JPWO2023223846A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023223846A5
JPWO2023223846A5 JP2024521666A JP2024521666A JPWO2023223846A5 JP WO2023223846 A5 JPWO2023223846 A5 JP WO2023223846A5 JP 2024521666 A JP2024521666 A JP 2024521666A JP 2024521666 A JP2024521666 A JP 2024521666A JP WO2023223846 A5 JPWO2023223846 A5 JP WO2023223846A5
Authority
JP
Japan
Prior art keywords
pair
conductor
openings
signal lines
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024521666A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023223846A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/017168 external-priority patent/WO2023223846A1/ja
Publication of JPWO2023223846A1 publication Critical patent/JPWO2023223846A1/ja
Publication of JPWO2023223846A5 publication Critical patent/JPWO2023223846A5/ja
Pending legal-status Critical Current

Links

JP2024521666A 2022-05-19 2023-05-02 Pending JPWO2023223846A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022082404 2022-05-19
PCT/JP2023/017168 WO2023223846A1 (ja) 2022-05-19 2023-05-02 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Publications (2)

Publication Number Publication Date
JPWO2023223846A1 JPWO2023223846A1 (https=) 2023-11-23
JPWO2023223846A5 true JPWO2023223846A5 (https=) 2025-01-24

Family

ID=88835141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024521666A Pending JPWO2023223846A1 (https=) 2022-05-19 2023-05-02

Country Status (5)

Country Link
US (1) US20250351264A1 (https=)
EP (1) EP4529363A1 (https=)
JP (1) JPWO2023223846A1 (https=)
CN (1) CN119174286A (https=)
WO (1) WO2023223846A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048792A1 (ja) * 2024-08-29 2026-03-05 京セラ株式会社 配線基板、電子部品収納用パッケージ及び電子モジュール

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6624729B2 (en) * 2000-12-29 2003-09-23 Hewlett-Packard Development Company, L.P. Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board
JP4652230B2 (ja) 2003-06-02 2011-03-16 日本電気株式会社 プリント回路基板用コンパクトビア伝送路およびその設計方法
EP3300104B1 (en) * 2015-05-20 2026-01-21 Kyocera Corporation Semiconductor element package, semiconductor device, and mounting structure
JP6825986B2 (ja) * 2017-05-26 2021-02-03 京セラ株式会社 配線基板、電子部品収納用パッケージおよび電子装置
US11864308B2 (en) * 2020-01-16 2024-01-02 Fujikura Ltd. Substrate and antenna module

Similar Documents

Publication Publication Date Title
US7478474B2 (en) Method of manufacturing shielded electronic circuit units
CN206461149U (zh) 电连接器
CN103813627B (zh) 多层电路基板
CN100512594C (zh) 用于印刷电路板的优选接地和导孔出口结构
JP4125570B2 (ja) 電子装置
US20060091545A1 (en) Printed circuit board for high-speed electrical connectors
TWI578857B (zh) Flexible circuit board differential mode signal transmission line anti - attenuation grounding structure
JPWO2023223846A5 (https=)
JP2021184482A5 (https=)
JP4527646B2 (ja) 電子装置
JPWO2015064637A1 (ja) 回路基板、電子部品収納用パッケージおよび電子装置
US6344609B1 (en) Electronic unit effectively utilizing circuit board surface
CN112770493B (zh) 柔性线路板及电子设备
WO2021131776A1 (ja) モジュール
CN104244569B (zh) 软性电路板高频信号传输线的抗衰减控制结构
JP4817924B2 (ja) 半導体パッケージ
WO2022009777A1 (ja) モジュール
JP2005347489A (ja) 半導体装置
CN219626637U (zh) 电路模块
WO2022085686A1 (ja) 回路モジュール
JPWO2024029628A5 (https=)
JPWO2023120586A5 (https=)
JPWO2022230848A5 (https=)
WO2022230848A1 (ja) 電子部品実装用パッケージ及び電子装置
JPWO2021002077A5 (https=)