KR970009495A - 면실장형(面實裝型)전자부품 및 그 제조방법 - Google Patents

면실장형(面實裝型)전자부품 및 그 제조방법 Download PDF

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KR970009495A
KR970009495A KR1019960030634A KR19960030634A KR970009495A KR 970009495 A KR970009495 A KR 970009495A KR 1019960030634 A KR1019960030634 A KR 1019960030634A KR 19960030634 A KR19960030634 A KR 19960030634A KR 970009495 A KR970009495 A KR 970009495A
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lead
outer lead
leads
horizontal portion
cage
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KR100438248B1 (ko
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가스타카 시바타
야스노부 쇼시
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사토 켄이치로
로무 가부시키가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
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    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

1. 청구범위에 기재된 발명이 속하는 기술 분야
수지팩케이지에서 뻗어나오는 외부리이드에 기판에 면적으로 접촉할 수 있는 수평부가 형성된 면실장형전자부품 및 그 제조방법에 관한 것이다.
2. 발명이 해결하려고 하는 기술적 과제
납땜붙이기(납땜도금)가 되어 있지 않은 외부리이드(5)끝면(7)의 납땜에 대한 번지는 성질을 향상시켜, 리프로우납땜에 의한 기판실장강도를 더욱 향상시킬 수 있는 면실장형전자부품을 제공한다.
3. 발명의 해결방법의 요지
소자(2)와, 이 소자(2)에 전기적으로 도통하는 복수개의 내부리이드(3)등이 내장되어 있는 수지팩케이지(4)와, 이 수지팩케이지의 측면에서 상기 각 내부리이드(3)와 연속되어 뻗어나오게 한 복수개의 외부리이드(5)를 가지며, 각 외부리이드(5)의 선단부에 수평부(6)이 형성되어 있는 면실장형전자부품으로서 상기 외부리이드(5)의 수평부(6)의 끝면(7)은 수평부의 저면에 라운드부(11)로 연계되어 있는 것이 특징이다.
또한, 상기의 수평부 끝면(7)에는 상하방향으로 뻗는 복수개의 줄자국(9)가 형성된다.
4. 발명의 중요한 용도
납땜도금이 되어 있지 않은 외부리이드의 끝면의 납땜에 대한 번지는 성질을 간단한 구성과 방법으로 향상시키고 납댐실장강도를 높힌다.

Description

면실장형(面實裝型)전자부품 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예에 있어서의 면실장형반도체 장치의 전체사시도, 제2도는 제1도의 Ⅱ-Ⅱ선을 따른 단면도, 제3도는 리이드의 수평부 말단부의 확대사시도.

Claims (6)

  1. 소자(2)와 이 소자에 전기적으로 도통하는 복수개의 내부리이드(3)등이 내장된 있는 수지팩케이지(4)와 이 수지팩케이지(4)의 측면에서 상기 각 내부리이드(3)과, 연속시켜서 뻗어나가게 한 복수개의 외부리이드(5)를 가지며, 각 외부리이드(5)의 선단부에 수평부(6)이 형성되어 있는 면실장형전자부품으로서, 상기 외부리이드(5)의 수평부(6)의 끝면(7)은 수평부(6)의 저면에 있는 라운드부(11)에 의해서 연계되어 있는 것을 특징으로 하는 면실장형전자부품.
  2. 제1항에 있어서, 상기 외부리이드(5)의 수평부(6)의 끝면(7)에는 상하방향으로 뻗는 복수개의 줄자국(9)이 형성되어 있는 것을 특징으로 하는 면실장형전자부품.
  3. 소자와 이 소자에 전기적으로 도통하는 복수개의 내부리이드(3)등이 내장되어 있는 수지팩케이지(4)와 이 수지팩케이지(4)의 측면에서 상기 각 내부리이드(3)과, 연속시켜서 뻗어나오게 한 복수개의 외부리이드(5)를 가지며, 각 외부리이드(5)의 선단부분에는 수평부(6)이 형성되어 있는 면실장형전자부품으로서, 상기의 외부리이드(5)의 수평부(6)의 끝면(7)에 있어서 그 저면측에는 상하방향으로 뻗는 복수의 줄자국(9)이 형성되어 있는 것을 특징으로 하는 면실장형전자부품.
  4. 제1항 내지 제3항에 있어서, 외부리이드(5)의 수평부(6)의 끝면(7)에는 납땜도금이 되어 있지 않으며, 상기 수평부(6)의 저면과 측면에는 납땜도금이 되어 있는 것을 특징으로 하는 면실장형전자부품.
  5. 소자(2)와 이 소자(2)에 전기적으로 도통하는 복수개의 내부리이드(3)등이 내장되어 있는 수지팩케이지(4)와, 이 수지팩케이지(4)의 측면에서 상기 각 내부리이드(3)과 연속시켜서 뻗어나가게 한 복수개의 외부리이드(5)를 가지며, 각 외부리이드(5)의 선단부에 수평부(6)이 형성되어 있는 면실장형전자부품의 제조방법으로서, 리이드프레임(20)위에 소자(2)를 본딩하는 과정, 리이드프레임(20)위의 내부리이드(3)과 상기의 소자(2)와의 사이를 전기적으로 도통시키는 과정, 상기 소자 내지 내부리이드(3)을 내장하는 수지팩케이지(4)를 형성하는 과정, 상기 수지팩케이지(4)가 형성된 상태의 리이드프레임(20)에 납땜도금을 행하는 과정, 외부리이드(5)를 리이드프레임(20)에서 분리하는 리이드커트에 의해서 형성되는 외부리이드(5)의 끝면(7)에 외부리이드(5)의 상면 또는 하면으로 연계되는 라운드부(11)를 형성하는 과정, 상기 외부리이드(5)를 성형하여 상기의 라운드부(11)에 연계되는 면이 아래로 되도록 하여 수평부(6)을 형성하는 과정을 포함하는 것을 특징으로 하는 면실장형전자부품의 제조방법.
  6. 제5항에 의해서, 상기의 리이드커트에 의해서 형성되는 외부리이드(5)의 끝면(7)에 상하방향으로 뻗는 복수개의 줄자국(9)를 형성하는 것을 특징으로 하는 면실장형전자부품의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960030634A 1995-07-31 1996-07-26 면실장형(面實裝型)전자부품및그제조방법 KR100438248B1 (ko)

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JP19556195A JP3213794B2 (ja) 1995-07-31 1995-07-31 面実装型電子部品およびその製造方法
JP95-195561 1995-07-31

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KR970009495A true KR970009495A (ko) 1997-02-24
KR100438248B1 KR100438248B1 (ko) 2004-09-10

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US (1) US5723902A (ko)
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TW (1) TW307982B (ko)

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JP3012555B2 (ja) * 1997-05-29 2000-02-21 神戸日本電気ソフトウェア株式会社 多面体ｉｃパッケージ
EP1473763A1 (en) * 2003-04-30 2004-11-03 STMicroelectronics S.r.l. Manufacturing method of a lead frame for power semiconductor electronic devices, separating the leads and downsetting the die pad in one step
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US5723902A (en) 1998-03-03
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