JP2021095580A5 - - Google Patents
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- Publication number
- JP2021095580A5 JP2021095580A5 JP2021053829A JP2021053829A JP2021095580A5 JP 2021095580 A5 JP2021095580 A5 JP 2021095580A5 JP 2021053829 A JP2021053829 A JP 2021053829A JP 2021053829 A JP2021053829 A JP 2021053829A JP 2021095580 A5 JP2021095580 A5 JP 2021095580A5
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- insulating resin
- material according
- cured product
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920005989 resin Polymers 0.000 claims 50
- 239000011347 resin Substances 0.000 claims 50
- 239000000463 material Substances 0.000 claims 45
- 239000011256 inorganic filler Substances 0.000 claims 9
- 229910003475 inorganic filler Inorganic materials 0.000 claims 9
- 239000002952 polymeric resin Substances 0.000 claims 7
- 229920003002 synthetic resin Polymers 0.000 claims 7
- 229920001187 thermosetting polymer Polymers 0.000 claims 7
- 230000009477 glass transition Effects 0.000 claims 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene group Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims 3
- 125000005587 carbonate group Chemical group 0.000 claims 3
- -1 siloxane skeleton Chemical group 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 239000002313 adhesive film Substances 0.000 claims 1
- 125000003368 amide group Chemical group 0.000 claims 1
- 125000005462 imide group Chemical group 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021053829A JP7188486B2 (ja) | 2019-06-10 | 2021-03-26 | 絶縁樹脂材料 |
| JP2022192285A JP7505538B2 (ja) | 2019-06-10 | 2022-11-30 | 絶縁樹脂材料 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019108167A JP6860038B2 (ja) | 2019-06-10 | 2019-06-10 | 絶縁樹脂材料 |
| JP2021053829A JP7188486B2 (ja) | 2019-06-10 | 2021-03-26 | 絶縁樹脂材料 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019108167A Division JP6860038B2 (ja) | 2019-06-10 | 2019-06-10 | 絶縁樹脂材料 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022192285A Division JP7505538B2 (ja) | 2019-06-10 | 2022-11-30 | 絶縁樹脂材料 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021095580A JP2021095580A (ja) | 2021-06-24 |
| JP2021095580A5 true JP2021095580A5 (https=) | 2021-08-12 |
| JP7188486B2 JP7188486B2 (ja) | 2022-12-13 |
Family
ID=67948366
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019108167A Active JP6860038B2 (ja) | 2019-06-10 | 2019-06-10 | 絶縁樹脂材料 |
| JP2021053829A Active JP7188486B2 (ja) | 2019-06-10 | 2021-03-26 | 絶縁樹脂材料 |
| JP2022192285A Active JP7505538B2 (ja) | 2019-06-10 | 2022-11-30 | 絶縁樹脂材料 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019108167A Active JP6860038B2 (ja) | 2019-06-10 | 2019-06-10 | 絶縁樹脂材料 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022192285A Active JP7505538B2 (ja) | 2019-06-10 | 2022-11-30 | 絶縁樹脂材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (3) | JP6860038B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20260109849A1 (en) | 2023-07-03 | 2026-04-23 | Asahi Kasei Kabushiki Kaisha | Epoxy resin composition, resin paste, film-type adhesive, printed wiring board, semiconductor chip package, and electronic device |
| KR20260019632A (ko) | 2023-11-06 | 2026-02-10 | 아사히 가세이 가부시키가이샤 | 조성물, 에폭시 수지 조성물, 필름, 프린트 배선판, 반도체칩 패키지 및 전자 장치 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0657740B2 (ja) * | 1988-09-27 | 1994-08-03 | 三菱電機株式会社 | 半導体封止用エポキシ樹脂組成物 |
| JP3091783B2 (ja) * | 1991-11-21 | 2000-09-25 | 日東電工株式会社 | 光重合性接着剤組成物とこれを用いた感圧性接着剤およびその接着シ―ト |
| JP2004123874A (ja) * | 2002-10-01 | 2004-04-22 | Nippon Steel Chem Co Ltd | フィルム形成用樹脂組成物及びフィルム状接着剤 |
| JP2004161828A (ja) * | 2002-11-11 | 2004-06-10 | Nippon Steel Chem Co Ltd | フィルム形成用樹脂組成物及びフィルム状接着剤 |
| JP4929623B2 (ja) * | 2004-06-21 | 2012-05-09 | 味の素株式会社 | 変性ポリイミド樹脂を含有する熱硬化性樹脂組成物 |
| JP4961761B2 (ja) * | 2005-02-09 | 2012-06-27 | 東レ株式会社 | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置 |
| JP4983228B2 (ja) * | 2005-11-29 | 2012-07-25 | 味の素株式会社 | 多層プリント配線板の絶縁層用樹脂組成物 |
| CN101679612B (zh) * | 2007-06-14 | 2013-07-17 | 味之素株式会社 | 多层印刷电路板的层间绝缘用树脂组合物 |
| JP2010248380A (ja) * | 2009-04-16 | 2010-11-04 | Shin-Etsu Chemical Co Ltd | 接着剤組成物、並びにそれを用いた接着シート及びカバーレイフィルム |
| JP2012131947A (ja) * | 2010-12-24 | 2012-07-12 | Sumitomo Bakelite Co Ltd | プリント配線板用エポキシ樹脂組成物、プリプレグ、金属張積層板、樹脂シート、プリント配線板及び半導体装置 |
| JP6123243B2 (ja) * | 2012-11-12 | 2017-05-10 | 味の素株式会社 | 絶縁樹脂材料 |
| JP6319495B2 (ja) * | 2017-04-05 | 2018-05-09 | 味の素株式会社 | 絶縁樹脂材料 |
| JP6695922B2 (ja) * | 2018-04-05 | 2020-05-20 | 味の素株式会社 | 絶縁樹脂材料 |
-
2019
- 2019-06-10 JP JP2019108167A patent/JP6860038B2/ja active Active
-
2021
- 2021-03-26 JP JP2021053829A patent/JP7188486B2/ja active Active
-
2022
- 2022-11-30 JP JP2022192285A patent/JP7505538B2/ja active Active
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