JPWO2024075816A5 - - Google Patents

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Publication number
JPWO2024075816A5
JPWO2024075816A5 JP2024555858A JP2024555858A JPWO2024075816A5 JP WO2024075816 A5 JPWO2024075816 A5 JP WO2024075816A5 JP 2024555858 A JP2024555858 A JP 2024555858A JP 2024555858 A JP2024555858 A JP 2024555858A JP WO2024075816 A5 JPWO2024075816 A5 JP WO2024075816A5
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JP
Japan
Prior art keywords
wiring board
opening
board according
plan
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024555858A
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English (en)
Japanese (ja)
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JPWO2024075816A1 (https=
JP7817435B2 (ja
Publication date
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Priority claimed from PCT/JP2023/036390 external-priority patent/WO2024075816A1/ja
Publication of JPWO2024075816A1 publication Critical patent/JPWO2024075816A1/ja
Publication of JPWO2024075816A5 publication Critical patent/JPWO2024075816A5/ja
Application granted granted Critical
Publication of JP7817435B2 publication Critical patent/JP7817435B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024555858A 2022-10-07 2023-10-05 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール Active JP7817435B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022162527 2022-10-07
JP2022162527 2022-10-07
PCT/JP2023/036390 WO2024075816A1 (ja) 2022-10-07 2023-10-05 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2024075816A1 JPWO2024075816A1 (https=) 2024-04-11
JPWO2024075816A5 true JPWO2024075816A5 (https=) 2025-06-17
JP7817435B2 JP7817435B2 (ja) 2026-02-18

Family

ID=90608429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024555858A Active JP7817435B2 (ja) 2022-10-07 2023-10-05 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Country Status (3)

Country Link
EP (1) EP4600998A1 (https=)
JP (1) JP7817435B2 (https=)
WO (1) WO2024075816A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5769474B2 (ja) * 2011-04-06 2015-08-26 京セラ株式会社 端子構造体、電子部品収納用パッケージおよび電子装置
JP2013197435A (ja) 2012-03-22 2013-09-30 Kyocera Corp 配線基板
WO2014192687A1 (ja) * 2013-05-29 2014-12-04 京セラ株式会社 素子収納用パッケージおよび実装構造体
EP3113218B1 (en) 2014-02-26 2020-03-04 Kyocera Corporation Package for an electronic-component and electronic device including the package
JP2017045959A (ja) * 2015-08-28 2017-03-02 株式会社東芝 高周波半導体装置用パッケージおよび高周波半導体装置
JP2018037564A (ja) 2016-09-01 2018-03-08 株式会社東芝 高周波半導体用パッケージおよび高周波半導体装置
JP7085908B2 (ja) 2018-06-13 2022-06-17 住友電工デバイス・イノベーション株式会社 半導体装置

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