KR950002543A - 전자 회로 장치 - Google Patents

전자 회로 장치 Download PDF

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Publication number
KR950002543A
KR950002543A KR1019940014412A KR19940014412A KR950002543A KR 950002543 A KR950002543 A KR 950002543A KR 1019940014412 A KR1019940014412 A KR 1019940014412A KR 19940014412 A KR19940014412 A KR 19940014412A KR 950002543 A KR950002543 A KR 950002543A
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KR
South Korea
Prior art keywords
wiring board
electronic circuit
component
circuit device
leadless
Prior art date
Application number
KR1019940014412A
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English (en)
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KR0157671B1 (ko
Inventor
다쯔로 우찌다
다까시 예비스야
미끼 모리
마사유끼 사이또
다까시 도가사끼
유끼오 기자끼
Original Assignee
사또 후미오
가부시끼가이샤 도시바
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Publication of KR950002543A publication Critical patent/KR950002543A/ko
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Publication of KR0157671B1 publication Critical patent/KR0157671B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8114—Guiding structures outside the body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0465—Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/306—Lifting the component during or after mounting; Increasing the gap between component and PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

실장시의 칩 부품의 부품 단변 방향으로 기울어지는 롤링 현상을 회피하고, 신뢰성이 높고 실장 면적이 작으며 고밀도 실장을 실현한 전자 회로 장치를 제공하는 것을 목적으로 한다.
회로 기판에 칩 부품이 범프 실장되어 있는 전자 부품 회로에서 회로 기판 상의 부품 탑재용 랜드 사이에 스페이서를 설치하는 것을 특징으로 한다.
본 발명의 전자 회로 장치는 고밀도 실장, 고신뢰성을 달성할 수 있다.

Description

전자 회로 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 전자 회로 장치의 단면도, 제2도는 본 발명의 땜납 범프의 형상을 도시하는 단면도, 제3도는 본 발명의 형상 기억 합금 또는 스텝 동작형 바이메탈로 구성된 돌기물이 동작하는 모양을 설명하는 단면도.

Claims (8)

  1. 배선 기판, 상기 배선 기판 상에 탑재되는 칩 부품, 상기 배선 기판과 상기 칩 부품 사이에 간극을 갖도록 형성되어 상기 칩 부품을 상기 배선 기판 상에 전기적으로 접속하는 한 쌍 이상의 범프 및 상기 간극에 형성된 스페이서를 구비하는 것을 특징으로 하는 전자 회로 장치.
  2. 배선 기판 상기 배선 기판 상에 탑재되는 칩 부품, 상기 배선 기판과 상기 칩 부품 사이에 간극을 갖도록 형성되어 상기 칩 부품을 상기 배선 기판 상에 전기적으로 접속하는 한쌍 이상의 범프 및 상기 칩 부품의 측면에 위치하도록 상기 배선 기판 상에 형성되어 상기 범프 높이보다 높은 한 쌍 이상의 기둥을 구비하는 것을 특징으로 하는 전자 회로 방법.
  3. 한 주면에 부품 탑재용 랜드가 설치된 배선 기판, 상기 배선 기판의 주면 상에 탑재되는 리드레스 부품, 상기 리드레스 부품의 적어도 한 주면으로부터 측면에 걸쳐 형성된 복수의 전극 및 상기 배선 기판의 주면과 상기 리드레스 부품의 주면 사이에 간극을 설치하도록 형성되어 상기 리드레스 부품의 주면 상의 전극을 상기 랜드에 전기적으로 접속하는 복수의 범프를 구비하는 전자 회로 장치에 있어서, 상기 범프가 상기 리드레스 부품의 측면 전극에 일체적으로 연재해서 접속되어 있는 것을 특징으로 하는 전자 회로 장치.
  4. 제3항에 있어서, 상기 랜드의 외측 단부가 상기 리드레스 부품 주면 상의 전극의 외측 단부와 거의 동일한 위치에 있는 것을 특징으로 하는 전자 회로 장치.
  5. 제3항에 있어서, 상기 범프의 외측 표면이 상기 랜드에 접속되는 부분과 상기 랜드의 내측 표면이 이루는 접촉 각도가 90。C 이상인 것을 특징으로 하는 전자 회로 장치.
  6. 제3항에 있어서, 상기 범프의 외측 표면이 상기 랜드에 접속되는 부분과 상기 랜드의 내측 표면이 이루는 접촉 각도가 90。C 이하로, 상기 범프의 외측 표면이 상기 접촉 각도보다 큰 방향으로 만곡하고 있는 것을 특징으로 하는 전자 회로 장치.
  7. 제3항에 있어서, 상기 리드레스 부품 위쪽 면에서 투영한 경우 상기 범프의 바깥 가장자리의 일부가 상기 리드레스 부품의 측면보다 외부에 있는 것을 특징으로 하는 전자 회로 장치.
  8. 제3항에 있어서, 상기 리드레스 부품 위쪽 면에서 투영한 경우, 상기 범프의 가장 외측이 되는 부분의 위치가 상기 리드레스 부품의 전극 측면 거의 중앙에 있는 것을 특징으로 하는 전자 회로 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940014412A 1993-06-24 1994-06-23 전자 회로 장치 KR0157671B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15315093 1993-06-24
JP93-153150 1993-06-24

Publications (2)

Publication Number Publication Date
KR950002543A true KR950002543A (ko) 1995-01-04
KR0157671B1 KR0157671B1 (ko) 1998-12-15

Family

ID=15556117

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940014412A KR0157671B1 (ko) 1993-06-24 1994-06-23 전자 회로 장치

Country Status (3)

Country Link
EP (1) EP0631461B1 (ko)
KR (1) KR0157671B1 (ko)
DE (1) DE69410168T2 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5639013A (en) * 1994-12-23 1997-06-17 Ford Motor Company Optimally shaped solder joints for improved reliability and space savings
US6060780A (en) * 1996-02-23 2000-05-09 Denson Corporation Surface mount type unit and transducer assembly using same
JP3423855B2 (ja) * 1996-04-26 2003-07-07 株式会社デンソー 電子部品搭載用構造体および電子部品の実装方法
DE102007053849A1 (de) 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Anordnung umfassend ein optoelektronisches Bauelement
CN104793026B (zh) * 2014-01-20 2018-09-28 旺矽科技股份有限公司 应用于探针测试装置的支撑结构及其制作方法
CN112270804B (zh) * 2020-10-29 2022-07-19 浙江优电云物联网技术有限公司 一种利用双金属片原理的点式火灾预警装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2134026B (en) * 1983-01-27 1985-11-20 Allen Bradley Int A method of joining a component part to an integrated circuit
GB2149581B (en) * 1983-11-11 1987-05-28 Plessey Co Plc Mounted integrated circuit chip carrier
EP0248566A3 (en) * 1986-05-30 1990-01-31 AT&T Corp. Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate
US4760948A (en) * 1986-12-23 1988-08-02 Rca Corporation Leadless chip carrier assembly and method
JPS63169793A (ja) * 1987-01-07 1988-07-13 株式会社村田製作所 プリント基板へのチツプ部品の取付構造
GB8727926D0 (en) * 1987-11-28 1987-12-31 British Aerospace Surface mounting leadless components on conductor pattern supporting substrates
US5001829A (en) * 1990-01-02 1991-03-26 General Electric Company Method for connecting a leadless chip carrier to a substrate
JPH04130794A (ja) * 1990-09-21 1992-05-01 Hitachi Ltd 集積回路基板のプリント基板実装方法

Also Published As

Publication number Publication date
DE69410168T2 (de) 1998-11-05
DE69410168D1 (de) 1998-06-18
EP0631461A1 (en) 1994-12-28
EP0631461B1 (en) 1998-05-13
KR0157671B1 (ko) 1998-12-15

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