JPWO2023149154A1 - - Google Patents
Info
- Publication number
- JPWO2023149154A1 JPWO2023149154A1 JP2023578427A JP2023578427A JPWO2023149154A1 JP WO2023149154 A1 JPWO2023149154 A1 JP WO2023149154A1 JP 2023578427 A JP2023578427 A JP 2023578427A JP 2023578427 A JP2023578427 A JP 2023578427A JP WO2023149154 A1 JPWO2023149154 A1 JP WO2023149154A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8053—Colour filters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8057—Optical shielding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022015503 | 2022-02-03 | ||
| PCT/JP2023/000103 WO2023149154A1 (ja) | 2022-02-03 | 2023-01-05 | 固体撮像素子、電子機器 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023149154A1 true JPWO2023149154A1 (cg-RX-API-DMAC7.html) | 2023-08-10 |
Family
ID=87552276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023578427A Pending JPWO2023149154A1 (cg-RX-API-DMAC7.html) | 2022-02-03 | 2023-01-05 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20250113637A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP4475188A4 (cg-RX-API-DMAC7.html) |
| JP (1) | JPWO2023149154A1 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20240138083A (cg-RX-API-DMAC7.html) |
| CN (1) | CN118435353A (cg-RX-API-DMAC7.html) |
| DE (1) | DE112023000807T5 (cg-RX-API-DMAC7.html) |
| TW (1) | TW202333488A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2023149154A1 (cg-RX-API-DMAC7.html) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0758306A (ja) * | 1993-08-11 | 1995-03-03 | Nec Corp | 光センサ素子 |
| JP2001237405A (ja) * | 2000-02-24 | 2001-08-31 | Victor Co Of Japan Ltd | 固体撮像装置および固体撮像装置の製造方法 |
| JP2009164385A (ja) * | 2008-01-08 | 2009-07-23 | Fujifilm Corp | 裏面照射型撮像素子 |
| JP2011134788A (ja) * | 2009-12-22 | 2011-07-07 | Canon Inc | 固体撮像装置及び固体撮像装置の製造方法 |
| JP2015002340A (ja) * | 2013-06-18 | 2015-01-05 | キヤノン株式会社 | 固体撮像装置及びその製造方法 |
| JP2015092521A (ja) * | 2013-11-08 | 2015-05-14 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| US20190157329A1 (en) * | 2017-11-20 | 2019-05-23 | Samsung Electronics Co., Ltd. | Image sensor and method of fabricating the same |
| US20210066369A1 (en) * | 2019-09-02 | 2021-03-04 | SK Hynix Inc. | Image sensing device |
| WO2021100298A1 (ja) * | 2019-11-21 | 2021-05-27 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子および撮像装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220068991A1 (en) * | 2018-12-27 | 2022-03-03 | Sony Semiconductor Solutions Corporation | Imaging element and manufacturing method of imaging element |
-
2022
- 2022-12-27 TW TW111150098A patent/TW202333488A/zh unknown
-
2023
- 2023-01-05 WO PCT/JP2023/000103 patent/WO2023149154A1/ja not_active Ceased
- 2023-01-05 CN CN202380015411.5A patent/CN118435353A/zh active Pending
- 2023-01-05 KR KR1020247026518A patent/KR20240138083A/ko active Pending
- 2023-01-05 US US18/727,183 patent/US20250113637A1/en active Pending
- 2023-01-05 JP JP2023578427A patent/JPWO2023149154A1/ja active Pending
- 2023-01-05 DE DE112023000807.8T patent/DE112023000807T5/de active Pending
- 2023-01-05 EP EP23749471.1A patent/EP4475188A4/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0758306A (ja) * | 1993-08-11 | 1995-03-03 | Nec Corp | 光センサ素子 |
| JP2001237405A (ja) * | 2000-02-24 | 2001-08-31 | Victor Co Of Japan Ltd | 固体撮像装置および固体撮像装置の製造方法 |
| JP2009164385A (ja) * | 2008-01-08 | 2009-07-23 | Fujifilm Corp | 裏面照射型撮像素子 |
| JP2011134788A (ja) * | 2009-12-22 | 2011-07-07 | Canon Inc | 固体撮像装置及び固体撮像装置の製造方法 |
| JP2015002340A (ja) * | 2013-06-18 | 2015-01-05 | キヤノン株式会社 | 固体撮像装置及びその製造方法 |
| JP2015092521A (ja) * | 2013-11-08 | 2015-05-14 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| US20190157329A1 (en) * | 2017-11-20 | 2019-05-23 | Samsung Electronics Co., Ltd. | Image sensor and method of fabricating the same |
| US20210066369A1 (en) * | 2019-09-02 | 2021-03-04 | SK Hynix Inc. | Image sensing device |
| WO2021100298A1 (ja) * | 2019-11-21 | 2021-05-27 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子および撮像装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4475188A1 (en) | 2024-12-11 |
| TW202333488A (zh) | 2023-08-16 |
| US20250113637A1 (en) | 2025-04-03 |
| DE112023000807T5 (de) | 2024-11-28 |
| WO2023149154A1 (ja) | 2023-08-10 |
| CN118435353A (zh) | 2024-08-02 |
| EP4475188A4 (en) | 2025-08-27 |
| KR20240138083A (ko) | 2024-09-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| BR102023005164A2 (cg-RX-API-DMAC7.html) | ||
| BR102022025291A2 (cg-RX-API-DMAC7.html) | ||
| BR112025024041B1 (pt) | Elemento de despejamento para uma embalagem compósita e embalagem compósita com um elemento de despejamento | |
| BR112025020304B1 (pt) | Liga de solda, esfera de solda, pré-forma de solda, junta de solda e circuito | |
| BR112025008516B1 (pt) | Método tudo em um de recuperação de níquel para recuperar níquel a partir de matérias-primas contendo níquel | |
| BR112025016688B1 (pt) | Compostos e composições farmacêuticas | |
| BR112025011041B1 (pt) | Dispositivo para inspeção de um elemento roscado e método de inspeção correspondente | |
| BR112025005915B1 (pt) | Gerador, dispositivo e método de ablação de campo pulsado | |
| BR102023016405B1 (pt) | Estrutura de viga de pá, pá de energia eólica e equipamento de energia eólica | |
| BR112024026850B1 (pt) | Triturador de mandíbula e método de serviço ou de manutenção de um triturador de mandíbula | |
| BR112024025233B1 (pt) | Método para alterar o estado de elevação vertical para um veículo transportador, controle e veículo | |
| BR102023009702B1 (pt) | Dispositivo para alisamento e aplicação de substância de tratamento | |
| BR112024027500B1 (pt) | Polipeptídeo, ácido nucleico, vetor, célula hospedeira, método para produzir o polipeptídeo, composição, uso do polipeptídeo, e, método para promover a proliferação de uma célula in vitro | |
| BR102023002997B1 (pt) | Um aparelho para detecção de vazamento de um gás e um método e um sistema do mesmo | |
| BR112024018530B1 (pt) | Método para determinar nível de escória do alto-forno, método para operar alto-forno e unidade de controle | |
| BR112024027130B1 (pt) | Sistema e método para um conjunto de cuff (balão) de tubo endotraqueal | |
| BR112025001284B1 (pt) | Cabo, sistema de sensor e método de montagem de um alojamento de sensor | |
| BR102022024748B1 (pt) | Equipamento extrator de esporos da superfície de grãos de cereal para aplicação em laboratório e seu processo operacional | |
| BR102022023712B1 (pt) | Sistema de montagem de estrutura flexível para estufas agrícolas, com sistema molejante de movimentação em relação à ação dos ventos | |
| BR122025008973A2 (pt) | Sistema, método para decodificar um vídeo e mídia legível por computador | |
| BR122025008972A2 (pt) | Sistema, método para decodificar um vídeo e mídia legível por computador | |
| BR122025008970A2 (pt) | Método para decodificar um vídeo, sistema e mídia legível por computador | |
| BR102022012728B1 (pt) | Unidade para visualização do reinício de escoamento de fluidos dependentes do tempo | |
| BR102022009310B1 (pt) | Sistema de montagem para as linhas de adubo de implementos agrícolas | |
| BR102022009015B1 (pt) | Válvula anti-congelamento para drenagem em circuitos hidráulicos de aquecedores solares, com sistema termomecânico de expansão e contração |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251118 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260707 |