JPWO2023140262A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023140262A5
JPWO2023140262A5 JP2023557658A JP2023557658A JPWO2023140262A5 JP WO2023140262 A5 JPWO2023140262 A5 JP WO2023140262A5 JP 2023557658 A JP2023557658 A JP 2023557658A JP 2023557658 A JP2023557658 A JP 2023557658A JP WO2023140262 A5 JPWO2023140262 A5 JP WO2023140262A5
Authority
JP
Japan
Prior art keywords
aromatic
vinyl compound
aromatic vinyl
mass
monomer units
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023557658A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023140262A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/001239 external-priority patent/WO2023140262A1/ja
Publication of JPWO2023140262A1 publication Critical patent/JPWO2023140262A1/ja
Publication of JPWO2023140262A5 publication Critical patent/JPWO2023140262A5/ja
Priority to JP2024094624A priority Critical patent/JP7627379B2/ja
Pending legal-status Critical Current

Links

JP2023557658A 2022-01-19 2023-01-17 Pending JPWO2023140262A1 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024094624A JP7627379B2 (ja) 2022-01-19 2024-06-11 共重合体、組成物、ワニス、及びそれらの硬化体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022006424 2022-01-19
PCT/JP2023/001239 WO2023140262A1 (ja) 2022-01-19 2023-01-17 共重合体、組成物、ワニス、及びそれらの硬化体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024094624A Division JP7627379B2 (ja) 2022-01-19 2024-06-11 共重合体、組成物、ワニス、及びそれらの硬化体

Publications (2)

Publication Number Publication Date
JPWO2023140262A1 JPWO2023140262A1 (https=) 2023-07-27
JPWO2023140262A5 true JPWO2023140262A5 (https=) 2023-12-20

Family

ID=87348840

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023557658A Pending JPWO2023140262A1 (https=) 2022-01-19 2023-01-17
JP2024094624A Active JP7627379B2 (ja) 2022-01-19 2024-06-11 共重合体、組成物、ワニス、及びそれらの硬化体

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024094624A Active JP7627379B2 (ja) 2022-01-19 2024-06-11 共重合体、組成物、ワニス、及びそれらの硬化体

Country Status (7)

Country Link
US (1) US20250084195A1 (https=)
EP (1) EP4467578A1 (https=)
JP (2) JPWO2023140262A1 (https=)
KR (1) KR20240099475A (https=)
CN (1) CN118475624A (https=)
TW (1) TW202340269A (https=)
WO (1) WO2023140262A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025258655A1 (ja) * 2024-06-13 2025-12-18 デンカ株式会社 オレフィン-芳香族ビニル化合物-芳香族ポリエン共重合体及びその製造方法、当該共重合体を含有する組成物、並びにこれらの硬化体

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2716639B2 (ja) 1992-12-24 1998-02-18 住友ベークライト株式会社 低誘電率熱硬化性樹脂組成物
JPH0940709A (ja) 1995-07-31 1997-02-10 Denki Kagaku Kogyo Kk エチレン−芳香族ビニル化合物共重合体の製造方法
JP3659760B2 (ja) 1996-03-19 2005-06-15 電気化学工業株式会社 エチレン−芳香族ビニル化合物共重合体及びその製造方法
US6559234B1 (en) 1998-12-22 2003-05-06 Denki Kagaku Kogyo Kabushiki Kaisha Cross-copolymerized olefin/styrene/diene copolymer, process for the production of the same and uses thereof
JP4781569B2 (ja) * 2001-02-21 2011-09-28 電気化学工業株式会社 クロス共重合化オレフィン−芳香族ビニル化合物−ジエン共重合体
JP2001316431A (ja) * 2000-05-08 2001-11-13 Denki Kagaku Kogyo Kk 医療用成形体
JP3985633B2 (ja) 2002-08-26 2007-10-03 株式会社日立製作所 低誘電正接絶縁材料を用いた高周波用電子部品
JP5104507B2 (ja) 2007-04-26 2012-12-19 日立化成工業株式会社 セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板
JP2009161743A (ja) 2007-12-10 2009-07-23 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料
JP5100630B2 (ja) * 2008-12-26 2012-12-19 電気化学工業株式会社 太陽電池封止材
JP5481098B2 (ja) 2009-06-03 2014-04-23 電気化学工業株式会社 後硬化性樹脂組成物及びそれを用いた電気絶縁材料
JP2012102173A (ja) * 2010-11-08 2012-05-31 Denki Kagaku Kogyo Kk 難燃性樹脂組成物
KR101832684B1 (ko) 2015-01-13 2018-02-26 히타치가세이가부시끼가이샤 플렉시블 프린트 배선판용 수지 필름, 수지 부착 금속박, 커버 레이 필름, 본딩 시트 및 플렉시블 프린트 배선판
KR102537249B1 (ko) * 2017-03-30 2023-05-26 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 가용성 다관능 비닐 방향족 공중합체, 그 제조 방법, 경화성 수지 조성물 및 그 경화물
JP7465894B2 (ja) * 2019-12-03 2024-04-11 デンカ株式会社 硬化性組成物及びその硬化体
CN118599040A (zh) * 2020-07-15 2024-09-06 电化株式会社 组合物及固化体
CN115667393A (zh) * 2020-09-11 2023-01-31 电化株式会社 组合物及其固化体

Similar Documents

Publication Publication Date Title
JPWO2021112088A5 (https=)
JPWO2021112087A5 (https=)
JP2024114775A5 (https=)
CN109370245A (zh) 树脂组合物及使用该树脂组合物的薄膜
JPWO2022054885A5 (https=)
CN108239501B (zh) 胶粘剂组合物及包含其的复合基材
JPWO2023140262A5 (https=)
CN1249182C (zh) 低介电损耗正切膜和配线膜
JPWO2021166649A5 (https=)
CN105321640A (zh) 正温度系数元件
JPWO2023008079A5 (https=)
TW201522463A (zh) 形成互穿型聚合物網路的可固化組成物(二)
WO2024014436A1 (ja) ワニス及びその硬化体
CN103360577A (zh) 热固性树脂组合物、树脂膜、覆铜板及柔性印刷布线板
JPWO2023042578A5 (https=)
JPH0580946B2 (https=)
TW201529719A (zh) 用於可固化組成物之以乙烯基封端之聚(伸苯基)醚及苯乙烯-丁二烯共聚物的摻合物
JP2018197338A5 (https=)
JP2021011587A5 (https=)
EP2571916A1 (en) Uv-curable polymer thick film dielectric compositions with excellent adhesion to ito
CN118475624A (zh) 共聚物、组合物、清漆、及它们的固化体
JPH04504587A (ja) 帯電防止用ワニス組成物
JPWO2023190602A5 (https=)
JPWO2020262245A5 (https=)
JPWO2023145108A5 (https=)