JP6860038B2 - 絶縁樹脂材料 - Google Patents

絶縁樹脂材料 Download PDF

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Publication number
JP6860038B2
JP6860038B2 JP2019108167A JP2019108167A JP6860038B2 JP 6860038 B2 JP6860038 B2 JP 6860038B2 JP 2019108167 A JP2019108167 A JP 2019108167A JP 2019108167 A JP2019108167 A JP 2019108167A JP 6860038 B2 JP6860038 B2 JP 6860038B2
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JP
Japan
Prior art keywords
resin material
insulating resin
mass
skeleton
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019108167A
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English (en)
Japanese (ja)
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JP2019151857A5 (https=
JP2019151857A (ja
Inventor
啓之 阪内
啓之 阪内
宏 織壁
宏 織壁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2019108167A priority Critical patent/JP6860038B2/ja
Publication of JP2019151857A publication Critical patent/JP2019151857A/ja
Publication of JP2019151857A5 publication Critical patent/JP2019151857A5/ja
Priority to JP2021053829A priority patent/JP7188486B2/ja
Application granted granted Critical
Publication of JP6860038B2 publication Critical patent/JP6860038B2/ja
Priority to JP2022192285A priority patent/JP7505538B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Compositions Of Macromolecular Compounds (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Organic Insulating Materials (AREA)
JP2019108167A 2019-06-10 2019-06-10 絶縁樹脂材料 Active JP6860038B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019108167A JP6860038B2 (ja) 2019-06-10 2019-06-10 絶縁樹脂材料
JP2021053829A JP7188486B2 (ja) 2019-06-10 2021-03-26 絶縁樹脂材料
JP2022192285A JP7505538B2 (ja) 2019-06-10 2022-11-30 絶縁樹脂材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019108167A JP6860038B2 (ja) 2019-06-10 2019-06-10 絶縁樹脂材料

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2018072995A Division JP6695922B2 (ja) 2018-04-05 2018-04-05 絶縁樹脂材料

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021053829A Division JP7188486B2 (ja) 2019-06-10 2021-03-26 絶縁樹脂材料

Publications (3)

Publication Number Publication Date
JP2019151857A JP2019151857A (ja) 2019-09-12
JP2019151857A5 JP2019151857A5 (https=) 2020-03-26
JP6860038B2 true JP6860038B2 (ja) 2021-04-14

Family

ID=67948366

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2019108167A Active JP6860038B2 (ja) 2019-06-10 2019-06-10 絶縁樹脂材料
JP2021053829A Active JP7188486B2 (ja) 2019-06-10 2021-03-26 絶縁樹脂材料
JP2022192285A Active JP7505538B2 (ja) 2019-06-10 2022-11-30 絶縁樹脂材料

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2021053829A Active JP7188486B2 (ja) 2019-06-10 2021-03-26 絶縁樹脂材料
JP2022192285A Active JP7505538B2 (ja) 2019-06-10 2022-11-30 絶縁樹脂材料

Country Status (1)

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JP (3) JP6860038B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20260109849A1 (en) 2023-07-03 2026-04-23 Asahi Kasei Kabushiki Kaisha Epoxy resin composition, resin paste, film-type adhesive, printed wiring board, semiconductor chip package, and electronic device
KR20260019632A (ko) 2023-11-06 2026-02-10 아사히 가세이 가부시키가이샤 조성물, 에폭시 수지 조성물, 필름, 프린트 배선판, 반도체칩 패키지 및 전자 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0657740B2 (ja) * 1988-09-27 1994-08-03 三菱電機株式会社 半導体封止用エポキシ樹脂組成物
JP3091783B2 (ja) * 1991-11-21 2000-09-25 日東電工株式会社 光重合性接着剤組成物とこれを用いた感圧性接着剤およびその接着シ―ト
JP2004123874A (ja) * 2002-10-01 2004-04-22 Nippon Steel Chem Co Ltd フィルム形成用樹脂組成物及びフィルム状接着剤
JP2004161828A (ja) * 2002-11-11 2004-06-10 Nippon Steel Chem Co Ltd フィルム形成用樹脂組成物及びフィルム状接着剤
JP4929623B2 (ja) * 2004-06-21 2012-05-09 味の素株式会社 変性ポリイミド樹脂を含有する熱硬化性樹脂組成物
JP4961761B2 (ja) * 2005-02-09 2012-06-27 東レ株式会社 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置
JP4983228B2 (ja) * 2005-11-29 2012-07-25 味の素株式会社 多層プリント配線板の絶縁層用樹脂組成物
CN101679612B (zh) * 2007-06-14 2013-07-17 味之素株式会社 多层印刷电路板的层间绝缘用树脂组合物
JP2010248380A (ja) * 2009-04-16 2010-11-04 Shin-Etsu Chemical Co Ltd 接着剤組成物、並びにそれを用いた接着シート及びカバーレイフィルム
JP2012131947A (ja) * 2010-12-24 2012-07-12 Sumitomo Bakelite Co Ltd プリント配線板用エポキシ樹脂組成物、プリプレグ、金属張積層板、樹脂シート、プリント配線板及び半導体装置
JP6123243B2 (ja) * 2012-11-12 2017-05-10 味の素株式会社 絶縁樹脂材料
JP6319495B2 (ja) * 2017-04-05 2018-05-09 味の素株式会社 絶縁樹脂材料
JP6695922B2 (ja) * 2018-04-05 2020-05-20 味の素株式会社 絶縁樹脂材料

Also Published As

Publication number Publication date
JP2019151857A (ja) 2019-09-12
JP7505538B2 (ja) 2024-06-25
JP2023036603A (ja) 2023-03-14
JP2021095580A (ja) 2021-06-24
JP7188486B2 (ja) 2022-12-13

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