアルキレン基は、それぞれ独立してニトロ基、シアノ基およびハロゲン基からなる群より選ばれた1種以上の官能基に置換され、
前記第1無機充填剤100重量部に対して前記第2無機充填剤の含有量が1重量部〜50重量部であり、
下記の数学式1
[数学式1]
当量比=前記アミン硬化剤に含有された総活性水素当量/前記熱硬化性樹脂に含有された総硬化性官能基当量。
で計算される当量比が1.4以上である、半導体パッケージ用樹脂組成物。 - 前記アミン硬化剤は、下記の化学式1〜3からなる群より選ばれた1種以上の化合物を含む、請求項1に記載の半導体パッケージ用樹脂組成物:
[化学式1]
Aは、スルホン基、カルボニル基、または炭素数1〜10のアルキレン基であり、
X1〜X8は、それぞれ独立してニトロ基、シアノ基、水素原子、ハロゲン基、炭素数1〜6のアルキル基、炭素数6〜15のアリール基、または炭素数2〜20のヘテロアリール基であり、
R1、R1'、R2およびR2'は、それぞれ独立して水素原子、ハロゲン基、炭素数1〜6のアルキル基、炭素数6〜15のアリール基、または炭素数2〜20のヘテロアリール基であり、
前記Aがアルキレン基である場合、nは、1〜10の整数であり、
前記Aがスルホン基またはカルボニル基である場合、nは、1であり、
前記炭素数1〜10のアルキレン基、炭素数1〜6のアルキル基、炭素数6〜15のアリール基、および炭素数2〜20のヘテロアリール基は、それぞれ独立してニトロ基、シアノ基およびハロゲン基からなる群より選ばれた1種以上の官能基に置換され、
[化学式2]
Y1〜Y8は、それぞれ独立してニトロ基、シアノ基、水素原子、ハロゲン基、炭素数1〜6のアルキル基、炭素数6〜15のアリール基、または炭素数2〜20のヘテロアリール基であり、
R3、R3'、R4およびR4'は、それぞれ独立して水素原子、ハロゲン基、炭素数1〜6のアルキル基、炭素数6〜15のアリール基、または炭素数2〜20のヘテロアリール基であり、
mは、1であり、
ただし、前記Y1〜Y8、R3、R3'、R4およびR4'の少なくともいずれかは、
(i)ニトロ基、
(ii)シアノ基、
(iii)ハロゲン基、
(iv)ニトロ基、シアノ基およびハロゲン基からなる群より選ばれた1種以上の官能基に置換された炭素数1〜6のアルキル基、
(v)ニトロ基、シアノ基およびハロゲン基からなる群より選ばれた1種以上の官能基に置換された炭素数6〜15のアリール基、または
(vi)ニトロ基、シアノ基およびハロゲン基からなる群より選ばれた1種以上の官能基に置換された炭素数2〜20のヘテロアリール基
であり、
[化学式3]
Z1〜Z4は、それぞれ独立してニトロ基、シアノ基、水素原子、ハロゲン基、炭素数1〜6のアルキル基、炭素数6〜15のアリール基、または炭素数2〜20のヘテロアリール基であり、
R5、R5'、R6およびR6'は、それぞれ独立して水素原子、ハロゲン基、炭素数1〜6のアルキル基、炭素数6〜15のアリール基、または炭素数2〜20のヘテロアリール基であり、
ただし、前記Z1〜Z4、R5、R5'、R6およびR6'の少なくともいずれかは、
(i)ニトロ基、
(ii)シアノ基、
(iii)ハロゲン基、
(iv)ニトロ基、シアノ基およびハロゲン基からなる群より選ばれた1種以上の官能基に置換された炭素数1〜6のアルキル基、
(v)ニトロ基、シアノ基およびハロゲン基からなる群より選ばれた1種以上の官能基に置換された炭素数6〜15のアリール基、または
(vi)ニトロ基、シアノ基およびハロゲン基からなる群より選ばれた1種以上の官能基に置換された炭素数2〜20のヘテロアリール基
である。 - 前記アミン硬化剤および熱硬化性樹脂100重量部に対して前記無機充填剤の含有量が200重量部以上である、請求項1または2に記載の半導体パッケージ用樹脂組成物。
- 前記アミン硬化剤および熱硬化性樹脂100重量部に対して前記無機充填剤の含有量が200重量部〜500重量部である、請求項1から3のいずれか一項に記載の半導体パッケージ用樹脂組成物。
- 前記平均粒径が0.1μm〜100μmの第1無機充填剤100重量部に対して前記平均粒径が1nm〜90nmの第2無機充填剤の含有量が1重量部〜50重量部である、請求項1から4のいずれか一項に記載の半導体パッケージ用樹脂組成物。
- 前記平均粒径が0.1μm〜100μmの第1無機充填剤または平均粒径が1nm〜90nmの第2無機充填剤の表面にシラン化合物が結合した、請求項1から5のいずれか一項に記載の半導体パッケージ用樹脂組成物。
- 前記シラン化合物は、アミノシランカップリング剤、エポキシシランカップリング剤、ビニルシランカップリング剤、陽イオンシランカップリング剤およびフェニルシランカップリング剤からなる群より選ばれた1種以上のシランカップリング剤を含む、請求項6に記載の半導体パッケージ用樹脂組成物。
- 前記無機充填剤は、前記半導体パッケージ用樹脂組成物に分散された、請求項1から7のいずれか一項に記載の半導体パッケージ用樹脂組成物。
- 前記半導体パッケージ用樹脂組成物は、140℃以上で最小粘度を有し、前記最小粘度が100Pa・s〜500Pa・sである、請求項1から8のいずれか一項に記載の半導体パッケージ用樹脂組成物。
- 前記半導体パッケージ用樹脂組成物は、IPC−TM−650(2.4.18.3)に準拠して測定した引張伸び率が2.0%以上である、請求項1から9のいずれか一項に記載の半導体パッケージ用樹脂組成物。
- 請求項1から10のいずれか一項による半導体パッケージ用樹脂組成物を繊維基材に含浸させて得られたプリプレグ。
- 請求項11によるプリプレグ;および加熱および加圧によって前記プリプレグと一体化した金属箔;を含む金属箔積層板。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20170036105 | 2017-03-22 | ||
KR10-2017-0036105 | 2017-03-22 | ||
KR10-2018-0018019 | 2018-02-13 | ||
KR1020180018019A KR102057255B1 (ko) | 2017-03-22 | 2018-02-13 | 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
PCT/KR2018/002780 WO2018174447A1 (ko) | 2017-03-22 | 2018-03-08 | 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019527759A JP2019527759A (ja) | 2019-10-03 |
JP6852249B2 true JP6852249B2 (ja) | 2021-03-31 |
Family
ID=63863949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019506370A Active JP6852249B2 (ja) | 2017-03-22 | 2018-03-08 | 半導体パッケージ用樹脂組成物とこれを用いたプリプレグおよび金属箔積層板 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11091630B2 (ja) |
EP (1) | EP3480245B1 (ja) |
JP (1) | JP6852249B2 (ja) |
KR (1) | KR102057255B1 (ja) |
CN (1) | CN109661421B (ja) |
TW (1) | TWI742255B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102049024B1 (ko) * | 2017-03-22 | 2019-11-26 | 주식회사 엘지화학 | 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
WO2020078938A1 (en) | 2018-10-18 | 2020-04-23 | Merck Patent Gmbh | Dielectric copolymer materials |
JP7468358B2 (ja) * | 2018-11-29 | 2024-04-16 | 株式会社レゾナック | 接合体及び半導体装置の製造方法、並びに接合用銅ペースト |
CN114555703A (zh) * | 2019-10-25 | 2022-05-27 | 松下知识产权经营株式会社 | 树脂组合物、树脂膜、具有树脂的金属箔、预浸料、覆金属层压体和印刷线路板 |
CN114634685A (zh) * | 2022-03-25 | 2022-06-17 | 中复神鹰碳纤维股份有限公司 | 微纳米粒子增韧的预浸料用环氧树脂及其制备方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4206631B2 (ja) * | 2000-10-12 | 2009-01-14 | 住友ベークライト株式会社 | 熱硬化性液状封止樹脂組成物、半導体素子の組立方法及び半導体装置 |
JP5381869B2 (ja) * | 2010-03-31 | 2014-01-08 | 住友ベークライト株式会社 | エポキシ樹脂前駆体組成物、プリプレグ、積層板、樹脂シート、プリント配線板および半導体装置 |
JP5547032B2 (ja) | 2010-10-21 | 2014-07-09 | パナソニック株式会社 | 熱伝導性樹脂組成物、樹脂シート、プリプレグ、金属積層板およびプリント配線板 |
JP2012089750A (ja) | 2010-10-21 | 2012-05-10 | Hitachi Chem Co Ltd | 半導体封止充てん用熱硬化性樹脂組成物及び半導体装置 |
KR20120079402A (ko) | 2011-01-04 | 2012-07-12 | 주식회사 두산 | 프리프레그 및 이를 포함하는 프린트 배선판 |
KR101236642B1 (ko) | 2011-01-06 | 2013-02-22 | 주식회사 두산 | 수지 조성물, 이를 이용한 프리프레그 및 프린트 배선판 |
KR20180135079A (ko) | 2011-01-18 | 2018-12-19 | 히타치가세이가부시끼가이샤 | 변성 실리콘 화합물, 이것을 이용한 열 경화성 수지 조성물, 프리프레그, 적층판 및 인쇄 배선판 |
WO2013065758A1 (ja) | 2011-11-02 | 2013-05-10 | 日立化成株式会社 | 樹脂組成物、並びにそれを用いた樹脂シート、プリプレグ、積層板、金属基板、プリント配線板及びパワー半導体装置 |
CN103906785A (zh) * | 2011-11-02 | 2014-07-02 | 日立化成株式会社 | 环氧树脂组合物、半固化环氧树脂组合物、固化环氧树脂组合物、树脂片、预浸料坯、层叠板、金属基板、配线板、半固化环氧树脂组合物的制造方法以及固化环氧树脂组合物的制造方法 |
CN103917596A (zh) * | 2011-11-07 | 2014-07-09 | 三菱瓦斯化学株式会社 | 树脂组合物、使用了其的预浸料和层压板 |
JP5344022B2 (ja) | 2011-11-16 | 2013-11-20 | 住友ベークライト株式会社 | エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置 |
KR102012311B1 (ko) | 2012-12-12 | 2019-08-20 | 엘지이노텍 주식회사 | 수지 조성물 및 이를 이용한 인쇄 회로 기판 |
JP6301473B2 (ja) | 2013-09-30 | 2018-03-28 | エルジー・ケム・リミテッド | 半導体パッケージ用の熱硬化性樹脂組成物とこれを用いたプリプレグおよび金属箔積層板 |
JP6221620B2 (ja) | 2013-10-22 | 2017-11-01 | 住友ベークライト株式会社 | 金属張積層板、プリント配線基板、および半導体装置 |
JP6167850B2 (ja) | 2013-10-29 | 2017-07-26 | 日立化成株式会社 | 熱硬化性樹脂組成物、これを用いたプリプレグ、樹脂付フィルム、積層板、プリント配線板及び半導体パッケージ |
JP6196138B2 (ja) | 2013-11-29 | 2017-09-13 | ナミックス株式会社 | 半導体封止剤および半導体装置 |
JP6415104B2 (ja) * | 2014-05-16 | 2018-10-31 | ナミックス株式会社 | 液状封止材、それを用いた電子部品 |
JP2016034996A (ja) | 2014-08-01 | 2016-03-17 | 日本化薬株式会社 | エポキシ樹脂組成物、プリプレグ及び金属張積層板、プリント配線基板 |
JP6425062B2 (ja) | 2014-08-07 | 2018-11-21 | パナソニックIpマネジメント株式会社 | 絶縁樹脂シート、並びにそれを用いた回路基板および半導体パッケージ |
KR101854501B1 (ko) | 2015-04-29 | 2018-05-04 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자 |
JP6267261B2 (ja) | 2016-03-30 | 2018-01-24 | 旭化成株式会社 | 熱硬化性樹脂組成物 |
-
2018
- 2018-02-13 KR KR1020180018019A patent/KR102057255B1/ko active IP Right Grant
- 2018-03-08 CN CN201880003409.5A patent/CN109661421B/zh active Active
- 2018-03-08 US US16/333,082 patent/US11091630B2/en active Active
- 2018-03-08 JP JP2019506370A patent/JP6852249B2/ja active Active
- 2018-03-08 EP EP18772360.6A patent/EP3480245B1/en active Active
- 2018-03-13 TW TW107108417A patent/TWI742255B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR20180107710A (ko) | 2018-10-02 |
TW201840628A (zh) | 2018-11-16 |
KR102057255B1 (ko) | 2019-12-18 |
JP2019527759A (ja) | 2019-10-03 |
TWI742255B (zh) | 2021-10-11 |
EP3480245A4 (en) | 2019-10-02 |
EP3480245A1 (en) | 2019-05-08 |
CN109661421A (zh) | 2019-04-19 |
CN109661421B (zh) | 2021-02-09 |
US11091630B2 (en) | 2021-08-17 |
US20190270881A1 (en) | 2019-09-05 |
EP3480245B1 (en) | 2020-11-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6852249B2 (ja) | 半導体パッケージ用樹脂組成物とこれを用いたプリプレグおよび金属箔積層板 | |
JP7074278B2 (ja) | 半導体パッケージ用熱硬化性樹脂組成物、プリプレグおよび金属箔積層板 | |
JP6756083B2 (ja) | 半導体パッケージ用樹脂組成物とこれを用いたプリプレグおよび金属箔積層板 | |
KR20210097269A (ko) | 반도체 패키지용 열경화성 수지 조성물, 프리프레그 및 금속박 적층판 | |
JP7052185B2 (ja) | 金属箔膜コーティング用熱硬化性樹脂組成物、それを用いた樹脂コーティング金属箔膜および金属箔積層板 | |
WO2018174447A1 (ko) | 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 | |
KR102246974B1 (ko) | 반도체 패키지용 열경화성 수지 조성물, 프리프레그 및 금속박 적층판 | |
KR102245724B1 (ko) | 금속박 적층판용 열경화성 수지 복합체 및 금속박 적층판 | |
WO2018174446A1 (ko) | 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190208 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200115 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200121 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200421 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20201006 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210104 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210209 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210218 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6852249 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |