JP7817435B2 - 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール - Google Patents

配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Info

Publication number
JP7817435B2
JP7817435B2 JP2024555858A JP2024555858A JP7817435B2 JP 7817435 B2 JP7817435 B2 JP 7817435B2 JP 2024555858 A JP2024555858 A JP 2024555858A JP 2024555858 A JP2024555858 A JP 2024555858A JP 7817435 B2 JP7817435 B2 JP 7817435B2
Authority
JP
Japan
Prior art keywords
view
recess
opening
plan
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024555858A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024075816A1 (https=
JPWO2024075816A5 (https=
Inventor
芳規 川頭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2024075816A1 publication Critical patent/JPWO2024075816A1/ja
Publication of JPWO2024075816A5 publication Critical patent/JPWO2024075816A5/ja
Application granted granted Critical
Publication of JP7817435B2 publication Critical patent/JP7817435B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
JP2024555858A 2022-10-07 2023-10-05 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール Active JP7817435B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022162527 2022-10-07
JP2022162527 2022-10-07
PCT/JP2023/036390 WO2024075816A1 (ja) 2022-10-07 2023-10-05 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2024075816A1 JPWO2024075816A1 (https=) 2024-04-11
JPWO2024075816A5 JPWO2024075816A5 (https=) 2025-06-17
JP7817435B2 true JP7817435B2 (ja) 2026-02-18

Family

ID=90608429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024555858A Active JP7817435B2 (ja) 2022-10-07 2023-10-05 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Country Status (3)

Country Link
EP (1) EP4600998A1 (https=)
JP (1) JP7817435B2 (https=)
WO (1) WO2024075816A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012222079A (ja) 2011-04-06 2012-11-12 Kyocera Corp 端子構造体、電子部品収納用パッケージおよび電子装置
JP2013197435A (ja) 2012-03-22 2013-09-30 Kyocera Corp 配線基板
WO2014192687A1 (ja) 2013-05-29 2014-12-04 京セラ株式会社 素子収納用パッケージおよび実装構造体
WO2015129731A1 (ja) 2014-02-26 2015-09-03 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP2019216200A (ja) 2018-06-13 2019-12-19 住友電工デバイス・イノベーション株式会社 半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017045959A (ja) * 2015-08-28 2017-03-02 株式会社東芝 高周波半導体装置用パッケージおよび高周波半導体装置
JP2018037564A (ja) 2016-09-01 2018-03-08 株式会社東芝 高周波半導体用パッケージおよび高周波半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012222079A (ja) 2011-04-06 2012-11-12 Kyocera Corp 端子構造体、電子部品収納用パッケージおよび電子装置
JP2013197435A (ja) 2012-03-22 2013-09-30 Kyocera Corp 配線基板
WO2014192687A1 (ja) 2013-05-29 2014-12-04 京セラ株式会社 素子収納用パッケージおよび実装構造体
WO2015129731A1 (ja) 2014-02-26 2015-09-03 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP2019216200A (ja) 2018-06-13 2019-12-19 住友電工デバイス・イノベーション株式会社 半導体装置

Also Published As

Publication number Publication date
JPWO2024075816A1 (https=) 2024-04-11
WO2024075816A1 (ja) 2024-04-11
EP4600998A1 (en) 2025-08-13

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