JPWO2023008079A5 - - Google Patents
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- Publication number
- JPWO2023008079A5 JPWO2023008079A5 JP2023514033A JP2023514033A JPWO2023008079A5 JP WO2023008079 A5 JPWO2023008079 A5 JP WO2023008079A5 JP 2023514033 A JP2023514033 A JP 2023514033A JP 2023514033 A JP2023514033 A JP 2023514033A JP WO2023008079 A5 JPWO2023008079 A5 JP WO2023008079A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- general formula
- curable resin
- integer
- following general
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000126 substance Substances 0.000 claims 8
- 125000003118 aryl group Chemical group 0.000 claims 7
- 125000004432 carbon atom Chemical group C* 0.000 claims 7
- 239000011347 resin Substances 0.000 claims 7
- 229920005989 resin Polymers 0.000 claims 7
- 125000000217 alkyl group Chemical group 0.000 claims 6
- 125000003710 aryl alkyl group Chemical group 0.000 claims 6
- 239000011342 resin composition Substances 0.000 claims 6
- 125000000753 cycloalkyl group Chemical group 0.000 claims 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 230000003014 reinforcing effect Effects 0.000 claims 2
- 239000002966 varnish Substances 0.000 claims 2
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 238000007865 diluting Methods 0.000 claims 1
- 125000000623 heterocyclic group Chemical group 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 150000002430 hydrocarbons Chemical class 0.000 claims 1
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021124129 | 2021-07-29 | ||
| JP2021124129 | 2021-07-29 | ||
| PCT/JP2022/026139 WO2023008079A1 (ja) | 2021-07-29 | 2022-06-30 | 硬化性樹脂組成物、および、硬化物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023008079A1 JPWO2023008079A1 (https=) | 2023-02-02 |
| JPWO2023008079A5 true JPWO2023008079A5 (https=) | 2023-07-05 |
| JP7306599B2 JP7306599B2 (ja) | 2023-07-11 |
Family
ID=85086710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023514033A Active JP7306599B2 (ja) | 2021-07-29 | 2022-06-30 | 硬化性樹脂組成物、および、硬化物 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240317916A1 (https=) |
| JP (1) | JP7306599B2 (https=) |
| CN (1) | CN117813331A (https=) |
| WO (1) | WO2023008079A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121666904A (zh) * | 2023-08-07 | 2026-03-13 | 株式会社力森诺科 | 半导体装置的制造方法及封装用材料 |
| JP2025028763A (ja) | 2023-08-18 | 2025-03-03 | 味の素株式会社 | 樹脂組成物 |
| TW202536020A (zh) * | 2023-10-16 | 2025-09-16 | 日商Ａｇｃ股份有限公司 | 組合物、預浸體、及金屬箔積層板 |
| WO2026023296A1 (ja) * | 2024-07-26 | 2026-01-29 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5237284B2 (ja) * | 2006-09-15 | 2013-07-17 | サビック・イノベーティブ・プラスチックス・アイピー・ベスローテン・フェンノートシャップ | ポリ（アリーレンエーテル）組成物、方法および物品 |
| JP2008274239A (ja) * | 2007-03-30 | 2008-11-13 | Univ Kanagawa | ハイパーブランチポリカーボネートおよびその製造方法 |
| TWI813767B (zh) * | 2018-09-18 | 2023-09-01 | 日商Ｄｉｃ股份有限公司 | 活性酯樹脂製造用原料組成物、活性酯樹脂及其製造方法、以及熱硬化性樹脂組成物及其硬化物 |
| JP2020100759A (ja) * | 2018-12-25 | 2020-07-02 | 京セラ株式会社 | 樹脂組成物、プリプレグ、金属張積層板および配線基板 |
| TWI874606B (zh) * | 2020-04-06 | 2025-03-01 | 日商Ｄｉｃ股份有限公司 | 硬化性樹脂、硬化性樹脂組成物及硬化物 |
| JP7060181B1 (ja) * | 2020-06-03 | 2022-04-26 | Dic株式会社 | 硬化性樹脂、硬化性樹脂組成物、及び、硬化物 |
| KR20230051434A (ko) * | 2020-08-19 | 2023-04-18 | 디아이씨 가부시끼가이샤 | 경화성 수지, 경화성 수지 조성물 및 경화물 |
-
2022
- 2022-06-30 US US18/577,915 patent/US20240317916A1/en active Pending
- 2022-06-30 JP JP2023514033A patent/JP7306599B2/ja active Active
- 2022-06-30 CN CN202280052870.6A patent/CN117813331A/zh active Pending
- 2022-06-30 WO PCT/JP2022/026139 patent/WO2023008079A1/ja not_active Ceased
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