JPWO2023042743A5 - - Google Patents
Info
- Publication number
- JPWO2023042743A5 JPWO2023042743A5 JP2023548438A JP2023548438A JPWO2023042743A5 JP WO2023042743 A5 JPWO2023042743 A5 JP WO2023042743A5 JP 2023548438 A JP2023548438 A JP 2023548438A JP 2023548438 A JP2023548438 A JP 2023548438A JP WO2023042743 A5 JPWO2023042743 A5 JP WO2023042743A5
- Authority
- JP
- Japan
- Prior art keywords
- hot
- sheet
- film
- curable organopolysiloxane
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021149269 | 2021-09-14 | ||
| PCT/JP2022/033707 WO2023042743A1 (ja) | 2021-09-14 | 2022-09-08 | ホットメルト型硬化性オルガノポリシロキサン組成物、該組成物の硬化生成物、および該組成物からなるフィルム等の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023042743A1 JPWO2023042743A1 (cg-RX-API-DMAC7.html) | 2023-03-23 |
| JPWO2023042743A5 true JPWO2023042743A5 (cg-RX-API-DMAC7.html) | 2025-09-10 |
Family
ID=85602832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023548438A Pending JPWO2023042743A1 (cg-RX-API-DMAC7.html) | 2021-09-14 | 2022-09-08 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240376347A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JPWO2023042743A1 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20240055833A (cg-RX-API-DMAC7.html) |
| CN (1) | CN117940471A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2023042743A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102912134B1 (ko) * | 2022-09-21 | 2026-01-14 | 다우 실리콘즈 코포레이션 | Uv 경화성 수지-선형 폴리실록산 핫멜트 조성물 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0726085B2 (ja) * | 1988-09-21 | 1995-03-22 | 信越化学工業株式会社 | シリコーン系感圧接着剤組成物 |
| JP2005053966A (ja) * | 2003-08-05 | 2005-03-03 | Shin Etsu Chem Co Ltd | 熱硬化性オルガノポリシロキサン組成物および接着剤 |
| KR102370815B1 (ko) | 2014-06-20 | 2022-03-08 | 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 | 핫 멜트성 실리콘 및 경화성 핫 멜트 조성물 |
| JP6586555B2 (ja) * | 2014-12-26 | 2019-10-09 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、それからなる半導体用封止剤および半導体装置 |
| US10604653B2 (en) | 2015-10-19 | 2020-03-31 | Dow Toray Co., Ltd. | Active energy ray curable hot melt silicone composition, cured product thereof, and method of producing film |
| US20210246337A1 (en) * | 2018-06-29 | 2021-08-12 | Dow Silicones Corporation | Solventless silicone pressure sensitive adhesive and methods for making and using same |
| JP7424733B2 (ja) * | 2019-09-14 | 2024-01-30 | ダウ・東レ株式会社 | ホットメルト性を有する硬化性シリコーンシートの製造方法 |
| KR102841521B1 (ko) * | 2019-12-20 | 2025-08-04 | 맥셀 주식회사 | 다이싱용 점착 테이프 및 반도체칩의 제조 방법 |
| JP7450388B2 (ja) * | 2019-12-27 | 2024-03-15 | ダウ・東レ株式会社 | 電子装置用基板の封止方法及び封止された電子装置用基板 |
| KR102458788B1 (ko) | 2020-04-24 | 2022-10-26 | 주식회사 케이씨씨 | 미서기창 구조 |
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2022
- 2022-09-08 US US18/691,858 patent/US20240376347A1/en active Pending
- 2022-09-08 JP JP2023548438A patent/JPWO2023042743A1/ja active Pending
- 2022-09-08 KR KR1020247011798A patent/KR20240055833A/ko active Pending
- 2022-09-08 WO PCT/JP2022/033707 patent/WO2023042743A1/ja not_active Ceased
- 2022-09-08 CN CN202280061375.1A patent/CN117940471A/zh active Pending