JPWO2024075816A1 - - Google Patents

Info

Publication number
JPWO2024075816A1
JPWO2024075816A1 JP2024555858A JP2024555858A JPWO2024075816A1 JP WO2024075816 A1 JPWO2024075816 A1 JP WO2024075816A1 JP 2024555858 A JP2024555858 A JP 2024555858A JP 2024555858 A JP2024555858 A JP 2024555858A JP WO2024075816 A1 JPWO2024075816 A1 JP WO2024075816A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024555858A
Other languages
Japanese (ja)
Other versions
JP7817435B2 (ja
JPWO2024075816A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024075816A1 publication Critical patent/JPWO2024075816A1/ja
Publication of JPWO2024075816A5 publication Critical patent/JPWO2024075816A5/ja
Application granted granted Critical
Publication of JP7817435B2 publication Critical patent/JP7817435B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
JP2024555858A 2022-10-07 2023-10-05 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール Active JP7817435B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022162527 2022-10-07
JP2022162527 2022-10-07
PCT/JP2023/036390 WO2024075816A1 (ja) 2022-10-07 2023-10-05 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2024075816A1 true JPWO2024075816A1 (https=) 2024-04-11
JPWO2024075816A5 JPWO2024075816A5 (https=) 2025-06-17
JP7817435B2 JP7817435B2 (ja) 2026-02-18

Family

ID=90608429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024555858A Active JP7817435B2 (ja) 2022-10-07 2023-10-05 配線基板、配線基板を用いた電子部品実装用パッケージ、および電子モジュール

Country Status (3)

Country Link
EP (1) EP4600998A1 (https=)
JP (1) JP7817435B2 (https=)
WO (1) WO2024075816A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012222079A (ja) * 2011-04-06 2012-11-12 Kyocera Corp 端子構造体、電子部品収納用パッケージおよび電子装置
JP2013197435A (ja) * 2012-03-22 2013-09-30 Kyocera Corp 配線基板
WO2014192687A1 (ja) * 2013-05-29 2014-12-04 京セラ株式会社 素子収納用パッケージおよび実装構造体
WO2015129731A1 (ja) * 2014-02-26 2015-09-03 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP2017045959A (ja) * 2015-08-28 2017-03-02 株式会社東芝 高周波半導体装置用パッケージおよび高周波半導体装置
JP2019216200A (ja) * 2018-06-13 2019-12-19 住友電工デバイス・イノベーション株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018037564A (ja) 2016-09-01 2018-03-08 株式会社東芝 高周波半導体用パッケージおよび高周波半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012222079A (ja) * 2011-04-06 2012-11-12 Kyocera Corp 端子構造体、電子部品収納用パッケージおよび電子装置
JP2013197435A (ja) * 2012-03-22 2013-09-30 Kyocera Corp 配線基板
WO2014192687A1 (ja) * 2013-05-29 2014-12-04 京セラ株式会社 素子収納用パッケージおよび実装構造体
WO2015129731A1 (ja) * 2014-02-26 2015-09-03 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP2017045959A (ja) * 2015-08-28 2017-03-02 株式会社東芝 高周波半導体装置用パッケージおよび高周波半導体装置
JP2019216200A (ja) * 2018-06-13 2019-12-19 住友電工デバイス・イノベーション株式会社 半導体装置

Also Published As

Publication number Publication date
WO2024075816A1 (ja) 2024-04-11
EP4600998A1 (en) 2025-08-13
JP7817435B2 (ja) 2026-02-18

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