KR20250017744A - 배선 구조체 및 전자 모듈 - Google Patents

배선 구조체 및 전자 모듈 Download PDF

Info

Publication number
KR20250017744A
KR20250017744A KR1020257000638A KR20257000638A KR20250017744A KR 20250017744 A KR20250017744 A KR 20250017744A KR 1020257000638 A KR1020257000638 A KR 1020257000638A KR 20257000638 A KR20257000638 A KR 20257000638A KR 20250017744 A KR20250017744 A KR 20250017744A
Authority
KR
South Korea
Prior art keywords
conductor
ground conductor
opening
wiring structure
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020257000638A
Other languages
English (en)
Korean (ko)
Inventor
요시키 카와즈
Original Assignee
교세라 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 교세라 가부시키가이샤 filed Critical 교세라 가부시키가이샤
Publication of KR20250017744A publication Critical patent/KR20250017744A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H01L23/043—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H01L23/053—
    • H01L24/27—
    • H01L24/30—
    • H01L24/43—
    • H01L24/46—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base

Landscapes

  • Structure Of Printed Boards (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
KR1020257000638A 2022-07-11 2023-07-10 배선 구조체 및 전자 모듈 Ceased KR20250017744A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-111268 2022-07-11
JP2022111268 2022-07-11
PCT/JP2023/025470 WO2024014433A1 (ja) 2022-07-11 2023-07-10 配線構造体および電子モジュール

Publications (1)

Publication Number Publication Date
KR20250017744A true KR20250017744A (ko) 2025-02-04

Family

ID=89536709

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257000638A Ceased KR20250017744A (ko) 2022-07-11 2023-07-10 배선 구조체 및 전자 모듈

Country Status (4)

Country Link
JP (1) JP7784549B2 (https=)
KR (1) KR20250017744A (https=)
CN (1) CN119547201A (https=)
WO (1) WO2024014433A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016115736A (ja) 2014-12-12 2016-06-23 京セラ株式会社 半導体素子パッケージおよび半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0874415B1 (en) * 1997-04-25 2006-08-23 Kyocera Corporation High-frequency package
JP5725876B2 (ja) * 2011-01-18 2015-05-27 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP6813263B2 (ja) * 2015-09-16 2021-01-13 京セラ株式会社 配線基板、半導体素子パッケージおよび半導体装置
EP3410471B1 (en) * 2016-01-27 2025-04-02 KYOCERA Corporation Wiring substrate, optical semiconductor element package, and optical semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016115736A (ja) 2014-12-12 2016-06-23 京セラ株式会社 半導体素子パッケージおよび半導体装置

Also Published As

Publication number Publication date
JPWO2024014433A1 (https=) 2024-01-18
CN119547201A (zh) 2025-02-28
JP7784549B2 (ja) 2025-12-11
WO2024014433A1 (ja) 2024-01-18

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D21 Rejection of application intended

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PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

B15 Application refused following examination

Free format text: ST27 STATUS EVENT CODE: N-2-6-B10-B15-EXM-PE0601 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601