JPWO2023140262A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2023140262A5 JPWO2023140262A5 JP2023557658A JP2023557658A JPWO2023140262A5 JP WO2023140262 A5 JPWO2023140262 A5 JP WO2023140262A5 JP 2023557658 A JP2023557658 A JP 2023557658A JP 2023557658 A JP2023557658 A JP 2023557658A JP WO2023140262 A5 JPWO2023140262 A5 JP WO2023140262A5
- Authority
- JP
- Japan
- Prior art keywords
- aromatic
- vinyl compound
- aromatic vinyl
- mass
- monomer units
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002554 vinyl polymer Polymers 0.000 claims 20
- 239000000178 monomer Substances 0.000 claims 18
- -1 aromatic vinyl compound Chemical class 0.000 claims 15
- 229920001577 copolymer Polymers 0.000 claims 13
- 150000001336 alkenes Chemical class 0.000 claims 10
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical group CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims 6
- 125000004432 carbon atom Chemical group C* 0.000 claims 6
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 claims 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 5
- 150000004291 polyenes Chemical class 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 229920000642 polymer Polymers 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000002966 varnish Substances 0.000 claims 3
- 125000003118 aryl group Chemical group 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 2
- 239000011229 interlayer Substances 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 239000012777 electrically insulating material Substances 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 150000002430 hydrocarbons Chemical class 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 229920001955 polyphenylene ether Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024094624A JP7627379B2 (ja) | 2022-01-19 | 2024-06-11 | 共重合体、組成物、ワニス、及びそれらの硬化体 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022006424 | 2022-01-19 | ||
| PCT/JP2023/001239 WO2023140262A1 (ja) | 2022-01-19 | 2023-01-17 | 共重合体、組成物、ワニス、及びそれらの硬化体 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024094624A Division JP7627379B2 (ja) | 2022-01-19 | 2024-06-11 | 共重合体、組成物、ワニス、及びそれらの硬化体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023140262A1 JPWO2023140262A1 (https=) | 2023-07-27 |
| JPWO2023140262A5 true JPWO2023140262A5 (https=) | 2023-12-20 |
Family
ID=87348840
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023557658A Pending JPWO2023140262A1 (https=) | 2022-01-19 | 2023-01-17 | |
| JP2024094624A Active JP7627379B2 (ja) | 2022-01-19 | 2024-06-11 | 共重合体、組成物、ワニス、及びそれらの硬化体 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024094624A Active JP7627379B2 (ja) | 2022-01-19 | 2024-06-11 | 共重合体、組成物、ワニス、及びそれらの硬化体 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250084195A1 (https=) |
| EP (1) | EP4467578A1 (https=) |
| JP (2) | JPWO2023140262A1 (https=) |
| KR (1) | KR20240099475A (https=) |
| CN (1) | CN118475624A (https=) |
| TW (1) | TW202340269A (https=) |
| WO (1) | WO2023140262A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025258655A1 (ja) * | 2024-06-13 | 2025-12-18 | デンカ株式会社 | オレフィン-芳香族ビニル化合物-芳香族ポリエン共重合体及びその製造方法、当該共重合体を含有する組成物、並びにこれらの硬化体 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2716639B2 (ja) | 1992-12-24 | 1998-02-18 | 住友ベークライト株式会社 | 低誘電率熱硬化性樹脂組成物 |
| JPH0940709A (ja) | 1995-07-31 | 1997-02-10 | Denki Kagaku Kogyo Kk | エチレン−芳香族ビニル化合物共重合体の製造方法 |
| JP3659760B2 (ja) | 1996-03-19 | 2005-06-15 | 電気化学工業株式会社 | エチレン−芳香族ビニル化合物共重合体及びその製造方法 |
| US6559234B1 (en) | 1998-12-22 | 2003-05-06 | Denki Kagaku Kogyo Kabushiki Kaisha | Cross-copolymerized olefin/styrene/diene copolymer, process for the production of the same and uses thereof |
| JP4781569B2 (ja) * | 2001-02-21 | 2011-09-28 | 電気化学工業株式会社 | クロス共重合化オレフィン−芳香族ビニル化合物−ジエン共重合体 |
| JP2001316431A (ja) * | 2000-05-08 | 2001-11-13 | Denki Kagaku Kogyo Kk | 医療用成形体 |
| JP3985633B2 (ja) | 2002-08-26 | 2007-10-03 | 株式会社日立製作所 | 低誘電正接絶縁材料を用いた高周波用電子部品 |
| JP5104507B2 (ja) | 2007-04-26 | 2012-12-19 | 日立化成工業株式会社 | セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
| JP2009161743A (ja) | 2007-12-10 | 2009-07-23 | Denki Kagaku Kogyo Kk | 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料 |
| JP5100630B2 (ja) * | 2008-12-26 | 2012-12-19 | 電気化学工業株式会社 | 太陽電池封止材 |
| JP5481098B2 (ja) | 2009-06-03 | 2014-04-23 | 電気化学工業株式会社 | 後硬化性樹脂組成物及びそれを用いた電気絶縁材料 |
| JP2012102173A (ja) * | 2010-11-08 | 2012-05-31 | Denki Kagaku Kogyo Kk | 難燃性樹脂組成物 |
| KR101832684B1 (ko) | 2015-01-13 | 2018-02-26 | 히타치가세이가부시끼가이샤 | 플렉시블 프린트 배선판용 수지 필름, 수지 부착 금속박, 커버 레이 필름, 본딩 시트 및 플렉시블 프린트 배선판 |
| KR102537249B1 (ko) * | 2017-03-30 | 2023-05-26 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 가용성 다관능 비닐 방향족 공중합체, 그 제조 방법, 경화성 수지 조성물 및 그 경화물 |
| JP7465894B2 (ja) * | 2019-12-03 | 2024-04-11 | デンカ株式会社 | 硬化性組成物及びその硬化体 |
| CN118599040A (zh) * | 2020-07-15 | 2024-09-06 | 电化株式会社 | 组合物及固化体 |
| CN115667393A (zh) * | 2020-09-11 | 2023-01-31 | 电化株式会社 | 组合物及其固化体 |
-
2023
- 2023-01-17 KR KR1020247019465A patent/KR20240099475A/ko not_active Withdrawn
- 2023-01-17 CN CN202380015862.9A patent/CN118475624A/zh active Pending
- 2023-01-17 EP EP23743256.2A patent/EP4467578A1/en not_active Withdrawn
- 2023-01-17 US US18/728,588 patent/US20250084195A1/en active Pending
- 2023-01-17 WO PCT/JP2023/001239 patent/WO2023140262A1/ja not_active Ceased
- 2023-01-17 JP JP2023557658A patent/JPWO2023140262A1/ja active Pending
- 2023-01-19 TW TW112102655A patent/TW202340269A/zh unknown
-
2024
- 2024-06-11 JP JP2024094624A patent/JP7627379B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPWO2021112088A5 (https=) | ||
| JPWO2021112087A5 (https=) | ||
| JP2024114775A5 (https=) | ||
| CN109370245A (zh) | 树脂组合物及使用该树脂组合物的薄膜 | |
| JPWO2022054885A5 (https=) | ||
| CN108239501B (zh) | 胶粘剂组合物及包含其的复合基材 | |
| JPWO2023140262A5 (https=) | ||
| CN1249182C (zh) | 低介电损耗正切膜和配线膜 | |
| JPWO2021166649A5 (https=) | ||
| CN105321640A (zh) | 正温度系数元件 | |
| JPWO2023008079A5 (https=) | ||
| TW201522463A (zh) | 形成互穿型聚合物網路的可固化組成物(二) | |
| WO2024014436A1 (ja) | ワニス及びその硬化体 | |
| CN103360577A (zh) | 热固性树脂组合物、树脂膜、覆铜板及柔性印刷布线板 | |
| JPWO2023042578A5 (https=) | ||
| JPH0580946B2 (https=) | ||
| TW201529719A (zh) | 用於可固化組成物之以乙烯基封端之聚(伸苯基)醚及苯乙烯-丁二烯共聚物的摻合物 | |
| JP2018197338A5 (https=) | ||
| JP2021011587A5 (https=) | ||
| EP2571916A1 (en) | Uv-curable polymer thick film dielectric compositions with excellent adhesion to ito | |
| CN118475624A (zh) | 共聚物、组合物、清漆、及它们的固化体 | |
| JPH04504587A (ja) | 帯電防止用ワニス組成物 | |
| JPWO2023190602A5 (https=) | ||
| JPWO2020262245A5 (https=) | ||
| JPWO2023145108A5 (https=) |