CN114630537B - 器件及其形成方法 - Google Patents

器件及其形成方法 Download PDF

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Publication number
CN114630537B
CN114630537B CN202111212678.2A CN202111212678A CN114630537B CN 114630537 B CN114630537 B CN 114630537B CN 202111212678 A CN202111212678 A CN 202111212678A CN 114630537 B CN114630537 B CN 114630537B
Authority
CN
China
Prior art keywords
film
sealing member
sealing
contact point
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202111212678.2A
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English (en)
Chinese (zh)
Other versions
CN114630537A (zh
Inventor
上田真慈
桥口徹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Aviation Electronics Industry Ltd
Original Assignee
Japan Aviation Electronics Industry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Aviation Electronics Industry Ltd filed Critical Japan Aviation Electronics Industry Ltd
Publication of CN114630537A publication Critical patent/CN114630537A/zh
Application granted granted Critical
Publication of CN114630537B publication Critical patent/CN114630537B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
    • A61B5/024—Measuring pulse rate or heart rate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Push-Button Switches (AREA)
  • Packages (AREA)
  • Bag Frames (AREA)
  • Electroluminescent Light Sources (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Vehicle Body Suspensions (AREA)
  • Manufacture Of Switches (AREA)
  • Package Closures (AREA)
CN202111212678.2A 2020-12-11 2021-10-18 器件及其形成方法 Active CN114630537B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020205499A JP7638690B2 (ja) 2020-12-11 2020-12-11 デバイス及びデバイスの製造方法
JP2020-205499 2020-12-11

Publications (2)

Publication Number Publication Date
CN114630537A CN114630537A (zh) 2022-06-14
CN114630537B true CN114630537B (zh) 2024-04-30

Family

ID=78598699

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111212678.2A Active CN114630537B (zh) 2020-12-11 2021-10-18 器件及其形成方法

Country Status (6)

Country Link
US (1) US11792949B2 (https=)
EP (1) EP4013197B1 (https=)
JP (1) JP7638690B2 (https=)
KR (1) KR102606997B1 (https=)
CN (1) CN114630537B (https=)
TW (1) TWI781782B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7638767B2 (ja) 2021-04-05 2025-03-04 日本航空電子工業株式会社 デバイス
US11800643B2 (en) * 2021-04-05 2023-10-24 Japan Aviation Electronics Industry, Limited Device having closed space between overlapping sealing members

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4933042A (en) * 1986-09-26 1990-06-12 General Electric Company Method for packaging integrated circuit chips employing a polymer film overlay layer
US5285619A (en) * 1992-10-06 1994-02-15 Williams International Corporation Self tooling, molded electronics packaging
US5776278A (en) * 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
CN1641903A (zh) * 2004-01-16 2005-07-20 Neclamilion能源株式会社 具有压力释放开口的薄膜包覆电子器件
CN201545294U (zh) * 2009-12-17 2010-08-11 邢德龙 纹路导气膜压缩袋

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3910008A (en) 1974-08-20 1975-10-07 Svenska Manufacturing Corp Vacuum packaging
WO1988002551A1 (en) * 1986-09-26 1988-04-07 General Electric Company Method and apparatus for packaging integrated circuit chips employing a polymer film overlay layer
JPS649175A (en) * 1987-06-24 1989-01-12 Dainippon Printing Co Ltd Method for packaging precise processed electronic part such as lead frame
JPH01309343A (ja) * 1988-06-08 1989-12-13 Fuji Electric Co Ltd 半導体装置の実装方法
US5605547A (en) 1995-03-27 1997-02-25 Micron Technology, Inc. Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor
JP3341833B2 (ja) 2000-02-21 2002-11-05 株式会社サントク 真空保管袋
JP3537400B2 (ja) 2000-03-17 2004-06-14 松下電器産業株式会社 半導体内蔵モジュール及びその製造方法
JP3876109B2 (ja) 2000-03-29 2007-01-31 松下電器産業株式会社 電子回路形成品の製造方法
JP2003258413A (ja) 2002-03-06 2003-09-12 Nikkiso Co Ltd 回路素子の実装装置および実装方法
JP2004223835A (ja) 2003-01-22 2004-08-12 Teijin Dupont Films Japan Ltd ヒートシール性ポリエステルフィルム
JP3789438B2 (ja) 2003-03-03 2006-06-21 Ｎｅｃラミリオンエナジー株式会社 フィルム外装電池
JP6851131B2 (ja) * 2013-12-04 2021-03-31 株式会社半導体エネルギー研究所 可撓性を有する二次電池
TWI660471B (zh) * 2017-10-06 2019-05-21 財團法人工業技術研究院 晶片封裝
KR102073295B1 (ko) * 2018-06-22 2020-02-04 삼성전자주식회사 반도체 패키지
US11515351B2 (en) * 2018-06-27 2022-11-29 Sony Semiconductor Solutions Corporation Semiconductor device and method of manufacturing semiconductor device
CN111755348B (zh) * 2019-03-26 2025-07-25 Pep创新私人有限公司 半导体器件封装方法及半导体器件
JP7638767B2 (ja) * 2021-04-05 2025-03-04 日本航空電子工業株式会社 デバイス
US11800643B2 (en) * 2021-04-05 2023-10-24 Japan Aviation Electronics Industry, Limited Device having closed space between overlapping sealing members

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4933042A (en) * 1986-09-26 1990-06-12 General Electric Company Method for packaging integrated circuit chips employing a polymer film overlay layer
US5776278A (en) * 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US5285619A (en) * 1992-10-06 1994-02-15 Williams International Corporation Self tooling, molded electronics packaging
CN1641903A (zh) * 2004-01-16 2005-07-20 Neclamilion能源株式会社 具有压力释放开口的薄膜包覆电子器件
CN201545294U (zh) * 2009-12-17 2010-08-11 邢德龙 纹路导气膜压缩袋

Also Published As

Publication number Publication date
TW202224120A (zh) 2022-06-16
JP7638690B2 (ja) 2025-03-04
JP2022092661A (ja) 2022-06-23
EP4013197B1 (en) 2023-07-12
CN114630537A (zh) 2022-06-14
KR102606997B1 (ko) 2023-11-29
US11792949B2 (en) 2023-10-17
US20220192043A1 (en) 2022-06-16
KR20220083566A (ko) 2022-06-20
TWI781782B (zh) 2022-10-21
EP4013197A1 (en) 2022-06-15

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