CN119547201A - 布线结构体和电子模块 - Google Patents

布线结构体和电子模块 Download PDF

Info

Publication number
CN119547201A
CN119547201A CN202380052369.4A CN202380052369A CN119547201A CN 119547201 A CN119547201 A CN 119547201A CN 202380052369 A CN202380052369 A CN 202380052369A CN 119547201 A CN119547201 A CN 119547201A
Authority
CN
China
Prior art keywords
ground conductor
conductor
substrate
wiring structure
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380052369.4A
Other languages
English (en)
Chinese (zh)
Inventor
川头芳规
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN119547201A publication Critical patent/CN119547201A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base

Landscapes

  • Structure Of Printed Boards (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
CN202380052369.4A 2022-07-11 2023-07-10 布线结构体和电子模块 Pending CN119547201A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022111268 2022-07-11
JP2022-111268 2022-07-11
PCT/JP2023/025470 WO2024014433A1 (ja) 2022-07-11 2023-07-10 配線構造体および電子モジュール

Publications (1)

Publication Number Publication Date
CN119547201A true CN119547201A (zh) 2025-02-28

Family

ID=89536709

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380052369.4A Pending CN119547201A (zh) 2022-07-11 2023-07-10 布线结构体和电子模块

Country Status (4)

Country Link
JP (1) JP7784549B2 (https=)
KR (1) KR20250017744A (https=)
CN (1) CN119547201A (https=)
WO (1) WO2024014433A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0874415B1 (en) * 1997-04-25 2006-08-23 Kyocera Corporation High-frequency package
JP5725876B2 (ja) * 2011-01-18 2015-05-27 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP2016115736A (ja) 2014-12-12 2016-06-23 京セラ株式会社 半導体素子パッケージおよび半導体装置
JP6813263B2 (ja) * 2015-09-16 2021-01-13 京セラ株式会社 配線基板、半導体素子パッケージおよび半導体装置
EP3410471B1 (en) * 2016-01-27 2025-04-02 KYOCERA Corporation Wiring substrate, optical semiconductor element package, and optical semiconductor device

Also Published As

Publication number Publication date
JPWO2024014433A1 (https=) 2024-01-18
KR20250017744A (ko) 2025-02-04
JP7784549B2 (ja) 2025-12-11
WO2024014433A1 (ja) 2024-01-18

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