JP7784549B2 - 配線構造体および電子モジュール - Google Patents

配線構造体および電子モジュール

Info

Publication number
JP7784549B2
JP7784549B2 JP2024533706A JP2024533706A JP7784549B2 JP 7784549 B2 JP7784549 B2 JP 7784549B2 JP 2024533706 A JP2024533706 A JP 2024533706A JP 2024533706 A JP2024533706 A JP 2024533706A JP 7784549 B2 JP7784549 B2 JP 7784549B2
Authority
JP
Japan
Prior art keywords
ground conductor
opening
wiring structure
conductor
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024533706A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024014433A1 (https=
JPWO2024014433A5 (https=
Inventor
芳規 川頭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2024014433A1 publication Critical patent/JPWO2024014433A1/ja
Publication of JPWO2024014433A5 publication Critical patent/JPWO2024014433A5/ja
Application granted granted Critical
Publication of JP7784549B2 publication Critical patent/JP7784549B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base

Landscapes

  • Structure Of Printed Boards (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
JP2024533706A 2022-07-11 2023-07-10 配線構造体および電子モジュール Active JP7784549B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022111268 2022-07-11
JP2022111268 2022-07-11
PCT/JP2023/025470 WO2024014433A1 (ja) 2022-07-11 2023-07-10 配線構造体および電子モジュール

Publications (3)

Publication Number Publication Date
JPWO2024014433A1 JPWO2024014433A1 (https=) 2024-01-18
JPWO2024014433A5 JPWO2024014433A5 (https=) 2025-03-19
JP7784549B2 true JP7784549B2 (ja) 2025-12-11

Family

ID=89536709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024533706A Active JP7784549B2 (ja) 2022-07-11 2023-07-10 配線構造体および電子モジュール

Country Status (4)

Country Link
JP (1) JP7784549B2 (https=)
KR (1) KR20250017744A (https=)
CN (1) CN119547201A (https=)
WO (1) WO2024014433A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6239669B1 (en) 1997-04-25 2001-05-29 Kyocera Corporation High frequency package
JP2012151232A (ja) 2011-01-18 2012-08-09 Kyocera Corp 電子部品収納用パッケージおよび電子装置
WO2017131092A1 (ja) 2016-01-27 2017-08-03 京セラ株式会社 配線基板、光半導体素子パッケージおよび光半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016115736A (ja) 2014-12-12 2016-06-23 京セラ株式会社 半導体素子パッケージおよび半導体装置
JP6813263B2 (ja) * 2015-09-16 2021-01-13 京セラ株式会社 配線基板、半導体素子パッケージおよび半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6239669B1 (en) 1997-04-25 2001-05-29 Kyocera Corporation High frequency package
JP2012151232A (ja) 2011-01-18 2012-08-09 Kyocera Corp 電子部品収納用パッケージおよび電子装置
WO2017131092A1 (ja) 2016-01-27 2017-08-03 京セラ株式会社 配線基板、光半導体素子パッケージおよび光半導体装置

Also Published As

Publication number Publication date
JPWO2024014433A1 (https=) 2024-01-18
KR20250017744A (ko) 2025-02-04
CN119547201A (zh) 2025-02-28
WO2024014433A1 (ja) 2024-01-18

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