JPWO2024014433A1 - - Google Patents

Info

Publication number
JPWO2024014433A1
JPWO2024014433A1 JP2024533706A JP2024533706A JPWO2024014433A1 JP WO2024014433 A1 JPWO2024014433 A1 JP WO2024014433A1 JP 2024533706 A JP2024533706 A JP 2024533706A JP 2024533706 A JP2024533706 A JP 2024533706A JP WO2024014433 A1 JPWO2024014433 A1 JP WO2024014433A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024533706A
Other languages
Japanese (ja)
Other versions
JP7784549B2 (ja
JPWO2024014433A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024014433A1 publication Critical patent/JPWO2024014433A1/ja
Publication of JPWO2024014433A5 publication Critical patent/JPWO2024014433A5/ja
Application granted granted Critical
Publication of JP7784549B2 publication Critical patent/JP7784549B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
JP2024533706A 2022-07-11 2023-07-10 配線構造体および電子モジュール Active JP7784549B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022111268 2022-07-11
JP2022111268 2022-07-11
PCT/JP2023/025470 WO2024014433A1 (ja) 2022-07-11 2023-07-10 配線構造体および電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2024014433A1 true JPWO2024014433A1 (https=) 2024-01-18
JPWO2024014433A5 JPWO2024014433A5 (https=) 2025-03-19
JP7784549B2 JP7784549B2 (ja) 2025-12-11

Family

ID=89536709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024533706A Active JP7784549B2 (ja) 2022-07-11 2023-07-10 配線構造体および電子モジュール

Country Status (4)

Country Link
JP (1) JP7784549B2 (https=)
KR (1) KR20250017744A (https=)
CN (1) CN119547201A (https=)
WO (1) WO2024014433A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6239669B1 (en) * 1997-04-25 2001-05-29 Kyocera Corporation High frequency package
JP2012151232A (ja) * 2011-01-18 2012-08-09 Kyocera Corp 電子部品収納用パッケージおよび電子装置
JP2017059680A (ja) * 2015-09-16 2017-03-23 京セラ株式会社 配線基板、半導体素子パッケージおよび半導体装置
WO2017131092A1 (ja) * 2016-01-27 2017-08-03 京セラ株式会社 配線基板、光半導体素子パッケージおよび光半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016115736A (ja) 2014-12-12 2016-06-23 京セラ株式会社 半導体素子パッケージおよび半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6239669B1 (en) * 1997-04-25 2001-05-29 Kyocera Corporation High frequency package
JP2012151232A (ja) * 2011-01-18 2012-08-09 Kyocera Corp 電子部品収納用パッケージおよび電子装置
JP2017059680A (ja) * 2015-09-16 2017-03-23 京セラ株式会社 配線基板、半導体素子パッケージおよび半導体装置
WO2017131092A1 (ja) * 2016-01-27 2017-08-03 京セラ株式会社 配線基板、光半導体素子パッケージおよび光半導体装置

Also Published As

Publication number Publication date
KR20250017744A (ko) 2025-02-04
CN119547201A (zh) 2025-02-28
JP7784549B2 (ja) 2025-12-11
WO2024014433A1 (ja) 2024-01-18

Similar Documents

Publication Publication Date Title
BR102023014872A2 (https=)
BR102023012440A2 (https=)
BR102023010976A2 (https=)
BR102023009641A2 (https=)
BR102023008688A2 (https=)
BR102023007252A2 (https=)
BR102023005164A2 (https=)
BR102023001877A2 (https=)
BR102023000289A2 (https=)
BR102022026909A2 (https=)
BR202022009269U2 (https=)
BR202022005961U2 (https=)
BR202022001779U2 (https=)
BR202022000931U2 (https=)
BY13149U (https=)
BY13157U (https=)
BY13135U (https=)
BY13137U (https=)
BY13140U (https=)
BY13141U (https=)
BY13142U (https=)
BY13143U (https=)
BY13144U (https=)
BY13145U (https=)
CN307047893S (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250110

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250110

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20251104

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20251201

R150 Certificate of patent or registration of utility model

Ref document number: 7784549

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150