TWI781782B - 裝置以及裝置之製造方法 - Google Patents

裝置以及裝置之製造方法 Download PDF

Info

Publication number
TWI781782B
TWI781782B TW110136992A TW110136992A TWI781782B TW I781782 B TWI781782 B TW I781782B TW 110136992 A TW110136992 A TW 110136992A TW 110136992 A TW110136992 A TW 110136992A TW I781782 B TWI781782 B TW I781782B
Authority
TW
Taiwan
Prior art keywords
sealing
film
sealing member
contact
circuit
Prior art date
Application number
TW110136992A
Other languages
English (en)
Chinese (zh)
Other versions
TW202224120A (zh
Inventor
上田真慈
橋口徹
Original Assignee
日商日本航空電子工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本航空電子工業股份有限公司 filed Critical 日商日本航空電子工業股份有限公司
Publication of TW202224120A publication Critical patent/TW202224120A/zh
Application granted granted Critical
Publication of TWI781782B publication Critical patent/TWI781782B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
    • A61B5/024—Measuring pulse rate or heart rate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Push-Button Switches (AREA)
  • Packages (AREA)
  • Bag Frames (AREA)
  • Electroluminescent Light Sources (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Vehicle Body Suspensions (AREA)
  • Manufacture Of Switches (AREA)
  • Package Closures (AREA)
TW110136992A 2020-12-11 2021-10-05 裝置以及裝置之製造方法 TWI781782B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020205499A JP7638690B2 (ja) 2020-12-11 2020-12-11 デバイス及びデバイスの製造方法
JP2020-205499 2020-12-11

Publications (2)

Publication Number Publication Date
TW202224120A TW202224120A (zh) 2022-06-16
TWI781782B true TWI781782B (zh) 2022-10-21

Family

ID=78598699

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110136992A TWI781782B (zh) 2020-12-11 2021-10-05 裝置以及裝置之製造方法

Country Status (6)

Country Link
US (1) US11792949B2 (https=)
EP (1) EP4013197B1 (https=)
JP (1) JP7638690B2 (https=)
KR (1) KR102606997B1 (https=)
CN (1) CN114630537B (https=)
TW (1) TWI781782B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7638767B2 (ja) 2021-04-05 2025-03-04 日本航空電子工業株式会社 デバイス
US11800643B2 (en) * 2021-04-05 2023-10-24 Japan Aviation Electronics Industry, Limited Device having closed space between overlapping sealing members

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201916279A (zh) * 2017-10-06 2019-04-16 財團法人工業技術研究院 晶片封裝
TW202015207A (zh) * 2018-06-27 2020-04-16 日商索尼半導體解決方案公司 半導體裝置及半導體裝置之製造方法
US20200235058A1 (en) * 2018-06-22 2020-07-23 Samsung Electronics Co., Ltd. Semiconductor package
US20200312676A1 (en) * 2019-03-26 2020-10-01 Pep Innovation Pte. Ltd. Packaging method, panel assembly, wafer package and chip package

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3910008A (en) 1974-08-20 1975-10-07 Svenska Manufacturing Corp Vacuum packaging
WO1988002551A1 (en) * 1986-09-26 1988-04-07 General Electric Company Method and apparatus for packaging integrated circuit chips employing a polymer film overlay layer
US4933042A (en) * 1986-09-26 1990-06-12 General Electric Company Method for packaging integrated circuit chips employing a polymer film overlay layer
JPS649175A (en) * 1987-06-24 1989-01-12 Dainippon Printing Co Ltd Method for packaging precise processed electronic part such as lead frame
JPH01309343A (ja) * 1988-06-08 1989-12-13 Fuji Electric Co Ltd 半導体装置の実装方法
US5776278A (en) * 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
US5285619A (en) * 1992-10-06 1994-02-15 Williams International Corporation Self tooling, molded electronics packaging
US5605547A (en) 1995-03-27 1997-02-25 Micron Technology, Inc. Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor
JP3341833B2 (ja) 2000-02-21 2002-11-05 株式会社サントク 真空保管袋
JP3537400B2 (ja) 2000-03-17 2004-06-14 松下電器産業株式会社 半導体内蔵モジュール及びその製造方法
JP3876109B2 (ja) 2000-03-29 2007-01-31 松下電器産業株式会社 電子回路形成品の製造方法
JP2003258413A (ja) 2002-03-06 2003-09-12 Nikkiso Co Ltd 回路素子の実装装置および実装方法
JP2004223835A (ja) 2003-01-22 2004-08-12 Teijin Dupont Films Japan Ltd ヒートシール性ポリエステルフィルム
JP3789438B2 (ja) 2003-03-03 2006-06-21 Ｎｅｃラミリオンエナジー株式会社 フィルム外装電池
JP3859645B2 (ja) * 2004-01-16 2006-12-20 Ｎｅｃラミリオンエナジー株式会社 フィルム外装電気デバイス
CN201545294U (zh) 2009-12-17 2010-08-11 邢德龙 纹路导气膜压缩袋
JP6851131B2 (ja) * 2013-12-04 2021-03-31 株式会社半導体エネルギー研究所 可撓性を有する二次電池
JP7638767B2 (ja) * 2021-04-05 2025-03-04 日本航空電子工業株式会社 デバイス
US11800643B2 (en) * 2021-04-05 2023-10-24 Japan Aviation Electronics Industry, Limited Device having closed space between overlapping sealing members

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201916279A (zh) * 2017-10-06 2019-04-16 財團法人工業技術研究院 晶片封裝
US20200235058A1 (en) * 2018-06-22 2020-07-23 Samsung Electronics Co., Ltd. Semiconductor package
TW202015207A (zh) * 2018-06-27 2020-04-16 日商索尼半導體解決方案公司 半導體裝置及半導體裝置之製造方法
US20200312676A1 (en) * 2019-03-26 2020-10-01 Pep Innovation Pte. Ltd. Packaging method, panel assembly, wafer package and chip package

Also Published As

Publication number Publication date
TW202224120A (zh) 2022-06-16
JP7638690B2 (ja) 2025-03-04
JP2022092661A (ja) 2022-06-23
EP4013197B1 (en) 2023-07-12
CN114630537A (zh) 2022-06-14
KR102606997B1 (ko) 2023-11-29
US11792949B2 (en) 2023-10-17
US20220192043A1 (en) 2022-06-16
KR20220083566A (ko) 2022-06-20
CN114630537B (zh) 2024-04-30
EP4013197A1 (en) 2022-06-15

Similar Documents

Publication Publication Date Title
TWI781782B (zh) 裝置以及裝置之製造方法
TWI680575B (zh) 可撓式顯示裝置及其製造方法
TWI615952B (zh) 顯示裝置及其製造方法
CN107765921A (zh) 柔性基板及柔性基板制作方法
JP5849091B2 (ja) 大面積可撓性ｏｌｅｄ光源
KR20010041993A (ko) 용접 밀봉된 전지들을 위한 패키징 물질
JP7638767B2 (ja) デバイス
US20220310946A1 (en) Flexible base substrate, display panel and display device
KR20160066369A (ko) 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법
EP4081003B1 (en) Device comprising a circuit member sealed by a film
KR101980231B1 (ko) 박막봉지를 구비한 평판 표시 장치 및 그 제조방법
JP2014225604A (ja) 樹脂多層基板およびその製造方法
JP7822186B2 (ja) デバイス
JP7591886B2 (ja) デバイス
JP2003205975A (ja) 空気封入緩衝材
TWI774184B (zh) 可薄型化半導體裝置及其製造方法
CN114079020A (zh) 显示屏及其封装方法、终端
US20250278004A1 (en) Electric paper display panel
TWI805492B (zh) 發光屏幕組、發光屏幕及其製作方法
JPWO2013051230A1 (ja) 有機ｅｌ素子及びその製造方法
JP2023113372A (ja) デバイス
JPS63183423A (ja) 液晶表示装置
JP2000292800A (ja) 液晶表示フィルムの製造方法、およびその液晶表示フィルム

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent