JPWO2023153476A1 - - Google Patents

Info

Publication number
JPWO2023153476A1
JPWO2023153476A1 JP2023580318A JP2023580318A JPWO2023153476A1 JP WO2023153476 A1 JPWO2023153476 A1 JP WO2023153476A1 JP 2023580318 A JP2023580318 A JP 2023580318A JP 2023580318 A JP2023580318 A JP 2023580318A JP WO2023153476 A1 JPWO2023153476 A1 JP WO2023153476A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023580318A
Other languages
Japanese (ja)
Other versions
JPWO2023153476A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023153476A1 publication Critical patent/JPWO2023153476A1/ja
Publication of JPWO2023153476A5 publication Critical patent/JPWO2023153476A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/01—Manufacture or treatment
    • H10H29/02—Manufacture or treatment using pick-and-place processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0425—Electrodes, e.g. characterised by the structure
    • H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
    • H01S5/04257—Electrodes, e.g. characterised by the structure characterised by the configuration having positive and negative electrodes on the same side of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
JP2023580318A 2022-02-10 2023-02-09 Pending JPWO2023153476A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022019835 2022-02-10
PCT/JP2023/004376 WO2023153476A1 (ja) 2022-02-10 2023-02-09 発光デバイスの製造方法および製造装置並びにレーザ素子基板

Publications (2)

Publication Number Publication Date
JPWO2023153476A1 true JPWO2023153476A1 (https=) 2023-08-17
JPWO2023153476A5 JPWO2023153476A5 (https=) 2024-10-23

Family

ID=87564539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023580318A Pending JPWO2023153476A1 (https=) 2022-02-10 2023-02-09

Country Status (5)

Country Link
US (1) US20250118943A1 (https=)
EP (1) EP4478564A4 (https=)
JP (1) JPWO2023153476A1 (https=)
CN (1) CN118648205A (https=)
WO (1) WO2023153476A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022030127A1 (https=) * 2020-08-04 2022-02-10

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5749284A (en) * 1980-09-09 1982-03-23 Matsushita Electric Ind Co Ltd Manufacture of light-emitting display device
JPS63157969U (https=) * 1987-04-01 1988-10-17
JPH10242149A (ja) * 1997-02-27 1998-09-11 Nippon Telegr & Teleph Corp <Ntt> はんだバンプの接続方法
JP2002169064A (ja) * 2000-11-30 2002-06-14 Kyocera Corp 光部品実装用基板及びその製造方法並びに光モジュール
US6485993B2 (en) * 1999-12-02 2002-11-26 Teraconnect Inc. Method of making opto-electronic devices using sacrificial devices
JP2006332521A (ja) * 2005-05-30 2006-12-07 Fujifilm Holdings Corp 半導体レーザー装置
JP2008252069A (ja) * 2007-03-06 2008-10-16 Sanyo Electric Co Ltd 半導体レーザ素子の製造方法および半導体レーザ素子
JP2011166068A (ja) * 2010-02-15 2011-08-25 Sony Corp 光装置および光機器
JP2017130589A (ja) * 2016-01-22 2017-07-27 日亜化学工業株式会社 発光装置の製造方法
JP2020043253A (ja) * 2018-09-12 2020-03-19 日亜化学工業株式会社 光源装置の製造方法
US20210175390A1 (en) * 2019-12-09 2021-06-10 Innolux Corporation Method of forming electronic device
US20220029051A1 (en) * 2020-07-27 2022-01-27 Au Optronics Corporation Fabrication method of display device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4897133B2 (ja) * 1999-12-09 2012-03-14 ソニー株式会社 半導体発光素子、その製造方法および配設基板
KR100754407B1 (ko) * 2006-06-08 2007-08-31 삼성전자주식회사 서브마운트 및 이를 구비하는 멀티 빔 레이저 다이오드모듈
JP6533838B2 (ja) * 2015-11-04 2019-06-19 ゴルテック インコーポレイテッド マイクロ発光ダイオードの搬送方法、製造方法、装置及び電子機器
JP2019220666A (ja) 2018-06-19 2019-12-26 株式会社ブイ・テクノロジー 半導体素子形成サファイア基板、及び前記半導体素子形成サファイア基板の製造方法、並びに前記半導体素子の転写方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5749284A (en) * 1980-09-09 1982-03-23 Matsushita Electric Ind Co Ltd Manufacture of light-emitting display device
JPS63157969U (https=) * 1987-04-01 1988-10-17
JPH10242149A (ja) * 1997-02-27 1998-09-11 Nippon Telegr & Teleph Corp <Ntt> はんだバンプの接続方法
US6485993B2 (en) * 1999-12-02 2002-11-26 Teraconnect Inc. Method of making opto-electronic devices using sacrificial devices
JP2002169064A (ja) * 2000-11-30 2002-06-14 Kyocera Corp 光部品実装用基板及びその製造方法並びに光モジュール
JP2006332521A (ja) * 2005-05-30 2006-12-07 Fujifilm Holdings Corp 半導体レーザー装置
JP2008252069A (ja) * 2007-03-06 2008-10-16 Sanyo Electric Co Ltd 半導体レーザ素子の製造方法および半導体レーザ素子
JP2011166068A (ja) * 2010-02-15 2011-08-25 Sony Corp 光装置および光機器
JP2017130589A (ja) * 2016-01-22 2017-07-27 日亜化学工業株式会社 発光装置の製造方法
JP2020043253A (ja) * 2018-09-12 2020-03-19 日亜化学工業株式会社 光源装置の製造方法
US20210175390A1 (en) * 2019-12-09 2021-06-10 Innolux Corporation Method of forming electronic device
US20220029051A1 (en) * 2020-07-27 2022-01-27 Au Optronics Corporation Fabrication method of display device

Also Published As

Publication number Publication date
EP4478564A4 (en) 2026-04-22
US20250118943A1 (en) 2025-04-10
CN118648205A (zh) 2024-09-13
EP4478564A1 (en) 2024-12-18
WO2023153476A1 (ja) 2023-08-17

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