JPWO2023153476A5 - - Google Patents
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- Publication number
- JPWO2023153476A5 JPWO2023153476A5 JP2023580318A JP2023580318A JPWO2023153476A5 JP WO2023153476 A5 JPWO2023153476 A5 JP WO2023153476A5 JP 2023580318 A JP2023580318 A JP 2023580318A JP 2023580318 A JP2023580318 A JP 2023580318A JP WO2023153476 A5 JPWO2023153476 A5 JP WO2023153476A5
- Authority
- JP
- Japan
- Prior art keywords
- light
- substrate
- manufacturing
- emitting device
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 46
- 238000004519 manufacturing process Methods 0.000 claims 32
- 238000000034 method Methods 0.000 claims 32
- 229910000679 solder Inorganic materials 0.000 claims 28
- 230000000452 restraining effect Effects 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 230000009036 growth inhibition Effects 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022019835 | 2022-02-10 | ||
| PCT/JP2023/004376 WO2023153476A1 (ja) | 2022-02-10 | 2023-02-09 | 発光デバイスの製造方法および製造装置並びにレーザ素子基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023153476A1 JPWO2023153476A1 (https=) | 2023-08-17 |
| JPWO2023153476A5 true JPWO2023153476A5 (https=) | 2024-10-23 |
Family
ID=87564539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023580318A Pending JPWO2023153476A1 (https=) | 2022-02-10 | 2023-02-09 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250118943A1 (https=) |
| EP (1) | EP4478564A4 (https=) |
| JP (1) | JPWO2023153476A1 (https=) |
| CN (1) | CN118648205A (https=) |
| WO (1) | WO2023153476A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112021004159T5 (de) * | 2020-08-04 | 2023-06-22 | Panasonic Holdings Corporation | Halbleiter-Lichtemissionsvorrichtung |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5749284A (en) * | 1980-09-09 | 1982-03-23 | Matsushita Electric Ind Co Ltd | Manufacture of light-emitting display device |
| JPS63157969U (https=) * | 1987-04-01 | 1988-10-17 | ||
| JP3090427B2 (ja) * | 1997-02-27 | 2000-09-18 | 日本電信電話株式会社 | はんだバンプの接続方法 |
| WO2001042820A2 (en) * | 1999-12-02 | 2001-06-14 | Teraconnect, Inc. | Method of making optoelectronic devices using sacrificial devices |
| JP4897133B2 (ja) * | 1999-12-09 | 2012-03-14 | ソニー株式会社 | 半導体発光素子、その製造方法および配設基板 |
| JP2002169064A (ja) * | 2000-11-30 | 2002-06-14 | Kyocera Corp | 光部品実装用基板及びその製造方法並びに光モジュール |
| JP2006332521A (ja) * | 2005-05-30 | 2006-12-07 | Fujifilm Holdings Corp | 半導体レーザー装置 |
| KR100754407B1 (ko) * | 2006-06-08 | 2007-08-31 | 삼성전자주식회사 | 서브마운트 및 이를 구비하는 멀티 빔 레이저 다이오드모듈 |
| JP2008252069A (ja) * | 2007-03-06 | 2008-10-16 | Sanyo Electric Co Ltd | 半導体レーザ素子の製造方法および半導体レーザ素子 |
| JP5521611B2 (ja) * | 2010-02-15 | 2014-06-18 | ソニー株式会社 | 光装置および光機器 |
| US10181546B2 (en) * | 2015-11-04 | 2019-01-15 | Goertek.Inc | Transferring method, manufacturing method, device and electronic apparatus of micro-LED |
| JP6551245B2 (ja) * | 2016-01-22 | 2019-07-31 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| JP2019220666A (ja) | 2018-06-19 | 2019-12-26 | 株式会社ブイ・テクノロジー | 半導体素子形成サファイア基板、及び前記半導体素子形成サファイア基板の製造方法、並びに前記半導体素子の転写方法 |
| JP6705479B2 (ja) * | 2018-09-12 | 2020-06-03 | 日亜化学工業株式会社 | 光源装置の製造方法 |
| CN113035736B (zh) * | 2019-12-09 | 2025-02-25 | 群创光电股份有限公司 | 电子装置的制作方法 |
| CN112885822B (zh) * | 2020-07-27 | 2023-08-01 | 友达光电股份有限公司 | 显示装置的制造方法 |
-
2023
- 2023-02-09 WO PCT/JP2023/004376 patent/WO2023153476A1/ja not_active Ceased
- 2023-02-09 JP JP2023580318A patent/JPWO2023153476A1/ja active Pending
- 2023-02-09 CN CN202380020305.6A patent/CN118648205A/zh active Pending
- 2023-02-09 EP EP23752940.9A patent/EP4478564A4/en active Pending
- 2023-02-09 US US18/836,213 patent/US20250118943A1/en active Pending
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