KR102606997B1 - 디바이스 및 디바이스의 제조방법 - Google Patents

디바이스 및 디바이스의 제조방법 Download PDF

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Publication number
KR102606997B1
KR102606997B1 KR1020210140090A KR20210140090A KR102606997B1 KR 102606997 B1 KR102606997 B1 KR 102606997B1 KR 1020210140090 A KR1020210140090 A KR 1020210140090A KR 20210140090 A KR20210140090 A KR 20210140090A KR 102606997 B1 KR102606997 B1 KR 102606997B1
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KR
South Korea
Prior art keywords
film
contact point
circuit
sealing member
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020210140090A
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English (en)
Korean (ko)
Other versions
KR20220083566A (ko
Inventor
신지 우에다
오사무 하시구치
Original Assignee
니혼 고꾸 덴시 고교 가부시끼가이샤
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Publication of KR20220083566A publication Critical patent/KR20220083566A/ko
Application granted granted Critical
Publication of KR102606997B1 publication Critical patent/KR102606997B1/ko
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Classifications

    • H01L25/16—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H01L23/293—
    • H01L23/3107—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
    • A61B5/024—Measuring pulse rate or heart rate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Push-Button Switches (AREA)
  • Packages (AREA)
  • Bag Frames (AREA)
  • Electroluminescent Light Sources (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Vehicle Body Suspensions (AREA)
  • Manufacture Of Switches (AREA)
  • Package Closures (AREA)
KR1020210140090A 2020-12-11 2021-10-20 디바이스 및 디바이스의 제조방법 Active KR102606997B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020205499A JP7638690B2 (ja) 2020-12-11 2020-12-11 デバイス及びデバイスの製造方法
JPJP-P-2020-205499 2020-12-11

Publications (2)

Publication Number Publication Date
KR20220083566A KR20220083566A (ko) 2022-06-20
KR102606997B1 true KR102606997B1 (ko) 2023-11-29

Family

ID=78598699

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210140090A Active KR102606997B1 (ko) 2020-12-11 2021-10-20 디바이스 및 디바이스의 제조방법

Country Status (6)

Country Link
US (1) US11792949B2 (https=)
EP (1) EP4013197B1 (https=)
JP (1) JP7638690B2 (https=)
KR (1) KR102606997B1 (https=)
CN (1) CN114630537B (https=)
TW (1) TWI781782B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7638767B2 (ja) 2021-04-05 2025-03-04 日本航空電子工業株式会社 デバイス
US11800643B2 (en) * 2021-04-05 2023-10-24 Japan Aviation Electronics Industry, Limited Device having closed space between overlapping sealing members

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201545294U (zh) * 2009-12-17 2010-08-11 邢德龙 纹路导气膜压缩袋

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3910008A (en) 1974-08-20 1975-10-07 Svenska Manufacturing Corp Vacuum packaging
WO1988002551A1 (en) * 1986-09-26 1988-04-07 General Electric Company Method and apparatus for packaging integrated circuit chips employing a polymer film overlay layer
US4933042A (en) * 1986-09-26 1990-06-12 General Electric Company Method for packaging integrated circuit chips employing a polymer film overlay layer
JPS649175A (en) * 1987-06-24 1989-01-12 Dainippon Printing Co Ltd Method for packaging precise processed electronic part such as lead frame
JPH01309343A (ja) * 1988-06-08 1989-12-13 Fuji Electric Co Ltd 半導体装置の実装方法
US5776278A (en) * 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US5285619A (en) * 1992-10-06 1994-02-15 Williams International Corporation Self tooling, molded electronics packaging
US5605547A (en) 1995-03-27 1997-02-25 Micron Technology, Inc. Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor
JP3341833B2 (ja) 2000-02-21 2002-11-05 株式会社サントク 真空保管袋
JP3537400B2 (ja) 2000-03-17 2004-06-14 松下電器産業株式会社 半導体内蔵モジュール及びその製造方法
JP3876109B2 (ja) 2000-03-29 2007-01-31 松下電器産業株式会社 電子回路形成品の製造方法
JP2003258413A (ja) 2002-03-06 2003-09-12 Nikkiso Co Ltd 回路素子の実装装置および実装方法
JP2004223835A (ja) 2003-01-22 2004-08-12 Teijin Dupont Films Japan Ltd ヒートシール性ポリエステルフィルム
JP3789438B2 (ja) 2003-03-03 2006-06-21 Ｎｅｃラミリオンエナジー株式会社 フィルム外装電池
JP3859645B2 (ja) * 2004-01-16 2006-12-20 Ｎｅｃラミリオンエナジー株式会社 フィルム外装電気デバイス
JP6851131B2 (ja) * 2013-12-04 2021-03-31 株式会社半導体エネルギー研究所 可撓性を有する二次電池
TWI660471B (zh) * 2017-10-06 2019-05-21 財團法人工業技術研究院 晶片封裝
KR102073295B1 (ko) * 2018-06-22 2020-02-04 삼성전자주식회사 반도체 패키지
US11515351B2 (en) * 2018-06-27 2022-11-29 Sony Semiconductor Solutions Corporation Semiconductor device and method of manufacturing semiconductor device
CN111755348B (zh) * 2019-03-26 2025-07-25 Pep创新私人有限公司 半导体器件封装方法及半导体器件
JP7638767B2 (ja) * 2021-04-05 2025-03-04 日本航空電子工業株式会社 デバイス
US11800643B2 (en) * 2021-04-05 2023-10-24 Japan Aviation Electronics Industry, Limited Device having closed space between overlapping sealing members

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201545294U (zh) * 2009-12-17 2010-08-11 邢德龙 纹路导气膜压缩袋

Also Published As

Publication number Publication date
TW202224120A (zh) 2022-06-16
JP7638690B2 (ja) 2025-03-04
JP2022092661A (ja) 2022-06-23
EP4013197B1 (en) 2023-07-12
CN114630537A (zh) 2022-06-14
US11792949B2 (en) 2023-10-17
US20220192043A1 (en) 2022-06-16
KR20220083566A (ko) 2022-06-20
CN114630537B (zh) 2024-04-30
TWI781782B (zh) 2022-10-21
EP4013197A1 (en) 2022-06-15

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