JPWO2024014433A5 - - Google Patents
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- Publication number
- JPWO2024014433A5 JPWO2024014433A5 JP2024533706A JP2024533706A JPWO2024014433A5 JP WO2024014433 A5 JPWO2024014433 A5 JP WO2024014433A5 JP 2024533706 A JP2024533706 A JP 2024533706A JP 2024533706 A JP2024533706 A JP 2024533706A JP WO2024014433 A5 JPWO2024014433 A5 JP WO2024014433A5
- Authority
- JP
- Japan
- Prior art keywords
- ground conductor
- wiring structure
- opening
- wiring
- structure according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022111268 | 2022-07-11 | ||
| JP2022111268 | 2022-07-11 | ||
| PCT/JP2023/025470 WO2024014433A1 (ja) | 2022-07-11 | 2023-07-10 | 配線構造体および電子モジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024014433A1 JPWO2024014433A1 (https=) | 2024-01-18 |
| JPWO2024014433A5 true JPWO2024014433A5 (https=) | 2025-03-19 |
| JP7784549B2 JP7784549B2 (ja) | 2025-12-11 |
Family
ID=89536709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024533706A Active JP7784549B2 (ja) | 2022-07-11 | 2023-07-10 | 配線構造体および電子モジュール |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7784549B2 (https=) |
| KR (1) | KR20250017744A (https=) |
| CN (1) | CN119547201A (https=) |
| WO (1) | WO2024014433A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0874415B1 (en) * | 1997-04-25 | 2006-08-23 | Kyocera Corporation | High-frequency package |
| JP5725876B2 (ja) * | 2011-01-18 | 2015-05-27 | 京セラ株式会社 | 電子部品収納用パッケージおよび電子装置 |
| JP2016115736A (ja) | 2014-12-12 | 2016-06-23 | 京セラ株式会社 | 半導体素子パッケージおよび半導体装置 |
| JP6813263B2 (ja) * | 2015-09-16 | 2021-01-13 | 京セラ株式会社 | 配線基板、半導体素子パッケージおよび半導体装置 |
| EP3410471B1 (en) * | 2016-01-27 | 2025-04-02 | KYOCERA Corporation | Wiring substrate, optical semiconductor element package, and optical semiconductor device |
-
2023
- 2023-07-10 CN CN202380052369.4A patent/CN119547201A/zh active Pending
- 2023-07-10 KR KR1020257000638A patent/KR20250017744A/ko not_active Ceased
- 2023-07-10 JP JP2024533706A patent/JP7784549B2/ja active Active
- 2023-07-10 WO PCT/JP2023/025470 patent/WO2024014433A1/ja not_active Ceased
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