JP2022092661A5 - - Google Patents

Download PDF

Info

Publication number
JP2022092661A5
JP2022092661A5 JP2020205499A JP2020205499A JP2022092661A5 JP 2022092661 A5 JP2022092661 A5 JP 2022092661A5 JP 2020205499 A JP2020205499 A JP 2020205499A JP 2020205499 A JP2020205499 A JP 2020205499A JP 2022092661 A5 JP2022092661 A5 JP 2022092661A5
Authority
JP
Japan
Prior art keywords
sealing member
inner part
contacts
film
seal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020205499A
Other languages
English (en)
Japanese (ja)
Other versions
JP7638690B2 (ja
JP2022092661A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2020205499A external-priority patent/JP7638690B2/ja
Priority to JP2020205499A priority Critical patent/JP7638690B2/ja
Priority to TW110136992A priority patent/TWI781782B/zh
Priority to US17/499,002 priority patent/US11792949B2/en
Priority to CN202111212678.2A priority patent/CN114630537B/zh
Priority to KR1020210140090A priority patent/KR102606997B1/ko
Priority to EP21204222.0A priority patent/EP4013197B1/en
Publication of JP2022092661A publication Critical patent/JP2022092661A/ja
Publication of JP2022092661A5 publication Critical patent/JP2022092661A5/ja
Publication of JP7638690B2 publication Critical patent/JP7638690B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2020205499A 2020-12-11 2020-12-11 デバイス及びデバイスの製造方法 Active JP7638690B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2020205499A JP7638690B2 (ja) 2020-12-11 2020-12-11 デバイス及びデバイスの製造方法
TW110136992A TWI781782B (zh) 2020-12-11 2021-10-05 裝置以及裝置之製造方法
US17/499,002 US11792949B2 (en) 2020-12-11 2021-10-12 Device including a circuit member sealed by a film, and method of forming the device
CN202111212678.2A CN114630537B (zh) 2020-12-11 2021-10-18 器件及其形成方法
KR1020210140090A KR102606997B1 (ko) 2020-12-11 2021-10-20 디바이스 및 디바이스의 제조방법
EP21204222.0A EP4013197B1 (en) 2020-12-11 2021-10-22 Device and forming method of device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020205499A JP7638690B2 (ja) 2020-12-11 2020-12-11 デバイス及びデバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2022092661A JP2022092661A (ja) 2022-06-23
JP2022092661A5 true JP2022092661A5 (https=) 2023-11-15
JP7638690B2 JP7638690B2 (ja) 2025-03-04

Family

ID=78598699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020205499A Active JP7638690B2 (ja) 2020-12-11 2020-12-11 デバイス及びデバイスの製造方法

Country Status (6)

Country Link
US (1) US11792949B2 (https=)
EP (1) EP4013197B1 (https=)
JP (1) JP7638690B2 (https=)
KR (1) KR102606997B1 (https=)
CN (1) CN114630537B (https=)
TW (1) TWI781782B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7638767B2 (ja) 2021-04-05 2025-03-04 日本航空電子工業株式会社 デバイス
US11800643B2 (en) * 2021-04-05 2023-10-24 Japan Aviation Electronics Industry, Limited Device having closed space between overlapping sealing members

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3910008A (en) 1974-08-20 1975-10-07 Svenska Manufacturing Corp Vacuum packaging
WO1988002551A1 (en) * 1986-09-26 1988-04-07 General Electric Company Method and apparatus for packaging integrated circuit chips employing a polymer film overlay layer
US4933042A (en) * 1986-09-26 1990-06-12 General Electric Company Method for packaging integrated circuit chips employing a polymer film overlay layer
JPS649175A (en) * 1987-06-24 1989-01-12 Dainippon Printing Co Ltd Method for packaging precise processed electronic part such as lead frame
JPH01309343A (ja) * 1988-06-08 1989-12-13 Fuji Electric Co Ltd 半導体装置の実装方法
US5776278A (en) * 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US5285619A (en) * 1992-10-06 1994-02-15 Williams International Corporation Self tooling, molded electronics packaging
US5605547A (en) 1995-03-27 1997-02-25 Micron Technology, Inc. Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor
JP3341833B2 (ja) 2000-02-21 2002-11-05 株式会社サントク 真空保管袋
JP3537400B2 (ja) 2000-03-17 2004-06-14 松下電器産業株式会社 半導体内蔵モジュール及びその製造方法
JP3876109B2 (ja) 2000-03-29 2007-01-31 松下電器産業株式会社 電子回路形成品の製造方法
JP2003258413A (ja) 2002-03-06 2003-09-12 Nikkiso Co Ltd 回路素子の実装装置および実装方法
JP2004223835A (ja) 2003-01-22 2004-08-12 Teijin Dupont Films Japan Ltd ヒートシール性ポリエステルフィルム
JP3789438B2 (ja) 2003-03-03 2006-06-21 Ｎｅｃラミリオンエナジー株式会社 フィルム外装電池
JP3859645B2 (ja) * 2004-01-16 2006-12-20 Ｎｅｃラミリオンエナジー株式会社 フィルム外装電気デバイス
CN201545294U (zh) 2009-12-17 2010-08-11 邢德龙 纹路导气膜压缩袋
JP6851131B2 (ja) * 2013-12-04 2021-03-31 株式会社半導体エネルギー研究所 可撓性を有する二次電池
TWI660471B (zh) * 2017-10-06 2019-05-21 財團法人工業技術研究院 晶片封裝
KR102073295B1 (ko) * 2018-06-22 2020-02-04 삼성전자주식회사 반도체 패키지
US11515351B2 (en) * 2018-06-27 2022-11-29 Sony Semiconductor Solutions Corporation Semiconductor device and method of manufacturing semiconductor device
CN111755348B (zh) * 2019-03-26 2025-07-25 Pep创新私人有限公司 半导体器件封装方法及半导体器件
JP7638767B2 (ja) * 2021-04-05 2025-03-04 日本航空電子工業株式会社 デバイス
US11800643B2 (en) * 2021-04-05 2023-10-24 Japan Aviation Electronics Industry, Limited Device having closed space between overlapping sealing members

Similar Documents

Publication Publication Date Title
JP2022092661A5 (https=)
US10863807B1 (en) Waterproof sleeve for electronic device
JP2003229080A5 (https=)
JP2017183621A (ja) 電子機器
CN109964362A (zh) 具有简单感测结构的电池模块
JP2001072116A (ja) 電気接続箱
CN205266110U (zh) 一种相变材料封装盒体
CN114267540A (zh) 一种高效散热型铝电解电容器
JPWO2023163100A5 (https=)
JP2018032677A (ja) コンデンサ
JP2016028223A (ja) 冷蔵庫
JP2000208948A (ja) 機器筐体の構造
ES2320447T3 (es) Dispositivo con circuitos hibridos de microondas con blindaje mediante elemento(s) de contacto elastico(s).
TWI587421B (zh) 一種元件選取系統
CN211205338U (zh) 气流传感器
KR20190044976A (ko) 이차 전지
TW202240622A (zh) 具空穴密閉式貼片保險絲
TWM615165U (zh) 具空穴密閉式貼片保險絲
CN217919276U (zh) 密封盒及显示屏
CN115188643B (zh) 具空穴密闭式贴片保险丝
KR20160113079A (ko) 곡면 구조의 전지셀 수납용 트레이
CN215499482U (zh) 一种无线耳机充电装置
JP2015166663A (ja) 冷蔵庫
JPH06333543A (ja) 蓄電池
JPH0436099Y2 (https=)