JPWO2023132063A5 - - Google Patents
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- Publication number
- JPWO2023132063A5 JPWO2023132063A5 JP2023572319A JP2023572319A JPWO2023132063A5 JP WO2023132063 A5 JPWO2023132063 A5 JP WO2023132063A5 JP 2023572319 A JP2023572319 A JP 2023572319A JP 2023572319 A JP2023572319 A JP 2023572319A JP WO2023132063 A5 JPWO2023132063 A5 JP WO2023132063A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- quantum
- cover
- bit
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/000384 WO2023132063A1 (ja) | 2022-01-07 | 2022-01-07 | 量子演算装置及び量子演算装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023132063A1 JPWO2023132063A1 (https=) | 2023-07-13 |
| JPWO2023132063A5 true JPWO2023132063A5 (https=) | 2024-07-10 |
| JP7666652B2 JP7666652B2 (ja) | 2025-04-22 |
Family
ID=87073584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023572319A Active JP7666652B2 (ja) | 2022-01-07 | 2022-01-07 | 量子演算装置及び量子演算装置の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20260082822A1 (https=) |
| EP (1) | EP4475176B1 (https=) |
| JP (1) | JP7666652B2 (https=) |
| WO (1) | WO2023132063A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025046715A1 (ja) * | 2023-08-28 | 2025-03-06 | 富士通株式会社 | 量子ビットデバイス及び量子ビットデバイスの製造方法 |
| JP2025112080A (ja) * | 2024-01-18 | 2025-07-31 | 富士通株式会社 | 量子ビットデバイスの製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04338683A (ja) * | 1991-05-16 | 1992-11-25 | Fujitsu Ltd | 超伝導集積回路素子とその実装方法 |
| JP3118562B2 (ja) * | 1997-12-08 | 2000-12-18 | 工業技術院長 | 超電導集積回路構造及びその製造方法 |
| US6528875B1 (en) * | 2001-04-20 | 2003-03-04 | Amkor Technology, Inc. | Vacuum sealed package for semiconductor chip |
| US9836699B1 (en) * | 2015-04-27 | 2017-12-05 | Rigetti & Co. | Microwave integrated quantum circuits with interposer |
| US10134972B2 (en) | 2015-07-23 | 2018-11-20 | Massachusetts Institute Of Technology | Qubit and coupler circuit structures and coupling techniques |
| EP4086965B1 (en) | 2016-09-13 | 2025-08-20 | Google LLC | Reducing loss in stacked quantum devices |
| JP6974470B2 (ja) | 2016-09-14 | 2021-12-01 | グーグル エルエルシーGoogle LLC | ローカル真空キャビティーを使用して量子デバイスの中の散逸および周波数ノイズを低減させること |
| CN110431568B (zh) | 2017-03-13 | 2024-03-08 | 谷歌有限责任公司 | 在堆叠的量子计算装置中的集成电路元件 |
| JP7427914B2 (ja) * | 2019-10-30 | 2024-02-06 | 日本電気株式会社 | 超伝導回路装置、スペーサ、及び超伝導回路装置の製造方法 |
-
2022
- 2022-01-07 JP JP2023572319A patent/JP7666652B2/ja active Active
- 2022-01-07 WO PCT/JP2022/000384 patent/WO2023132063A1/ja not_active Ceased
- 2022-01-07 EP EP22918652.3A patent/EP4475176B1/en active Active
-
2024
- 2024-06-05 US US18/734,686 patent/US20260082822A1/en active Pending
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