WO2023042743A1 - ホットメルト型硬化性オルガノポリシロキサン組成物、該組成物の硬化生成物、および該組成物からなるフィルム等の製造方法 - Google Patents
ホットメルト型硬化性オルガノポリシロキサン組成物、該組成物の硬化生成物、および該組成物からなるフィルム等の製造方法 Download PDFInfo
- Publication number
- WO2023042743A1 WO2023042743A1 PCT/JP2022/033707 JP2022033707W WO2023042743A1 WO 2023042743 A1 WO2023042743 A1 WO 2023042743A1 JP 2022033707 W JP2022033707 W JP 2022033707W WO 2023042743 A1 WO2023042743 A1 WO 2023042743A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- composition
- group
- hot
- component
- mass
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 224
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 158
- 239000012943 hotmelt Substances 0.000 title claims abstract description 89
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 41
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 27
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 12
- -1 siloxane unit Chemical group 0.000 claims description 84
- 238000001723 curing Methods 0.000 claims description 50
- 239000004065 semiconductor Substances 0.000 claims description 35
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 30
- 125000000962 organic group Chemical group 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 23
- 125000004432 carbon atom Chemical group C* 0.000 claims description 22
- 150000001875 compounds Chemical class 0.000 claims description 22
- 238000006243 chemical reaction Methods 0.000 claims description 21
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 20
- 229920002554 vinyl polymer Polymers 0.000 claims description 20
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 19
- 239000000178 monomer Substances 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 19
- 125000000524 functional group Chemical group 0.000 claims description 17
- 230000003287 optical effect Effects 0.000 claims description 17
- 239000003795 chemical substances by application Substances 0.000 claims description 16
- 239000003960 organic solvent Substances 0.000 claims description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 12
- 239000003505 polymerization initiator Substances 0.000 claims description 11
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 8
- 238000010526 radical polymerization reaction Methods 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
- 238000000016 photochemical curing Methods 0.000 claims description 6
- 238000013007 heat curing Methods 0.000 claims description 5
- 239000006185 dispersion Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000002243 precursor Substances 0.000 claims description 3
- 125000005842 heteroatom Chemical group 0.000 claims description 2
- 230000000977 initiatory effect Effects 0.000 claims 1
- 239000007787 solid Substances 0.000 abstract description 15
- 238000004383 yellowing Methods 0.000 abstract description 6
- 238000013461 design Methods 0.000 abstract description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 69
- 239000000853 adhesive Substances 0.000 description 32
- 230000001070 adhesive effect Effects 0.000 description 32
- 239000010410 layer Substances 0.000 description 28
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 24
- 125000000217 alkyl group Chemical group 0.000 description 12
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 12
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 12
- 230000008569 process Effects 0.000 description 12
- 239000002904 solvent Substances 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 9
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 9
- 229910052909 inorganic silicate Inorganic materials 0.000 description 9
- 239000000565 sealant Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- 150000003254 radicals Chemical class 0.000 description 8
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 7
- 125000005370 alkoxysilyl group Chemical group 0.000 description 7
- 239000002585 base Substances 0.000 description 7
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 7
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 6
- 125000003710 aryl alkyl group Chemical group 0.000 description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 description 6
- 238000005227 gel permeation chromatography Methods 0.000 description 6
- 239000003999 initiator Substances 0.000 description 6
- 229920001223 polyethylene glycol Polymers 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 239000002202 Polyethylene glycol Substances 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 5
- 239000007983 Tris buffer Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 238000011049 filling Methods 0.000 description 5
- 125000006038 hexenyl group Chemical group 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000003504 photosensitizing agent Substances 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 4
- 239000003085 diluting agent Substances 0.000 description 4
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 4
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 150000002894 organic compounds Chemical class 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 125000003396 thiol group Chemical group [H]S* 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 229920001400 block copolymer Polymers 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
- 239000002612 dispersion medium Substances 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 238000006459 hydrosilylation reaction Methods 0.000 description 3
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 125000005641 methacryl group Chemical group 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- 125000003944 tolyl group Chemical group 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 125000005023 xylyl group Chemical group 0.000 description 3
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 2
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 2
- VDYWHVQKENANGY-UHFFFAOYSA-N 1,3-Butyleneglycol dimethacrylate Chemical compound CC(=C)C(=O)OC(C)CCOC(=O)C(C)=C VDYWHVQKENANGY-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 2
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 2
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- LRRQSCPPOIUNGX-UHFFFAOYSA-N 2-hydroxy-1,2-bis(4-methoxyphenyl)ethanone Chemical compound C1=CC(OC)=CC=C1C(O)C(=O)C1=CC=C(OC)C=C1 LRRQSCPPOIUNGX-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 125000003358 C2-C20 alkenyl group Chemical group 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- ZEDSKTISNTXEQI-UHFFFAOYSA-N [(2,6-dichlorobenzoyl)-(4-propylphenyl)phosphoryl]-(2,6-dichlorophenyl)methanone Chemical compound C1=CC(CCC)=CC=C1P(=O)(C(=O)C=1C(=CC=CC=1Cl)Cl)C(=O)C1=C(Cl)C=CC=C1Cl ZEDSKTISNTXEQI-UHFFFAOYSA-N 0.000 description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 2
- 239000007809 chemical reaction catalyst Substances 0.000 description 2
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 2
- 239000000306 component Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000012933 diacyl peroxide Substances 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000002075 main ingredient Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- ZCYXXKJEDCHMGH-UHFFFAOYSA-N nonane Chemical compound CCCC[CH]CCCC ZCYXXKJEDCHMGH-UHFFFAOYSA-N 0.000 description 2
- BKIMMITUMNQMOS-UHFFFAOYSA-N normal nonane Natural products CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 125000005504 styryl group Chemical group 0.000 description 2
- 125000004434 sulfur atom Chemical group 0.000 description 2
- 150000003573 thiols Chemical class 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- JLLAWIKMLAQZCZ-UHFFFAOYSA-N (2,6-dichlorophenyl)-diphenylphosphorylmethanone Chemical compound ClC1=CC=CC(Cl)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 JLLAWIKMLAQZCZ-UHFFFAOYSA-N 0.000 description 1
- SUEDCWGEKSLKOM-UHFFFAOYSA-N (2,6-dimethoxyphenyl)-diphenylphosphorylmethanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 SUEDCWGEKSLKOM-UHFFFAOYSA-N 0.000 description 1
- HGXJDMCMYLEZMJ-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOOC(=O)C(C)(C)C HGXJDMCMYLEZMJ-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- MGFZNUUZUVWOTG-UHFFFAOYSA-N (3-amino-3-oxoprop-1-en-2-yl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(=C)C(N)=O MGFZNUUZUVWOTG-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- ZXHDKGCWOIPNKR-UHFFFAOYSA-N (4-methoxy-2,3-dimethylphenyl)-phenylmethanone Chemical compound CC1=C(C)C(OC)=CC=C1C(=O)C1=CC=CC=C1 ZXHDKGCWOIPNKR-UHFFFAOYSA-N 0.000 description 1
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 1
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical class [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- UBRWPVTUQDJKCC-UHFFFAOYSA-N 1,3-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC(C(C)(C)OOC(C)(C)C)=C1 UBRWPVTUQDJKCC-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- UKDKWYQGLUUPBF-UHFFFAOYSA-N 1-ethenoxyhexadecane Chemical group CCCCCCCCCCCCCCCCOC=C UKDKWYQGLUUPBF-UHFFFAOYSA-N 0.000 description 1
- SDXHBDVTZNMBEW-UHFFFAOYSA-N 1-ethoxy-2-(2-hydroxyethoxy)ethanol Chemical compound CCOC(O)COCCO SDXHBDVTZNMBEW-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- HYQASEVIBPSPMK-UHFFFAOYSA-N 12-(2-methylprop-2-enoyloxy)dodecyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCCCCOC(=O)C(C)=C HYQASEVIBPSPMK-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- OXBLVCZKDOZZOJ-UHFFFAOYSA-N 2,3-Dihydrothiophene Chemical compound C1CC=CS1 OXBLVCZKDOZZOJ-UHFFFAOYSA-N 0.000 description 1
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 description 1
- CRJIYMRJTJWVLU-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yl 3-(5,5-dimethylhexyl)dioxirane-3-carboxylate Chemical compound CC(C)(C)CCCCC1(C(=O)OC(C)(C)CC(C)(C)C)OO1 CRJIYMRJTJWVLU-UHFFFAOYSA-N 0.000 description 1
- DPGYCJUCJYUHTM-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yloxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)CC(C)(C)C DPGYCJUCJYUHTM-UHFFFAOYSA-N 0.000 description 1
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
- UXCIJKOCUAQMKD-UHFFFAOYSA-N 2,4-dichlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC(Cl)=C3SC2=C1 UXCIJKOCUAQMKD-UHFFFAOYSA-N 0.000 description 1
- LZHUBCULTHIFNO-UHFFFAOYSA-N 2,4-dihydroxy-1,5-bis[4-(2-hydroxyethoxy)phenyl]-2,4-dimethylpentan-3-one Chemical compound C=1C=C(OCCO)C=CC=1CC(C)(O)C(=O)C(O)(C)CC1=CC=C(OCCO)C=C1 LZHUBCULTHIFNO-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- KJSGODDTWRXQRH-UHFFFAOYSA-N 2-(dimethylamino)ethyl benzoate Chemical compound CN(C)CCOC(=O)C1=CC=CC=C1 KJSGODDTWRXQRH-UHFFFAOYSA-N 0.000 description 1
- PYKCEDJHRUUDRK-UHFFFAOYSA-N 2-(tert-butyldiazenyl)-2-methylpropanenitrile Chemical compound CC(C)(C)N=NC(C)(C)C#N PYKCEDJHRUUDRK-UHFFFAOYSA-N 0.000 description 1
- XOGPDSATLSAZEK-UHFFFAOYSA-N 2-Aminoanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(N)=CC=C3C(=O)C2=C1 XOGPDSATLSAZEK-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- LDQYWNUWKVADJV-UHFFFAOYSA-N 2-[(1-amino-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanamide;dihydrate Chemical compound O.O.NC(=O)C(C)(C)N=NC(C)(C)C(N)=O LDQYWNUWKVADJV-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- NKMOLEYVYVWWJC-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis[2-(3-sulfanylbutanoyloxy)ethyl]-1,3,5-triazinan-1-yl]ethyl 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCCN1C(=O)N(CCOC(=O)CC(C)S)C(=O)N(CCOC(=O)CC(C)S)C1=O NKMOLEYVYVWWJC-UHFFFAOYSA-N 0.000 description 1
- UTJOKVDTJFBVPH-UHFFFAOYSA-N 2-[diethoxy(methyl)silyl]ethyl-[2-[diethoxy(methyl)silyl]ethyl-dimethylsilyl]oxy-dimethylsilane Chemical compound CCO[Si](C)(OCC)CC[Si](C)(C)O[Si](C)(C)CC[Si](C)(OCC)OCC UTJOKVDTJFBVPH-UHFFFAOYSA-N 0.000 description 1
- HITBDIPWYKTHIH-UHFFFAOYSA-N 2-[diethoxy(methyl)silyl]ethyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(OCC)CC[Si](C)(OCC)OCC HITBDIPWYKTHIH-UHFFFAOYSA-N 0.000 description 1
- XOPJGCDHBHSJFK-UHFFFAOYSA-N 2-[dimethoxy(methyl)silyl]ethyl-[2-[dimethoxy(methyl)silyl]ethyl-dimethylsilyl]oxy-dimethylsilane Chemical compound CO[Si](C)(OC)CC[Si](C)(C)O[Si](C)(C)CC[Si](C)(OC)OC XOPJGCDHBHSJFK-UHFFFAOYSA-N 0.000 description 1
- KFGSXJLKKLOVNP-UHFFFAOYSA-N 2-[dimethoxy(methyl)silyl]ethyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CC[Si](C)(OC)OC KFGSXJLKKLOVNP-UHFFFAOYSA-N 0.000 description 1
- FGTYTUFKXYPTML-UHFFFAOYSA-N 2-benzoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 FGTYTUFKXYPTML-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- WDIXVQTZULGQNI-UHFFFAOYSA-N 2-ethyl-2-(2-methylbutan-2-ylperoxy)hexanoic acid Chemical compound CCCCC(CC)(C(O)=O)OOC(C)(C)CC WDIXVQTZULGQNI-UHFFFAOYSA-N 0.000 description 1
- WBEKRAXYEBAHQF-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;3-sulfanylbutanoic acid Chemical compound CC(S)CC(O)=O.CC(S)CC(O)=O.CC(S)CC(O)=O.CCC(CO)(CO)CO WBEKRAXYEBAHQF-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- ZACVGCNKGYYQHA-UHFFFAOYSA-N 2-ethylhexoxycarbonyloxy 2-ethylhexyl carbonate Chemical compound CCCCC(CC)COC(=O)OOC(=O)OCC(CC)CCCC ZACVGCNKGYYQHA-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical class OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- WLVPRARCUSRDNI-UHFFFAOYSA-N 2-hydroxy-1-phenyl-1-propanone Chemical compound CC(O)C(=O)C1=CC=CC=C1 WLVPRARCUSRDNI-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- YRNDGUSDBCARGC-UHFFFAOYSA-N 2-methoxyacetophenone Chemical compound COCC(=O)C1=CC=CC=C1 YRNDGUSDBCARGC-UHFFFAOYSA-N 0.000 description 1
- RTEZVHMDMFEURJ-UHFFFAOYSA-N 2-methylpentan-2-yl 2,2-dimethylpropaneperoxoate Chemical compound CCCC(C)(C)OOC(=O)C(C)(C)C RTEZVHMDMFEURJ-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- WXUKWXKGNXTMLW-UHFFFAOYSA-N 2-nitro-9h-fluorene;(phenyldisulfanyl)benzene Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1.C1=CC=C2C3=CC=C([N+](=O)[O-])C=C3CC2=C1 WXUKWXKGNXTMLW-UHFFFAOYSA-N 0.000 description 1
- UMWZLYTVXQBTTE-UHFFFAOYSA-N 2-pentylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(CCCCC)=CC=C3C(=O)C2=C1 UMWZLYTVXQBTTE-UHFFFAOYSA-N 0.000 description 1
- NUIZZJWNNGJSGL-UHFFFAOYSA-N 2-phenylpropan-2-yl 2,2-dimethyloctaneperoxoate Chemical compound CCCCCCC(C)(C)C(=O)OOC(C)(C)c1ccccc1 NUIZZJWNNGJSGL-UHFFFAOYSA-N 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- XYFRHHAYSXIKGH-UHFFFAOYSA-N 3-(5-methoxy-2-methoxycarbonyl-1h-indol-3-yl)prop-2-enoic acid Chemical compound C1=C(OC)C=C2C(C=CC(O)=O)=C(C(=O)OC)NC2=C1 XYFRHHAYSXIKGH-UHFFFAOYSA-N 0.000 description 1
- DSSAWHFZNWVJEC-UHFFFAOYSA-N 3-(ethenoxymethyl)heptane Chemical compound CCCCC(CC)COC=C DSSAWHFZNWVJEC-UHFFFAOYSA-N 0.000 description 1
- XTMHZQHIQLSLMK-UHFFFAOYSA-N 3-[dimethylsilyloxy(dimethyl)silyl]propyl 2-methylprop-2-enoate Chemical compound C[SiH](C)O[Si](C)(C)CCCOC(=O)C(C)=C XTMHZQHIQLSLMK-UHFFFAOYSA-N 0.000 description 1
- CARSMBZECAABMO-UHFFFAOYSA-N 3-chloro-2,6-dimethylbenzoic acid Chemical compound CC1=CC=C(Cl)C(C)=C1C(O)=O CARSMBZECAABMO-UHFFFAOYSA-N 0.000 description 1
- YAXXOCZAXKLLCV-UHFFFAOYSA-N 3-dodecyloxolane-2,5-dione Chemical compound CCCCCCCCCCCCC1CC(=O)OC1=O YAXXOCZAXKLLCV-UHFFFAOYSA-N 0.000 description 1
- VFXXTYGQYWRHJP-UHFFFAOYSA-N 4,4'-azobis(4-cyanopentanoic acid) Chemical compound OC(=O)CCC(C)(C#N)N=NC(C)(CCC(O)=O)C#N VFXXTYGQYWRHJP-UHFFFAOYSA-N 0.000 description 1
- XBRVPWBNRAPVCC-UHFFFAOYSA-N 4,6,11-trioxa-1-aza-5$l^{3}-silabicyclo[3.3.3]undecane Chemical class C1CO[Si]2OCCN1CCO2 XBRVPWBNRAPVCC-UHFFFAOYSA-N 0.000 description 1
- LABQKWYHWCYABU-UHFFFAOYSA-N 4-(3-sulfanylbutanoyloxy)butyl 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCCCCOC(=O)CC(C)S LABQKWYHWCYABU-UHFFFAOYSA-N 0.000 description 1
- NBTPLJIGKXRDCD-UHFFFAOYSA-N 4-[diethoxy(methyl)silyl]butyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(OCC)CCCC[Si](C)(OCC)OCC NBTPLJIGKXRDCD-UHFFFAOYSA-N 0.000 description 1
- SWIWVYUDWDVRPX-UHFFFAOYSA-N 4-[dimethoxy(methyl)silyl]butyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCC[Si](C)(OC)OC SWIWVYUDWDVRPX-UHFFFAOYSA-N 0.000 description 1
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical group OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- BVEYJWQCMOVMAR-UHFFFAOYSA-N 5-Hydroxy-4-octanone Chemical compound CCCC(O)C(=O)CCC BVEYJWQCMOVMAR-UHFFFAOYSA-N 0.000 description 1
- QIOCAKLWNDZXKH-UHFFFAOYSA-N 5-[diethoxy(methyl)silyl]pentyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(OCC)CCCCC[Si](C)(OCC)OCC QIOCAKLWNDZXKH-UHFFFAOYSA-N 0.000 description 1
- UBBNKENBCRDMOY-UHFFFAOYSA-N 5-[dimethoxy(methyl)silyl]pentyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCC[Si](C)(OC)OC UBBNKENBCRDMOY-UHFFFAOYSA-N 0.000 description 1
- 125000006043 5-hexenyl group Chemical group 0.000 description 1
- PFGDZDUDTMKJHK-UHFFFAOYSA-N 6-[dimethoxy(methyl)silyl]hexyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCCC[Si](C)(OC)OC PFGDZDUDTMKJHK-UHFFFAOYSA-N 0.000 description 1
- AAOISIQFPPAFQO-UHFFFAOYSA-N 7:0(6Me,6Me) Chemical compound CC(C)(C)CCCCC(O)=O AAOISIQFPPAFQO-UHFFFAOYSA-N 0.000 description 1
- XMJOCRXNMXIMSW-UHFFFAOYSA-N 8-[dimethoxy(methyl)silyl]octyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCCCCC[Si](C)(OC)OC XMJOCRXNMXIMSW-UHFFFAOYSA-N 0.000 description 1
- PQJUJGAVDBINPI-UHFFFAOYSA-N 9H-thioxanthene Chemical compound C1=CC=C2CC3=CC=CC=C3SC2=C1 PQJUJGAVDBINPI-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 238000006596 Alder-ene reaction Methods 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- 229910003849 O-Si Inorganic materials 0.000 description 1
- 229910003872 O—Si Inorganic materials 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910020489 SiO3 Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 241000534944 Thia Species 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- VLMHTHBOGIBJTA-UHFFFAOYSA-N [(2,6-dichlorobenzoyl)-(2,5-dimethylphenyl)phosphanyl]-(2,6-dichlorophenyl)methanone Chemical compound CC1=CC=C(C)C(P(C(=O)C=2C(=CC=CC=2Cl)Cl)C(=O)C=2C(=CC=CC=2Cl)Cl)=C1 VLMHTHBOGIBJTA-UHFFFAOYSA-N 0.000 description 1
- PRRGXULZOZTZDK-UHFFFAOYSA-N [(2,6-dichlorobenzoyl)-(2,5-dimethylphenyl)phosphoryl]-(2,6-dichlorophenyl)methanone Chemical compound CC1=CC=C(C)C(P(=O)(C(=O)C=2C(=CC=CC=2Cl)Cl)C(=O)C=2C(=CC=CC=2Cl)Cl)=C1 PRRGXULZOZTZDK-UHFFFAOYSA-N 0.000 description 1
- DNRISHWSPBDRTH-UHFFFAOYSA-N [(2,6-dichlorobenzoyl)-phenylphosphoryl]-(2,6-dichlorophenyl)methanone Chemical compound ClC1=CC=CC(Cl)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(Cl)C=CC=C1Cl DNRISHWSPBDRTH-UHFFFAOYSA-N 0.000 description 1
- ZTCAGYRXUCWHPV-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,5-dimethylphenyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(C=1C(=CC=C(C)C=1)C)C(=O)C1=C(OC)C=CC=C1OC ZTCAGYRXUCWHPV-UHFFFAOYSA-N 0.000 description 1
- LXEKPEMOWBOYRF-UHFFFAOYSA-N [2-[(1-azaniumyl-1-imino-2-methylpropan-2-yl)diazenyl]-2-methylpropanimidoyl]azanium;dichloride Chemical compound Cl.Cl.NC(=N)C(C)(C)N=NC(C)(C)C(N)=N LXEKPEMOWBOYRF-UHFFFAOYSA-N 0.000 description 1
- LOPVAWVHGAWUPS-UHFFFAOYSA-M [2-hydroxy-3-(2-methylprop-2-enoyloxy)propyl]-trimethylazanium;chloride Chemical compound [Cl-].CC(=C)C(=O)OCC(O)C[N+](C)(C)C LOPVAWVHGAWUPS-UHFFFAOYSA-M 0.000 description 1
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 1
- AEHGADJCYDXLCC-UHFFFAOYSA-N [3-tert-butyl-2-(3-tert-butyl-4,4-dimethyl-2-phenylpentan-2-yl)peroxy-4,4-dimethylpentan-2-yl]benzene Chemical compound C=1C=CC=CC=1C(C)(C(C(C)(C)C)C(C)(C)C)OOC(C)(C(C(C)(C)C)C(C)(C)C)C1=CC=CC=C1 AEHGADJCYDXLCC-UHFFFAOYSA-N 0.000 description 1
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 1
- JQCCEDUTYZNWDO-UHFFFAOYSA-N [dimethyl(2-triethoxysilylethyl)silyl]oxy-dimethyl-(2-triethoxysilylethyl)silane Chemical compound CCO[Si](OCC)(OCC)CC[Si](C)(C)O[Si](C)(C)CC[Si](OCC)(OCC)OCC JQCCEDUTYZNWDO-UHFFFAOYSA-N 0.000 description 1
- HEQDCEOZBRONNB-UHFFFAOYSA-N [dimethyl(2-trimethoxysilylethyl)silyl]oxy-dimethyl-(2-trimethoxysilylethyl)silane Chemical compound CO[Si](OC)(OC)CC[Si](C)(C)O[Si](C)(C)CC[Si](OC)(OC)OC HEQDCEOZBRONNB-UHFFFAOYSA-N 0.000 description 1
- PPGFUNOEXFJQKD-UHFFFAOYSA-N [dimethyl(6-triethoxysilylhexyl)silyl]oxy-dimethyl-(6-triethoxysilylhexyl)silane Chemical compound C(C)O[Si](CCCCCC[Si](O[Si](C)(C)CCCCCC[Si](OCC)(OCC)OCC)(C)C)(OCC)OCC PPGFUNOEXFJQKD-UHFFFAOYSA-N 0.000 description 1
- XGLHFMKUHVPRNK-UHFFFAOYSA-N [dimethyl(6-trimethoxysilylhexyl)silyl]oxy-dimethyl-(6-trimethoxysilylhexyl)silane Chemical compound CO[Si](CCCCCC[Si](O[Si](C)(C)CCCCCC[Si](OC)(OC)OC)(C)C)(OC)OC XGLHFMKUHVPRNK-UHFFFAOYSA-N 0.000 description 1
- ZFJFYUXFKXTXGT-UHFFFAOYSA-N [dimethyl(methylsilyloxy)silyl]oxy-[dimethyl(trimethylsilyloxy)silyl]oxy-dimethylsilane Chemical compound C[SiH2]O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C ZFJFYUXFKXTXGT-UHFFFAOYSA-N 0.000 description 1
- NRTJGTSOTDBPDE-UHFFFAOYSA-N [dimethyl(methylsilyloxy)silyl]oxy-dimethyl-trimethylsilyloxysilane Chemical compound C[SiH2]O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C NRTJGTSOTDBPDE-UHFFFAOYSA-N 0.000 description 1
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 150000001454 anthracenes Chemical class 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 150000001558 benzoic acid derivatives Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- WPKWPKDNOPEODE-UHFFFAOYSA-N bis(2,4,4-trimethylpentan-2-yl)diazene Chemical compound CC(C)(C)CC(C)(C)N=NC(C)(C)CC(C)(C)C WPKWPKDNOPEODE-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- YYYYODAPGRLAHC-UHFFFAOYSA-N bis[[dimethyl(2-trimethoxysilylethyl)silyl]oxy]-methyl-(2-trimethoxysilylethyl)silane Chemical group CO[Si](CC[Si](C)(C)O[Si](C)(CC[Si](OC)(OC)OC)O[Si](C)(C)CC[Si](OC)(OC)OC)(OC)OC YYYYODAPGRLAHC-UHFFFAOYSA-N 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 125000000332 coumarinyl group Chemical class O1C(=O)C(=CC2=CC=CC=C12)* 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical compound CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 1
- XJOBOFWTZOKMOH-UHFFFAOYSA-N decanoyl decaneperoxoate Chemical compound CCCCCCCCCC(=O)OOC(=O)CCCCCCCCC XJOBOFWTZOKMOH-UHFFFAOYSA-N 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229940057404 di-(4-tert-butylcyclohexyl)peroxydicarbonate Drugs 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- JBSLOWBPDRZSMB-BQYQJAHWSA-N dibutyl (e)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C\C(=O)OCCCC JBSLOWBPDRZSMB-BQYQJAHWSA-N 0.000 description 1
- 125000001664 diethylamino group Chemical group [H]C([H])([H])C([H])([H])N(*)C([H])([H])C([H])([H])[H] 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 1
- HZWAUDKTZOUQPD-UHFFFAOYSA-N diphenylphosphoryl-(2-methylphenyl)methanone Chemical compound CC1=CC=CC=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 HZWAUDKTZOUQPD-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- YCWQBZCTYWZZAX-UHFFFAOYSA-N ditert-butyl 7,8-dioxabicyclo[4.2.0]octane-3,6-dicarboxylate Chemical compound C1C(C(=O)OC(C)(C)C)CCC2(C(=O)OC(C)(C)C)OOC21 YCWQBZCTYWZZAX-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- IGBZOHMCHDADGY-UHFFFAOYSA-N ethenyl 2-ethylhexanoate Chemical compound CCCCC(CC)C(=O)OC=C IGBZOHMCHDADGY-UHFFFAOYSA-N 0.000 description 1
- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
- GLVVKKSPKXTQRB-UHFFFAOYSA-N ethenyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OC=C GLVVKKSPKXTQRB-UHFFFAOYSA-N 0.000 description 1
- LZWYWAIOTBEZFN-UHFFFAOYSA-N ethenyl hexanoate Chemical compound CCCCCC(=O)OC=C LZWYWAIOTBEZFN-UHFFFAOYSA-N 0.000 description 1
- AFSIMBWBBOJPJG-UHFFFAOYSA-N ethenyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC=C AFSIMBWBBOJPJG-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- SSTAXLJQSRFHMB-UHFFFAOYSA-N ethyl 1,4-dimethylcyclohexa-2,4-diene-1-carboxylate Chemical compound CCOC(=O)C1(C)CC=C(C)C=C1 SSTAXLJQSRFHMB-UHFFFAOYSA-N 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- QWVBGCWRHHXMRM-UHFFFAOYSA-N hexadecoxycarbonyloxy hexadecyl carbonate Chemical compound CCCCCCCCCCCCCCCCOC(=O)OOC(=O)OCCCCCCCCCCCCCCCC QWVBGCWRHHXMRM-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- DZVCFNFOPIZQKX-LTHRDKTGSA-M merocyanine Chemical class [Na+].O=C1N(CCCC)C(=O)N(CCCC)C(=O)C1=C\C=C\C=C/1N(CCCS([O-])(=O)=O)C2=CC=CC=C2O\1 DZVCFNFOPIZQKX-LTHRDKTGSA-M 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- GEJHIUFJTCYNSC-UHFFFAOYSA-N methyl 1-[(1-methoxycarbonylcyclohexyl)diazenyl]cyclohexane-1-carboxylate Chemical compound C1CCCCC1(C(=O)OC)N=NC1(C(=O)OC)CCCCC1 GEJHIUFJTCYNSC-UHFFFAOYSA-N 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- DASJFYAPNPUBGG-UHFFFAOYSA-N naphthalene-1-sulfonyl chloride Chemical compound C1=CC=C2C(S(=O)(=O)Cl)=CC=CC2=C1 DASJFYAPNPUBGG-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- GNWXVOQHLPBSSR-UHFFFAOYSA-N oxolane;toluene Chemical compound C1CCOC1.CC1=CC=CC=C1 GNWXVOQHLPBSSR-UHFFFAOYSA-N 0.000 description 1
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000004978 peroxycarbonates Chemical class 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- 125000001484 phenothiazinyl group Chemical class C1(=CC=CC=2SC3=CC=CC=C3NC12)* 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- SYJCUYXTMQSJLM-UHFFFAOYSA-N phenylphosphanyl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)PC1=CC=CC=C1 SYJCUYXTMQSJLM-UHFFFAOYSA-N 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 150000004032 porphyrins Chemical class 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- RGBXDEHYFWDBKD-UHFFFAOYSA-N propan-2-yl propan-2-yloxy carbonate Chemical compound CC(C)OOC(=O)OC(C)C RGBXDEHYFWDBKD-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- WVIICGIFSIBFOG-UHFFFAOYSA-N pyrylium Chemical compound C1=CC=[O+]C=C1 WVIICGIFSIBFOG-UHFFFAOYSA-N 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- WYKYCHHWIJXDAO-UHFFFAOYSA-N tert-butyl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)C WYKYCHHWIJXDAO-UHFFFAOYSA-N 0.000 description 1
- PFBLRDXPNUJYJM-UHFFFAOYSA-N tert-butyl 2-methylpropaneperoxoate Chemical compound CC(C)C(=O)OOC(C)(C)C PFBLRDXPNUJYJM-UHFFFAOYSA-N 0.000 description 1
- VNJISVYSDHJQFR-UHFFFAOYSA-N tert-butyl 4,4-dimethylpentaneperoxoate Chemical compound CC(C)(C)CCC(=O)OOC(C)(C)C VNJISVYSDHJQFR-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical group 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- CSKKAINPUYTTRW-UHFFFAOYSA-N tetradecoxycarbonyloxy tetradecyl carbonate Chemical compound CCCCCCCCCCCCCCOC(=O)OOC(=O)OCCCCCCCCCCCCCC CSKKAINPUYTTRW-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- IZRJPHXTEXTLHY-UHFFFAOYSA-N triethoxy(2-triethoxysilylethyl)silane Chemical compound CCO[Si](OCC)(OCC)CC[Si](OCC)(OCC)OCC IZRJPHXTEXTLHY-UHFFFAOYSA-N 0.000 description 1
- PQVPWZHUJMEZSA-UHFFFAOYSA-N triethoxy(4-triethoxysilylbutyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCC[Si](OCC)(OCC)OCC PQVPWZHUJMEZSA-UHFFFAOYSA-N 0.000 description 1
- CTFNCWNXTNBVME-UHFFFAOYSA-N triethoxy(5-triethoxysilylpentan-2-yl)silane Chemical compound CCO[Si](OCC)(OCC)CCCC(C)[Si](OCC)(OCC)OCC CTFNCWNXTNBVME-UHFFFAOYSA-N 0.000 description 1
- BMSFSODNLPWTPF-UHFFFAOYSA-N triethoxy(5-triethoxysilylpentyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCCC[Si](OCC)(OCC)OCC BMSFSODNLPWTPF-UHFFFAOYSA-N 0.000 description 1
- NRYWFNLVRORSCA-UHFFFAOYSA-N triethoxy(6-triethoxysilylhexyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCCCC[Si](OCC)(OCC)OCC NRYWFNLVRORSCA-UHFFFAOYSA-N 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- JFFBPULXPLWPAA-UHFFFAOYSA-N trimethoxy(10-trimethoxysilyldecyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCCCCC[Si](OC)(OC)OC JFFBPULXPLWPAA-UHFFFAOYSA-N 0.000 description 1
- JCGDCINCKDQXDX-UHFFFAOYSA-N trimethoxy(2-trimethoxysilylethyl)silane Chemical compound CO[Si](OC)(OC)CC[Si](OC)(OC)OC JCGDCINCKDQXDX-UHFFFAOYSA-N 0.000 description 1
- LQASLKRKZDJCBO-UHFFFAOYSA-N trimethoxy(3-trimethoxysilylpropyl)silane Chemical compound CO[Si](OC)(OC)CCC[Si](OC)(OC)OC LQASLKRKZDJCBO-UHFFFAOYSA-N 0.000 description 1
- OTRIBZPALGOVNZ-UHFFFAOYSA-N trimethoxy(4-trimethoxysilylbutyl)silane Chemical compound CO[Si](OC)(OC)CCCC[Si](OC)(OC)OC OTRIBZPALGOVNZ-UHFFFAOYSA-N 0.000 description 1
- SIWWUMIYHBHZEU-UHFFFAOYSA-N trimethoxy(5-trimethoxysilylheptan-2-yl)silane Chemical compound CO[Si](OC)(OC)C(CC)CCC(C)[Si](OC)(OC)OC SIWWUMIYHBHZEU-UHFFFAOYSA-N 0.000 description 1
- OXQUKGVMOJFCGS-UHFFFAOYSA-N trimethoxy(5-trimethoxysilylhexan-2-yl)silane Chemical compound CO[Si](OC)(OC)C(C)CCC(C)[Si](OC)(OC)OC OXQUKGVMOJFCGS-UHFFFAOYSA-N 0.000 description 1
- QFBFYIBBIGTUNJ-UHFFFAOYSA-N trimethoxy(5-trimethoxysilyloctan-2-yl)silane Chemical compound CCCC([Si](OC)(OC)OC)CCC(C)[Si](OC)(OC)OC QFBFYIBBIGTUNJ-UHFFFAOYSA-N 0.000 description 1
- SSGNPAVXPKHOKS-UHFFFAOYSA-N trimethoxy(5-trimethoxysilylpentan-2-yl)silane Chemical compound CO[Si](OC)(OC)CCCC(C)[Si](OC)(OC)OC SSGNPAVXPKHOKS-UHFFFAOYSA-N 0.000 description 1
- MAFPECYMNWKRHR-UHFFFAOYSA-N trimethoxy(5-trimethoxysilylpentyl)silane Chemical compound CO[Si](OC)(OC)CCCCC[Si](OC)(OC)OC MAFPECYMNWKRHR-UHFFFAOYSA-N 0.000 description 1
- PRAIIRKDOKYQQY-UHFFFAOYSA-N trimethoxy(6-trimethoxysilylheptan-2-yl)silane Chemical compound CO[Si](OC)(OC)C(C)CCCC(C)[Si](OC)(OC)OC PRAIIRKDOKYQQY-UHFFFAOYSA-N 0.000 description 1
- ODWVKKAQQWZKHG-UHFFFAOYSA-N trimethoxy(6-trimethoxysilylhexan-2-yl)silane Chemical compound CO[Si](OC)(OC)CCCCC(C)[Si](OC)(OC)OC ODWVKKAQQWZKHG-UHFFFAOYSA-N 0.000 description 1
- BHXFSPFDYQBPQY-UHFFFAOYSA-N trimethoxy(6-trimethoxysilylhexan-3-yl)silane Chemical compound CO[Si](OC)(OC)C(CC)CCC[Si](OC)(OC)OC BHXFSPFDYQBPQY-UHFFFAOYSA-N 0.000 description 1
- GFKCWAROGHMSTC-UHFFFAOYSA-N trimethoxy(6-trimethoxysilylhexyl)silane Chemical compound CO[Si](OC)(OC)CCCCCC[Si](OC)(OC)OC GFKCWAROGHMSTC-UHFFFAOYSA-N 0.000 description 1
- BMQGQVPUOLXPKP-UHFFFAOYSA-N trimethoxy(7-trimethoxysilylheptyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCC[Si](OC)(OC)OC BMQGQVPUOLXPKP-UHFFFAOYSA-N 0.000 description 1
- XXZYMMVFLZFHBD-UHFFFAOYSA-N trimethoxy(7-trimethoxysilylnonan-2-yl)silane Chemical compound CO[Si](OC)(OC)C(CC)CCCCC(C)[Si](OC)(OC)OC XXZYMMVFLZFHBD-UHFFFAOYSA-N 0.000 description 1
- UPQNGNQELOQBLG-UHFFFAOYSA-N trimethoxy(7-trimethoxysilyloctan-2-yl)silane Chemical compound CO[Si](OC)(OC)C(C)CCCCC(C)[Si](OC)(OC)OC UPQNGNQELOQBLG-UHFFFAOYSA-N 0.000 description 1
- SHCGUUKICQTMGF-UHFFFAOYSA-N trimethoxy(8-trimethoxysilyloctyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCCC[Si](OC)(OC)OC SHCGUUKICQTMGF-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 1
- ZQTYRTSKQFQYPQ-UHFFFAOYSA-N trisiloxane Chemical class [SiH3]O[SiH2]O[SiH3] ZQTYRTSKQFQYPQ-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000000341 volatile oil Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/12—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/148—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Definitions
- the present invention relates to a hot-melt curable organopolysiloxane composition, and techniques for encapsulating and bonding semiconductors and the like using the composition.
- Curable silicone compositions are used in a wide range of industrial fields because they cure to form cured products with excellent heat resistance, cold resistance, electrical insulation, weather resistance, water repellency, and transparency.
- a cured product of such a curable silicone composition is more resistant to discoloration than other organic materials, and exhibits less deterioration in physical properties, making it suitable as a sealant for optical materials and semiconductor devices.
- Patent Literature 1 discloses a curable hot-melt composition which is based on an alkenyl group-containing organopolysiloxane having a high phenyl group content and is cured by a hydrosilylation reaction.
- the curing agent disclosed in Patent Document 1 is a hydrosilylation reaction catalyst involved in a heat curing reaction that requires a high temperature exceeding 150°C.
- Patent Document 2 an active energy ray-curable hot-melt silicone composition that uses a thiol-ene reaction.
- the animal composition is excellent in that it can be cured quickly even at room temperature (low temperature), but the cured product has low yellowing resistance, making it difficult to apply in applications where transparency is required. There is also room for improvement in adhesive strength.
- the object of the present invention is to enable curing in a wide range of temperatures from low to high depending on the sealing and bonding processes and the heat resistance of the resin member, and in particular, to achieve good curability even at low temperatures such as room temperature. It is possible to design the adhesion and adhesive strength of the resulting cured product to the substrate in a wide range, and it has excellent physical strength such as durability, transparency, and handling workability such as overmolding. To provide a hot-melt type silicone composition which is excellent in heat resistance and its use.
- the component (C) when at least part of the component (C) is a photoradical polymerization initiator (C1), it has photocurability by irradiation with high-energy rays, so that it has good curability at room temperature. organic polysiloxane compositions can be realized.
- the above problems can be suitably solved by the hot-melt curable organopolysiloxane composition molded into a sheet or film, a peelable laminate containing the same, and a method for producing the same.
- the above-mentioned problems are a cured product obtained by curing the hot-melt curable organopolysiloxane composition according to the present invention, a semiconductor device or an optical semiconductor device having the cured product, and encapsulation or The adhesion method is preferably solved.
- the hot-melt type curable organopolysiloxane composition of the present invention has good hot-melt properties, and depending on the sealing process and the heat resistance of the resin member, it can be cured by heating at high temperatures and/or by high-energy rays such as ultraviolet rays. By irradiation, it is possible to cure in a wide temperature range from low temperature to high temperature such as room temperature. It can be designed in a wide range of properties and adhesive strength, has excellent physical strength such as durability and transparency, and is excellent in handling workability such as overmolding. / It can be suitably used as an adhesive member such as a sealant for protecting a bonding process or a substrate material, especially a resin substrate having low heat resistance, or an adhesive member such as a substrate.
- such a hot-melt type curable organopolysiloxane composition is in the form of a sheet or film containing no voids and having a thickness of 10 to 1000 ⁇ m, or in combination with the curable silicone composition sheet or film. It can be provided in the form of a release laminate comprising a release sheet or film.
- the sheet or film made of the hot-melt curable organopolysiloxane composition of the present invention, or the peelable laminate containing the same can be used as desired in the manufacturing process of electronic parts such as semiconductor devices. It can be cut to size and used, and can be applied to industrial production processes such as batch sealing and batch bonding to large-area substrates. Irradiation can achieve a good sealing process at low temperatures such as room temperature.
- room temperature refers to the temperature of the environment where the person handling the curable organopolysiloxane composition of the present invention is present. Room temperature generally refers to 0°C to 40°C, especially 15°C to 30°C, especially 18°C to 25°C.
- the hot-melt curable organopolysiloxane composition of the present invention has a complex viscosity of more than 500 Pa s before curing at 25°C, or is solid and has no fluidity, while curing at 80°C. It is preferable that the complex viscosity of the previous composition is 20% or less of the complex viscosity at 25°C (in other words, the rate of change in complex viscosity from 25°C to 80°C is 80% or more).
- the pre-composition have a complex viscosity of 500,000 Pa ⁇ s or less, preferably a melt viscosity within the range of 10 to 300,000 Pa ⁇ s.
- the complex viscosity of the composition before curing at 80° C. is within the above range, the low-temperature fluidity is excellent, so even for a substrate with low heat resistance, the composition can be applied to the sealing site at a relatively low temperature. There is an advantage that objects can be filled or molded.
- the complex viscosity at a certain temperature is measured using a complex viscometer such as Anton Paar's MCR302 at a heating rate of 2°C/min in the range of 25°C to 100°C. Refers to the complex viscosity recorded at temperature.
- the hot-melt curable organopolysiloxane composition of the present invention comprises the above components (A) to (C) and may optionally contain (D) a radical reactive component. From the standpoint of handling workability, (F) an organic solvent may optionally be contained, and a photosensitizer and other additives may be contained within the scope not contrary to the object of the present invention. Each component will be described below.
- Component (A) is a chain polysiloxane molecule having at least two alkenyl groups in the molecule, and is the main ingredient (base polymer) of this composition.
- the alkenyl group of the component (A) organopolysiloxane includes, for example, alkenyl groups having 2 to 10 carbon atoms such as vinyl group, allyl group, butenyl group, pentenyl group, hexenyl group and heptenyl group, particularly vinyl group. or a hexenyl group.
- the bonding position of the alkenyl group of the component (A) includes, for example, the terminal of the molecular chain and/or the side chain of the molecular chain.
- component (A) preferably has an alkenyl group bonded to a silicon atom at a site other than the terminal of the molecular chain, and the alkenyl group is added to the side chain of the molecular chain.
- the use of a linear organopolysiloxane having is one of the preferred embodiments of the present invention.
- the (A) component may contain only a single component, or may be a mixture of two or more different components.
- the organic groups other than alkenyl groups bonded to silicon atoms include, for example, alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl and heptyl groups.
- alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl and heptyl groups.
- aryl groups such as phenyl group, tolyl group, xylyl group and naphthyl group; aralkyl groups such as benzyl group and phenethyl group; halogens such as chloromethyl group, 3-chloropropyl group and 3,3,3-trifluoropropyl group alkyl group, etc., and particularly preferably a methyl group or a phenyl group.
- Component (A) unlike component (B), has a chain polysiloxane molecular structure.
- the component (A) is preferably linear or partially branched linear (branched), and may partially contain a cyclic or three-dimensional network.
- it is a linear or branched diorganopolysiloxane whose main chain consists of repeating diorganosiloxane units and whose molecular chain ends are blocked with triorganosiloxy groups.
- the siloxane units that give the branched organopolysiloxane are the T units or Q units described later.
- the properties of component (A) at room temperature may be oily or gum-like. From the standpoint of the properties, it is preferable that the component (A) has an oily state at room temperature, and the viscosity of the component (A) at 25° C. is preferably 1 mPa ⁇ s or more and 100,000 mPa ⁇ s or less, which will be described later. It is particularly preferable that the viscosity is 10 mPa ⁇ s or more, 50,000 mPa ⁇ s or less, and 10,000 mPa ⁇ s or less in relation to the vinyl content.
- the curable organopolysiloxane composition according to the present invention is a solvent type
- at least part of component (A) has a viscosity exceeding 100,000 mPa ⁇ s at 25°C or Plasticity measured according to the prescribed method (25 ° C., 4.2 g of spherical sample under 1 kgf load for 3 minutes, reading the thickness to 1/100 mm, and multiplying this value by 100) is in the range of 50-200, more preferably in the range of 80-180.
- the content of alkenyl groups in component (A) is preferably in the range of 0.001 to 10% by mass, preferably in the range of 0.005 to 5.0% by mass, based on the mass of component (A). A range of 01 to 3.0% by mass is more preferable.
- the content of the vinyl (CH 2 ⁇ CH—) moiety in the aliphatic unsaturated carbon-carbon bond-containing group (hereinafter referred to as “vinyl content”) is in the range of 0.005 to 10.0% by mass. It is particularly preferred to use organosiloxanes in the range of 0.005 to 5.0% by weight.
- Component (A) contains, as organic groups other than aliphatic unsaturated carbon-carbon bond-containing groups, alkyl groups such as methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group and heptyl group; Aryl groups such as tolyl group, xylyl group and naphthyl group; Aralkyl groups such as benzyl group and phenethyl group; Halogenated alkyl groups such as chloromethyl group, 3-chloropropyl group and 3,3,3-trifluoropropyl group; may contain From an industrial point of view, it is particularly preferred to contain a methyl group.
- alkyl groups such as methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group and heptyl group
- Aryl groups such as tolyl group, xylyl group and naphthyl group
- an organic group other than the aliphatic unsaturated carbon-carbon bond-containing group in the component (A) is preferably a methyl group, and the content of the aryl group or aralkyl group is less than 0.1 mol%, particularly 0.0 mol%, relative to the entire silicon-bonded groups, and substantially Preferably, it does not contain any aryl or aralkyl groups.
- Such component (A) may be used alone or as a mixture of a plurality of components.
- (A1) a linear or branched organopolysiloxane having at least two alkenyl groups only at both ends of the molecular chain, and (A2) having at least one or more alkenyl groups at sites other than the ends of the molecular chain and having at least 3 or more alkenyl groups in the molecule, may be one selected from linear or branched organopolysiloxanes, or may be a mixture containing both at any mass ratio.
- These components (A1) and (A2) may also preferably be a mixture of two or more components having different viscosities, siloxane polymerization degrees, or alkenyl group contents.
- volatile or low-molecular-weight siloxane oligomers octamethyltetrasiloxane (D4), decamethylpentasiloxane (D5), etc.
- D4 octamethyltetrasiloxane
- D5 decamethylpentasiloxane
- the degree can be designed as desired, it may be less than 1% by mass of the entire component (A) and less than 0.1% by mass for each siloxane oligomer, and if necessary, may be reduced to near the detection limit.
- the component (B) is an organopolysiloxane resin, and the content of the component (B) in the total solid content of the composition is 50% by mass or more, so that the composition as a whole has hot-melt properties.
- the component (B) is a component that adjusts the adhesive force, that is, the adhesion to the substrate, of the cured product obtained by curing the composition according to the present invention. That is, it is possible to adjust the hardness of the cured product of the present composition and the adhesion to the substrate according to the amount of the component (B) used.
- the cured product when the content of the component (B) is small, the cured product is flexible and has low adhesion to the substrate surface, and when the substrates are peeled off, the substrate surface is easily peeled off due to interfacial peeling. tend to be removable from On the other hand, when the content of component (B) increases, the adhesion of the cured product to the substrate surface tends to increase.
- component (B) is used in excess of 2 parts, the pressure-sensitive adhesive layer forms a strong bond with the substrate surface, and the adhesive layer tends to undergo cohesive failure when peeled, resulting in a permanent adhesion mode.
- Component (B) is a siloxane unit (M unit) represented by R 3 SiO 1/2 (wherein R represents a monovalent organic group independently of each other) in the molecule, and SiO 4/2 is an organopolysiloxane resin containing a siloxane unit (Q unit) represented by
- M unit siloxane unit
- Q unit siloxane unit
- the molar ratio of M units to Q units is preferably between 0.5 and 2.0. If this molar ratio is less than 0.5, the adhesion of the cured product to the substrate may be reduced, and if it is greater than 2.0, the cohesive force of the substances constituting the adhesion layer will be reduced. is.
- a range of 20:1.00 is more preferred, and 0.60:1.00 to 1.10:1.00 is even more preferred.
- the above molar ratio can be easily measured by 29 Si nuclear magnetic resonance.
- Component (B) may consist of only M units and Q units, but may also contain R 2 SiO 2/2 units (D units) and/or RSiO 3/2 units (T units).
- each R independently represents a monovalent organic group.
- the total content of M units and Q units in component (B) is preferably 50% by weight or more, more preferably 80% by weight or more, and particularly preferably 100% by weight.
- the monovalent organic group of R is preferably a monovalent hydrocarbon group having 1 to 10 carbon atoms, such as an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, and an aryl group having 6 to 10 carbon atoms. , a cycloalkyl group having 6 to 10 carbon atoms, a benzyl group, a phenylethyl group, and a phenylpropyl group.
- 90 mol % or more of R is preferably an alkyl group having 1 to 6 carbon atoms or a phenyl group, and particularly preferably 95 to 100 mol % of R is a methyl group or a phenyl group.
- a methyl group is preferred as the monovalent organic group in component (B), and the content of aryl groups or aralkyl groups should be It is preferably less than 0.1 mol%, particularly 0.0 mol%, and substantially free of aryl or aralkyl groups.
- the organopolysiloxane resin as component (B) preferably has a weight average molecular weight (Mw) of 2,500 or more, preferably 3,000 or more, as measured by gel permeation chromatography (GPC) in terms of standard polystyrene.
- Mw weight average molecular weight
- GPC gel permeation chromatography
- component (B) is a resin composed of the above R 3 SiO 1/2 units (M units) and SiO 4/2 units (Q units) having a weight average molecular weight (Mw) in the range of 2000 to 50000. is particularly preferred.
- it is an organopolysiloxane resin having a weight average molecular weight (Mw) in the range of 1,000 to 10,000, and the content of the organopolysiloxane resin having a molecular weight of 100,000 or more is 1% by mass or less of the total. , more preferably 0.5% by mass or less, particularly preferably substantially 0% by mass, is used to realize an organopolysiloxane pressure-sensitive adhesive layer with a low haze value of the cured product. sometimes you can.
- Mw weight average molecular weight
- Hydrolyzable groups such as hydroxyl groups or alkoxy groups in component (B) are directly bonded to silicon such as T units or Q units among the siloxane units in the resin structure, and Since these groups are produced as a result of hydrolysis, the content of hydroxyl groups or hydrolyzable groups can be reduced by hydrolyzing the synthesized organopolysiloxane resin with a silylating agent such as trimethylsilane.
- the formation of an organopolysiloxane resin structure with a large molecular weight in the cured product can be suppressed, and the curability of the composition at low temperatures and the storage elastic modulus of the resulting cured product layer can be further improved.
- Good adhesion and removability from the substrate surface after exposure to high temperatures may be improved.
- resins also called MQ resins
- (B) component for example, ( Me3SiO1 /2 ) 0.45 (SiO4 /2 ) 0.55 (HO1 /2 ) 0.05 ( Me3SiO1 /2 ) 0.40 (SiO4 /2 ) 0.60 (HO1 /2 ) 0.10 ( Me3SiO1 /2 ) 0.52 (SiO4 /2 ) 0.48 (HO1 /2 ) 0.01 ( Me3SiO1 /2 ) 0.40 (Me2ViSiO1 / 2 ) 0.05 (SiO4 /2 ) 0.55 (HO1 /2 ) 0.05 ( Me3SiO1 /2 ) 0.45 (SiO4 /2 ) 0.55 (MeO1 /2 ) 0.10 ( Me3SiO1 /2 ) 0.25 (Me2PhSiO1 / 2 ) 0.20 (SiO4 /2 ) 0.55 (HO1 /2 ) 0.05 ( Me3SiO1 /2 ) 0.10
- the total amount of subscripts of silicon-containing units is set to 1.
- (HO) 1/2 unit subscript indicates the relative amount) can be mentioned.
- the low-molecular-weight siloxane oligomer in the component (B) may be reduced or removed.
- Component (B) is a component that realizes the hot-melt properties of the composition according to the present invention, adjusts the storage elastic modulus of the cured product, and imparts adhesion to a desired substrate. is in the range of 50 to 99 parts by mass when the mass of component (A) of the composition is 1 to 50 parts by mass, and when the amount is small, the adhesive layer has a relatively weak adhesion to the substrate. When the blending amount is large, the adhesion of the pressure-sensitive adhesive layer to the base material is strong, exhibiting strong adhesiveness. Accordingly, the cured product according to the present invention has the advantage that the adhesiveness and adhesive strength to the substrate can be designed in a wide range.
- the content of the component (B) in the total mass of the solid content of the composition is 50. It must be at least 5% by mass, preferably in the range of 55 to 95% by mass.
- the content of the component (B) is less than the above lower limit, even if the component (D) or the like is used instead, the hot-melt properties of the resulting composition may deteriorate, or the hot-melt composition may be formed into a sheet.
- the ratio of the sum of the masses of components (A), (B) and (D2) to the total solid mass of the present composition can be defined as "mass % of siloxane in the composition",
- the siloxane mass % is preferably 55 to 99.5 mass %, and when it is in the range of 60 to 99.5 mass %, the organopolysiloxane pressure-sensitive adhesive layer according to the present invention has a transparent appearance.
- it can be designed to have the flexibility characteristic of silicone and to have sufficient adhesion to substrates.
- the above organopolysiloxane resin is selected as the component (B), and the above resin component is blended in the above range with respect to the chain siloxane polymer component, the composition as a whole is good.
- the cured product obtained by curing thereof tends to favorably achieve viscoelastic properties such as high storage modulus and stress at room temperature.
- Component (C) is a radical polymerization initiator, which may be (C1) a photo-radical polymerization initiator, (C2) a thermal radical polymerization initiator, or a combination thereof.
- the type of component (C), the curing method, and the curing temperature may be appropriately selected according to the curing and adhesion processes of the base material, the heat resistance of the substrate, the need for low energy consumption, and the like. Since the composition according to the present invention has an alkenyl group in component (A), which is the main ingredient, good curability can be achieved by irradiation with high-energy rays and/or heating in the presence of component (C). can be done.
- the amount of component (C) to be used is 0.1 to 10 parts by mass, and particularly preferably 0.2 to 5 parts by mass, when the mass of component (A) is 1 to 50 parts by mass. .
- the amount of component (C) used depends on the process and curing time of the pressure-sensitive adhesive layer to which the present composition is applied, the content of alkenyl groups derived from component (A), the dose of high-energy radiation and/or heating. It can be appropriately designed within the above range depending on the conditions.
- Component (C1) is a photoradical polymerization initiator, and is a component that accelerates the photocuring reaction of the alkenyl groups in component (A) and optionally the thiol compound (E) by irradiation with high-energy rays such as ultraviolet rays.
- Radical photopolymerization initiators are roughly classified into photocleavage type and hydrogen abstraction type, but the photoradical polymerization initiator used in the composition of the present invention is arbitrarily selected from those known in the art. It can be selected and used, and is not particularly limited. Some photoradical polymerization initiators can accelerate the curing reaction not only under irradiation with high-energy rays such as ultraviolet rays but also under light irradiation in the visible light range.
- radical photopolymerization initiators include 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, ⁇ -hydroxy- ⁇ , ⁇ '-dimethylacetophenone, 2-methyl-2 ⁇ -ketol compounds such as hydroxypropiophenone and 1-hydroxycyclohexylphenyl ketone; methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1-[4 Acetophenone compounds such as -(methylthio)-phenyl]-2-morpholinopropane-1; benzoin ether compounds such as benzoin ethyl ether, benzoin isopropyl ether, and anisoin methyl ether; ketal compounds such as benzyl dimethyl ketal; aromatic sulfonyl chloride compounds such as naphthalenesulfonyl chloride; photoactive oxime compounds such as 1-phenone-1,1-
- photoradical polymerization initiators suitable as the component (C1) in the present invention include bis-(2,6-dichlorobenzoyl)phenylphosphine oxide, bis-(2,6-dichlorobenzoyl)-2,5- Dimethylphenylphosphine oxide, bis-(2,6-dichlorobenzoyl)-4-propylphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, bis(2,6-dimethoxybenzoyl) )-2,4,4-trimethylpentylphosphine oxide, bis(2,6-dichlorobenzoyl)-4-propylphenylphosphine oxide, bis(2,6-dichlorobenzoyl)-2,5-dimethylphenylphosphine bisacylphosphine oxides such as oxide, bis-(2,6-dimethoxybenzoyl)-2,5-dimethylphenylpho
- acetophenone-based photopolymerization initiator suitable as the component (C1) in the present invention include Omnirad 907, 369, 369E, 379 manufactured by IGM Resins.
- Commercially available acylphosphine oxide-based photopolymerization initiators include Omnirad TPO, TPO-L, and 819 manufactured by IGM Resins.
- Commercially available oxime ester photopolymerization initiators include Irgacure OXE01 and OXE02 manufactured by BASF Japan Ltd., N-1919 manufactured by ADEKA Co., Ltd., Adeka Arcles NCI-831, NCI-831E manufactured by Changzhou Yutaka Electronic New Materials Co., Ltd. and TR-PBG-304.
- Component (C2) is a thermal radical polymerization initiator that generates radical species upon heating and accelerates the photo-curing reaction of alkenyl groups in components (A) and (D) and optionally (E) a thiol compound.
- thermal radical polymerization initiators include azo compounds and organic peroxides.
- azo compounds 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), 1,1 '-Azobis-1-cyclohexanecarbonitrile, dimethyl-2,2'-azobisisobutyrate, dimethyl-2,2'-azobis (2-methylpropionate), dimethyl-1,1'-azobis (1 -cyclohexanecarboxylate), 4,4′-azobis(4-cyanovaleric acid), 2,2′-azobis(2-amidinopropane) dihydrochloride, 2-tert-butylazo-2-cyanopropane, 2,2 '-Azobis(2-methylpropionamide) dihydrate, 2,2'-azobis(2,4,4-trimethylpentane) and the like.
- organic peroxides include alkyl peroxides, diacyl peroxides, ester peroxides, and carbonate peroxides.
- the alkyl peroxides include dicumyl peroxide, di-tert-butyl peroxide, di-tert-butylcumyl peroxide, 2,5-dimethyl-2,5-di(tert-butylperoxy ) hexane, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexyne-3, tert-butylcumyl, 1,3-bis(tert-butylperoxyisopropyl)benzene, 3,6,9- Triethyl-3,6,9-trimethyl-1,4,7-triperoxonane is exemplified.
- diacyl peroxides include benzoyl peroxide, lauroyl peroxide, and decanoyl peroxide.
- peroxide esters include 1,1,3,3-tetramethyl butyl peroxy neodecanoate, ⁇ -cumyl peroxy neo decanoate, tert-butyl peroxy neo decanoate, tert-butyl peroxy neoheptanoate, tert-butyl peroxypivalate, tert-hexyl peroxypivalate, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, tert-amylperoxyl-2- Ethylhexanoate, tert-butylperoxy-2-ethylhexanoate, tert-butylperoxyisobutyrate, di-tert-butylperoxyhexahydroterephthalate, tert-
- Peroxycarbonates include di-3-methoxybutylperoxydicarbonate, di(2-ethylhexyl)peroxydicarbonate, diisopropylperoxycarbonate, tert-butylperoxyisopropylcarbonate, di(4-tert-butylcyclohexyl ) peroxydicarbonate, dicetyl peroxydicarbonate, dimyristyl peroxydicarbonate.
- the present composition can also use (C') a photosensitizer in combination with (C1) a photoradical polymerization initiator.
- a sensitizer can increase the photon efficiency of the polymerization reaction, making longer wavelength light available for the polymerization reaction compared to the use of the photoinitiator alone. It is known to be particularly effective when the coating thickness is relatively thick or when relatively long wavelength LED light sources are used.
- Sensitizers include anthracene compounds, phenothiazine compounds, perylene compounds, cyanine compounds, merocyanine compounds, coumarin compounds, benzylidene ketone compounds, (thio)xanthene or (thio)xanthone compounds such as isopropyl Thioxanthone, 2,4-diethylthioxanthone, squalium-based compounds, (thia)pyrylium-based compounds, porphyrin-based compounds, and the like are known, and any photosensitizer may be used in the curable organopolysiloxane composition of the present invention. It can be used for products and adhesive compositions. The amount used is arbitrary, but the mass ratio of the component (C') to the component (C1) is in the range of 0 to 10, and when used, it is selected in the range of 0.01 to 5. is common.
- the present composition contains the (A) component described above and optionally the (E) component described later, it forms a cured product by a radical polymerization reaction.
- the present composition when at least part of the component (C) is the photoradical polymerization initiator (C1), the present composition can be cured by irradiation with high-energy rays such as ultraviolet rays.
- the thermal radical polymerization initiator (C2) when at least part of the component (C) is the thermal radical polymerization initiator (C2), the composition can be cured by heating.
- heating and high-energy ray irradiation can be selected or combined for curing, and can be appropriately selected depending on the desired curing method and sealing/adhesion process.
- At least part of the component (C) of the composition according to the present invention is (C1) a photoradical polymerization initiator, and optionally further contains (C') a photosensitizer, so that the environmental load is small, Rapid curing is possible even at low temperatures, including room temperature, even for substrates and members with poor heat resistance, and it has the advantage of being suitable for industrial production processes that respond to low energy consumption in fields such as semiconductors.
- the thermal radical polymerization initiator (C2) there is an advantage that rapid curing is possible at high temperatures in a short time.
- composition according to the present invention optionally further has (D1) a monofunctional or polyfunctional vinyl-based monomer and (D2) an organic group containing at least one acrylic or methacrylic group in the molecule. It may contain one or more radical reactive components selected from organopolysiloxane compounds.
- (meth)acrylic acid indicates that both acrylic acid and methacrylic acid are included.
- (meth)acrylate”, “(meth)acryloxy”, and “(meth)acrylamide” are each meant to include both acrylate and methacrylate, acryloxy and methacryloxy, acrylamide and methacrylamide.
- component (D) contains carbon-carbon unsaturated double bonds mainly derived from acrylic groups or methacrylic groups in the molecule, so it is a radical-reactive component. Participates in curing reaction by radical polymerization. Therefore, by optionally using the component (D), the melt viscosity, the adhesion to the substrate, the crosslink density of the cured product, etc. can be adjusted. It is possible to adjust the hardness of the cured product obtained by curing or semi-curing the product and the adhesion to the substrate, and in particular, it may be useful for adjusting the crosslink density and the adhesive strength to the substrate. be.
- radical-reactive component (D) is optional, and the amount used is not particularly limited, but is in the range of 0.1 to 50 parts by mass per 1 to 50 parts by mass of component (A). is preferred, and a range of 0.1 to 25 parts by mass is particularly preferred.
- Component (D1) is a vinyl-based monomer that is a starting material for organic resins generally called vinyl-based resins, and includes methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, lower alkyl (meth)acrylates such as isopropyl (meth)acrylate; glycidyl (meth)acrylate; n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, n-hexyl (meth)acrylate, Cyclohexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isoamyl (meth)acrylate, octyl (meth)acrylate, dodecyl (meth)acrylate, isobornyl (meth)acrylate, stearyl (meth)acrylate, dicyclopentanyl (me
- polyfunctional vinyl monomers can also be used, such as diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, neopentyl glycol di(meth) Acrylate, polyethylene glycol di(meth)acrylate, 1,4-bis((meth)acryloyloxy)butane, 1,6-bis((meth)acryloyloxy)hexane, 1,9-bis((meth)acryloyloxy) Nonane, 1,10-bis((meth)acryloyloxy)decane, 1,12-bis((meth)acryloyloxy)dodecane, tris(2-acryloyloxy)ethyl isosialate, trimethylolpropane tri(meth)acrylate , pentaerythritol tri(meth)acrylate, neopentyl glycol di(meth)acrylate, trimethyl
- the preferred component (D1) is a monofunctional or polyfunctional vinyl-based monomer having 8 or more carbon atoms, preferably 8 to 30 carbon atoms, more preferably 13 to 30 carbon atoms. Since such vinyl monomers have low volatility and relatively low viscosity, the workability and moldability of the uncured composition are excellent, and the resulting cured product has a high glass transition temperature. tend to be achievable.
- suitable component (D1) is an acrylate-based vinyl having 8 or more carbon atoms, preferably 8 to 30 carbon atoms, more preferably 13 to 30 carbon atoms, and one acryloxy group. It is a monomer and can be used alone or in combination of two or more in consideration of the viscosity, curability, hardness after curing, and glass transition temperature of the compound. Among them, vinyl monomers selected from dodecyl acrylate, 2-ethylhexyl acrylate, isobornyl acrylate, and dicyclopentanyl acrylate are preferred.
- suitable component (D1) is an acrylate-based vinyl monomer having 8 or more carbon atoms, preferably 8 to 30 carbon atoms, more preferably 13 to 30 carbon atoms, and having two or more acryloxy groups. It can be used alone or in combination of two or more in consideration of the viscosity, curability, compatibility with the compound having one acryloxy group, hardness after curing, and glass transition temperature of the compound.
- Diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, 1,6-bis((meth)acryloyloxy)hexane, 1,12-bis((meth)acryloyloxy)dodecane, trimethylolpropane tri(meth) ) acrylates, double-ended acryloxy-functional polydimethylsiloxanes can preferably be used, but compounds having no silicon atoms, namely diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, 1,6-bis(((meth) acryloyloxy)hexane, 1,12-bis((meth)acryloyloxy)dodecane, trimethylolpropane tri(meth)acrylate, polyethylene glycol di(meth)acrylate (average degree of polymerization within the range of 4 to 30) is more preferred.
- (meth)acrylate compounds containing one or more ether bonds (-C-O-C-) in the molecule e.g., diethylene glycol di(meth)acrylate, triethylene glycol di(meth)
- One or more selected from acrylates, trimethylolpropane tri(meth)acrylate and polyethylene glycol di(meth)acrylate can be used alone or in combination to improve the haze resistance of the resulting cured product.
- the amount of the (meth)acrylate compound containing one or more ether bonds (-C-O-C-) in the molecule is preferably 0.001-5% by mass, more preferably 0.05-2. % by mass.
- the haze resistance property here refers to the property that the haze value of the material is 1 or less even after exposure to a high humidity environment, or the haze value is reduced to 1 or less under dry conditions even if the haze value is 1 or more. .
- Component (D2) is an organopolysiloxane compound having an organic group containing at least one acrylic or methacrylic group in the molecule, and is resinous, chain (including linear and branched), cyclic and Any resin-linear block copolymer composed of resinous blocks and chain blocks can be used.
- the (D2) component has the general formula (1) at the terminal or side chain of the molecular chain:
- Z is a divalent organic group that may contain a hetero atom and is bonded to the silicon atom that constitutes the main chain of the polysiloxane *, and is a divalent organic group that may contain a silicon atom, an oxygen atom, a nitrogen atom, or a sulfur atom. may be a valent organic group.
- Z is an alkylene group having 2 to 22 carbon atoms
- Z 2 is * -[(CH 2 ) 2 O] m (C n H 2n )-(m is a number ranging from 0 to 3, n is 2 a number in the range of to 10) ⁇ , and -Z 1 -R 2 2 Si-OR 2 2 Si-Z 2 - described later. Any one group selected from divalent linking groups represented by is preferable.
- the silicon-bonded functional group (R A ) has the general formula (1): is represented by In the formula, each R 1 independently represents a hydrogen atom, a methyl group or a phenyl group, preferably a hydrogen atom or a methyl group. Each R 2 independently represents an alkyl group or an aryl group, and is industrially preferably an alkyl group having 1 to 20 carbon atoms or a phenyl group, particularly preferably a methyl group.
- Z 1 represents -O(CH 2 ) m - (m is a number ranging from 0 to 3), m is preferably 1 or 2.
- Z 2 is a divalent organic group represented by —C n H 2n — (where n is a number in the range of 2 to 10) bonded to a silicon atom constituting the main chain of polysiloxane *, and n is 2 to 6 are practically preferred.
- the silicon-bonded functional group (R A ) represented by the general formula (1) includes a silicon-bonded functional group (R Alk ) containing at least one alkenyl group, and a silicon-bonded hydrogen atom and a silicon-bonded hydrogen atom in the molecule.
- Method by reacting a hydrosilane compound having an acrylic functional group (e.g., 3-(1,1,3,3-tetramethyldisiloxanyl)propyl methacrylate, etc.) in the presence of a hydrosilylation reaction catalyst It can be introduced intramolecularly.
- a hydrosilylation reaction catalyst such as dibutylhydroxytoluene (BHT).
- the (D2) component may contain one or more linear organopolysiloxanes selected from the following components (D2-1-1) and (D2-1-2) below.
- Component (D2-1-1) is a linear organopolysiloxane having at least one functional group (R A ) in the molecule, represented by the following structural formula.
- R 1 is independently a C1-C6 alkyl group, C2-C20 alkenyl group, C6-C12 aryl group
- R A' is independently a C1-C6 alkyl group, C2-C20 alkenyl a C6-C12 aryl group, and a silicon atom-bonded functional group (R A ) including the aforementioned acryl or methacryl groups
- n1 is a positive number
- n2 is 0 or a positive number be.
- at least one of R A' is a silicon atom-bonded functional group (R A ) containing an acryl group or a methacryl group as described above.
- n1+n2 is a positive number of 0 or more and is not limited, it is preferably in the range of 10 to 5,000, more preferably 10 to 2,000, still more preferably 10 to 1,000.
- the value of n1+n2 is such that the viscosity of component (C'1) at 25° C. is in the range of 1 to 100,000 mPa ⁇ s, more preferably 10 to 50,000 mPa ⁇ s, and still more preferably 500 to 50,000 mPa ⁇ s. Any number that satisfies the viscosity range of s may be used and is preferred.
- Component (D2-1-2) is a branched-chain organopolysiloxane having at least one functional group (R A ) in the molecule and containing branched siloxane units, represented by the following average unit formula: be.
- Component (D2-1-2) is more specifically a branched organopolysiloxane represented by the following siloxane unit formula.
- R A' R 1 2 SiO 1/2 a (R 1 2 SiO 2/2 ) b1 (RA ' R 1 SiO 2/2 ) b2 (R 1 SiO 3/2 ) c1 (R A' SiO 3 /2 ) c2
- R 1 and R A′ are the same groups as above
- R 1 and R A′ are the same groups as above
- the (D2-1-2) component may be a branched organopolysiloxane having a methacryloyl group-containing organic group only on the terminal M unit represented by the following siloxane unit formula.
- R A' R 1 2 SiO 1/2 a (R 1 2 SiO 2/2 ) b1 (R 1 SiO 3/2 ) c1
- R 1 and R A′ are the same groups as described above, and 0 ⁇ a ⁇ 10, 15 ⁇ b1 ⁇ 2000, 0 ⁇ c1 ⁇ 10, and at least one of R A′ is the above acrylic group. or a silicon atom-bonded functional group (R A ) containing a methacrylic group.
- the viscosity of component (D2-1-2) at 25° C. is preferably 10 to 50,000 mPa ⁇ s, more preferably 100 to 2,000 mPa ⁇ s.
- Examples of the (D2) component widely available on the market include (branched or linear) polydimethylsiloxane containing (meth)acrylic groups at one end; methacryloxypropyl-blocked polydimethylsiloxane at both ends.
- composition according to the present invention contains an organopolysiloxane resin as the component (B), and as part of the component (B), (B-2) R B 3 SiO 1/2 and R A a R B (3-a) Organopolysiloxane containing M units represented by SiO 1/2 and Q units in a ratio of the amount of M units to Q units in the range of 0.5 to 2.0 It may contain a resin.
- a represents an integer of 1 to 3
- R A is a silicon atom-bonded functional group containing an acrylic group or a methacrylic group
- R B is a monovalent organic group excluding R A , a methyl group, an ethyl group , propyl group, butyl group, pentyl group, hexyl group, heptyl group and other alkyl groups
- phenyl group, tolyl group, xylyl group, naphthyl group and other aryl groups Halogenated alkyl groups such as 3-chloropropyl group and 3,3,3-trifluoropropyl group
- alkenyl groups such as vinyl group, allyl group, butenyl group, pentenyl group and hexenyl group.
- At least part of R B may be an alkenyl group having 2 to 12 carbon atoms, and is preferred.
- At least one of the M units constituting the component (B-2) is a triorganosiloxy unit containing a functional group R A represented by R A R B (3-a) SiO 1/2 be.
- Component (B-2) is an MQ-type organopolysiloxane resin having an acrylic group or a methacrylic group in the molecule, and a silicon atom bond containing at least one acrylic group or methacrylic group represented by RA in the molecule. Since it has a functional group, it participates in the same curing reaction as components (A) and (D).
- Component (B-2) is optionally a component that adjusts the adhesion to the substrate, the crosslink density of the cured product, and the melt viscosity. It is possible to adjust the hardness and adhesion to the substrate.
- Component (B-2) is a siloxane unit (T unit) represented by a small amount of RSiO 3/2 (R is a monovalent organic group that may contain the above RA ) or R 2 SiO 2/2 (R is may contain siloxane units (D units) represented by the same monovalent organic group), but substantially the above R B 3 SiO 1/2 and R A a R B (3-a) SiO 1 It is preferable to consist only of M units and Q units represented by /2 , and the sum of the amount of T units and D units per 1 mol of Q units in component (C) is preferably less than 0.1 mol. .
- the ratio (molar ratio) of the amount of M units to Q units in component (B-2) is in the range of 0.5 to 2.0, preferably in the range of 0.5 to 1.5, It is more preferably in the range of 0.55 to 1.20, particularly preferably in the range of 0.60 to 1.10.
- component (B-2) used is arbitrary, and it may be blended in the form of partially replacing the above component (B).
- component (B-2) may be used in the range of 0 to 50% by mass, or may be used in the range of 0 to 25% by mass of the total component (B).
- the composition according to the present invention may further contain (E) a polyfunctional thiol compound having at least two thiol groups (--SH) in the molecule. Since the polyfunctional thiol compound functions as a chain transfer agent to promote radical polymerization, a part of the component (C) according to the present invention is a radical photopolymerization initiator, and the composition is exposed to high energy such as ultraviolet rays. In the case of curing by radiation irradiation, the curing speed and the deep-part curability of the cured product can be improved even when the irradiation dose of high-energy radiation is small.
- polyfunctional thiol compounds examples include pentaerythritol tetrakis(3-mercaptobutyrate), 1,4-bis(3-mercaptobutyryloxy)butane, 1,3,5-tris(2-(3 sulfanylbutanoyloxy)ethyl)-1,3,5-triazinane-2,4,6-trione, trimethylolpropane tris(3-mercaptobutyrate) and the like.
- component (E) may be an organopolysiloxane compound having an organic group containing at least two thiol groups in the molecule, and may be a resinous, chain (including linear and branched), cyclic and resin-linear type block copolymers composed of resin blocks and chain blocks.
- the binding site of the thiol modified group is not particularly limited, and may be either the terminal of the molecular chain or the side chain.
- linear organopolysiloxane having a thiol modifying group at the side chain site, such as a dimethylsiloxane/2-thiolpropylmethylsiloxane copolymer whose molecular chain end is blocked with a trimethylsiloxy group.
- component (E) is a thiol group-containing organopolysiloxane compound
- the compatibility with other constituent components and the uniformity and viscosity of the composition as a whole can be improved, and the intramolecular crosslink density and the like can be adjusted.
- component (E) is optional, but the amount used is 0 to 20 parts by mass, and 0 to 10 parts by mass, based on 1 to 50 parts by mass of component (A). Amounts of 0 to 5 parts by weight are particularly preferred.
- the composition may further contain a known tackifier as component (F).
- Component (G) improves the adhesive strength of the cured product obtained by curing the present composition to the substrate, and can be used by selecting one or more from known adhesion imparting agents. .
- the adhesive strength may be significantly improved after a certain period of time.
- Component (F) is used in an amount of 0.01 to 5 parts by mass, particularly preferably 0.02 to 2 parts by mass, when the total composition of the present invention is 100 parts by mass. . If the amount of component (F) used is less than the lower limit, the adhesive strength to the substrate may not be sufficiently improved. may affect the appearance of the
- component (F) contains an organic compound having 2 or 3 alkoxysilyl groups at the molecular chain ends.
- the organic compound referred to here includes an organic silicon compound in addition to an alkane compound and the like.
- organic compounds having two alkoxysilyl groups at the molecular chain ends include 1,2-bis(trimethoxysilyl)ethane, 1,2-bis(triethoxysilyl)ethane, 1,2-bis (methyldimethoxysilyl)ethane, 1,2-bis(methyldiethoxysilyl)ethane, 1,3-bis(trimethoxysilyl)propane, 1,4-bis(trimethoxysilyl)butane, 1,4-bis( triethoxysilyl)butane, 1-methyldimethoxysilyl-4-trimethoxysilylbutane, 1-methyldiethoxysilyl-4-triethoxysilylbutane, 1,4-bis(methyldimethoxysilyl)butane, 1,4-bis (methyldiethoxysilyl)butane, 1,5-bis(trimethoxysilyl)pentane, 1,5-bis(triethoxysilyl)pentane, 1,4-bis((tri
- organic compounds having three alkoxysilyl groups include 1,3,5-tris ⁇ 2-(trimethoxysilyl)ethyl ⁇ -1,1,3,5,5-pentamethyltrisiloxane, 1 , 3,5-tris ⁇ 2-(methyldimethoxysilyl)ethyl ⁇ -1,1,3,5,5-tetramethyldisiloxane, 1,3,5-tris ⁇ 2-(triethoxysilyl)ethyl ⁇ -1,1,3,5,5-tetramethyldisiloxane, 1,3,5-tris ⁇ 2-(methyldiethoxysilyl)ethyl ⁇ -1,1,3,5,5-tetramethyldisiloxane, Examples include trisiloxane compounds having three alkoxysilyl groups such as 1,3,5-tris ⁇ 6-(trimethoxysilyl)hexyl ⁇ -1,1,3,5,5-tetramethyldisiloxane.
- JP-B-52-8854 and JP-A-10-195085 Disclosed reaction mixtures of amino group-containing organoalkoxysilanes and epoxy group-containing organoalkoxysilanes, particularly carbasilatrane derivatives having silicon-bonded alkoxy groups or silicon-bonded alkenyl groups in one molecule, alkoxysilyl group-containing organic Silatrane derivatives and the like having groups can be used and are preferred. These are also disclosed in the above-mentioned Patent Documents 1 to 4, and an appropriate tackifier can be selected from these and used.
- the curable organopolysiloxane composition according to the present invention includes a non-reactive polydimethylsiloxane or polydimethyldiphenylsiloxane that does not contain a carbon-carbon double bond-containing reactive group such as an alkenyl group, an acrylic group, or a methacrylic group. of organopolysiloxanes, which may improve the loss modulus (tan ⁇ ), storage modulus (G′) and loss modulus (G′′) of the cured product.
- the use of hydroxyl-terminated polydimethylsiloxane or polydimethyldiphenylsiloxane can increase the loss factor of the cured product, and such compositions are within the scope of the present invention.
- the hot-melt curable organopolysiloxane composition of the present invention is solid or has poor fluidity at 25° C., and is essentially a low-solvent or solvent-free composition.
- a small amount of an organic solvent is allowed in order to improve the wettability of the present composition to a substrate or when it is unavoidably contained as a solvent associated with the component (B).
- the present composition may be used temporarily.
- the hot-melt curable organopolysiloxane composition according to the invention may be dispersed in one or more organic solvents as a diluent or dispersion medium and mixed, and then coated in the form of a dispersion in the form of a film or sheet. You may In this case, it is preferable that the organic solvent is removed from the final mixed composition or the composition molded into a film or sheet by means of heat drying or the like to obtain a dry solid form.
- the hot-melt curable organopolysiloxane composition is dispersed in an organic solvent as the above diluent or dispersion medium, components (A) to (D) that form a solid content as a cured product, and optionally other
- the total amount of the organic solvent as a diluent is in the range of 0 to 100 parts by mass, and may be in the range of 0 to 25 parts by mass. preferable.
- an organic solvent for example, aromatic hydrocarbon solvents such as toluene, xylene, and benzene, aliphatic hydrocarbon solvents such as heptane, hexane, octane, and isoparaffin, Ester solvents such as ethyl acetate and isobutyl acetate, ether solvents such as diisopropyl ether and 1,4-dioxane, chlorinated aliphatic hydrocarbon solvents such as trichlorethylene, perchlorethylene and methylene chloride, solvent volatile oils, etc. and two or more of them may be combined according to the wettability to the sheet-like substrate.
- aromatic hydrocarbon solvents such as toluene, xylene, and benzene
- aliphatic hydrocarbon solvents such as heptane, hexane, octane, and isoparaffin
- Ester solvents such as ethyl acetate and isobuty
- the hot-melt type curable organopolysiloxane composition according to the present invention may optionally contain components other than the above components within a range that does not impair the technical effects of the present invention.
- adhesion promoters such as phenol, quinone, amine, phosphorus, phosphite, sulfur, or thioether
- light stabilizers such as triazoles or benzophenones
- one or more antistatic agents such as cationic surfactants, anionic surfactants, or nonionic surfactants, polymerization inhibitors, and UV absorbers agents and the like.
- pigments, dyes, and optionally surface-treated inorganic fine particles can also be arbitrarily blended. .
- the method for preparing the hot-melt curable organopolysiloxane composition according to the present invention is not particularly limited, and is carried out by homogeneously mixing each component.
- An organic solvent may be added as necessary, and a known stirrer or kneader may be used to mix and prepare.
- the present composition may have radical polymerizability when heated. is preferred.
- the hot-melt curable organopolysiloxane composition of the present invention may be used in the form of granules, pellets, sheets or films.
- the sheet or film made of the curable silicone composition of the present invention with an average thickness of 10 to 1000 ⁇ m has hot-melt properties, and the type of component (B) is Therefore, it has curability due to radical polymerization reaction triggered by irradiation of high-energy rays and heating, so it has excellent handling workability and melting characteristics, and is used especially for overmolding and film adhesives between substrates. It is advantageous for
- the hot-melt curable organopolysiloxane composition of the present invention can be used in the form of a sheet or film. It can be used as a laminate having a structure in which materials are interposed.
- a film-like substrate provided with a release layer (generally referred to as a release film) can be used as an adhesive or a sealant when a sheet-like material made of a hot-melt curable organopolysiloxane composition is used as an adhesive or a sealant. Can be stripped.
- this laminate is also referred to as a peelable laminate.
- the hot-melt curable organopolysiloxane composition when applied in step (I), it may be heated and melted and applied to the substrate in a fluid state. may be applied onto the substrate in the form of a dispersion solution using and the organic solvent removed in step (II).
- the sheet or film of the curable hot-melt silicone composition can be obtained as part of the release laminate described below.
- the present composition may have radical polymerizability by heating. Especially preferred.
- the method for producing the peelable laminate described above is not particularly limited, but as an example, the following step 1: a step of mixing the components of the hot-melt curable organopolysiloxane composition; Step 2: a step of kneading the mixture obtained in step 1 while heating and melting; Step 3: A step of laminating the heat-melted mixture obtained in step 2 between two release films having at least one release surface so that the mixture is in contact with the release surface to form a laminate. Step 4: The laminate obtained in Step 3 is pressed between rolls, and the mixture interposed between two release films is rolled to obtain a hot-melt curable organopolysiloxane composition having a specific film thickness.
- a method can be mentioned that includes the step of forming a product sheet or film. Additionally, optionally in step 4, rolls with cooling or temperature control capabilities may be used. Moreover, after step 4, a step of cutting the obtained laminate containing the sheet or film of the hot-melt curable organopolysiloxane composition may be added. Alternatively, instead of step 2, the mixture obtained in step 1 may be dispersed in an organic solvent and applied on a release film, and the organic solvent may be removed by heating or the like before step 3.
- this release film is not particularly limited, and therefore includes what is generally called a film as well as what is called a sheet. However, it is referred to herein as a release film regardless of its thickness.
- the temperature of the mixing step of step 1 is not particularly limited, but heating may be performed as necessary so that each component is sufficiently mixed, and the heating temperature can be, for example, 50° C. or higher.
- the sheet or film of the present invention preferably has a thickness of 10 to 1000 ⁇ m, and is preferably flat. Flat means that the thickness of the resulting sheet or film is within ⁇ 100 ⁇ m or less, preferably within ⁇ 50 ⁇ m or less, more preferably within ⁇ 30 ⁇ m or less.
- the type of material of the base material of the release film that constitutes the release laminate is not particularly limited, but for example, a polyester film, polyolefin film, polycarbonate film, acrylic film, or the like can be used as appropriate.
- the sheet-like substrate is preferably non-porous.
- a release film is a film having a release layer formed by treating one or both sides of a film of such materials to impart release properties, such treatments being known in the art.
- a layer having releasability provided on the surface of the release film is called a release layer.
- the release layer enables the sheet or film made of the curable silicone composition to be easily separated from the film-like substrate. It is also called a release liner, separator, release layer or release coating layer.
- the release layer can be formed as a release layer having a release coating capability such as a silicone-based release agent, a fluorine-based release agent, an alkyd-based release agent, or a fluorosilicone-based release agent.
- fine physical irregularities may be formed on the surface of the film-like substrate to reduce adhesion to the hot-melt curable organopolysiloxane composition, or the composition of the present invention or a cured product thereof may be used.
- the substrate may be made of a material that is difficult to adhere to the layer.
- the above laminate is, for example, an uncured sheet or film made of a hot-melt curable organopolysiloxane composition that is not in contact with the release film after peeling one of the two release films that constitute the laminate. After applying the member to the adherend, the uncured sheet or film-like member can be peeled off from another film-like substrate, ie, a release film, for use.
- the hot-melt curable organopolysiloxane composition can be handled in the form of granules, pellets or sheets at room temperature and is a low-flowing or non-flowing solid at 25°C.
- non-flowing means that it does not deform and/or flow in the absence of external force. It does not deform and/or flow in the absence of Such non-fluidity means that, for example, the composition is substantially deformed even when the molded composition is placed on a hot plate at 25° C. and no external force is applied to the composition or a certain load is applied to the composition. and/or non-flowing. If the composition is non-flowing at 25° C., the shape retention of the composition at that temperature is good and the surface tackiness is low, so that the composition can be easily handled even in an uncured state.
- the softening point of the present composition is preferably 100° C. or lower. Such a softening point is high when the composition with a height of 22 mm is pressed on a hot plate with a load of 100 g weight for 10 seconds from above, and the amount of deformation of the composition is measured after the load is removed. It means the temperature at which the amount of deformation in the longitudinal direction becomes 1 mm or more.
- the sheet obtained by the production method of the present invention is a hot-melt curable organopolysiloxane composition containing the components described above and has hot-melt properties.
- the curable hot-melt silicone composition sheet of the present invention can be used as a heat-meltable pressure-sensitive adhesive, sealant, and/or adhesive.
- the curable hot-melt silicone composition sheet has excellent moldability, gap-filling properties, and adhesive strength, and can be used as a die attach film or film adhesive.
- it can be suitably used as a hot-melt type curable organopolysiloxane composition sheet for overmolding, compression molding or press molding, and can be suitably used as an elastic adhesive member between substrates such as semiconductors. You may
- the hot-melt curable organopolysiloxane composition sheet obtained by the production method of the present invention is placed on a desired site such as a semiconductor and melted by heating. , forming a film adhesive layer on and between the adherends that utilizes gap filling properties against unevenness and gaps on the base material, and temporarily fixing, arranging, and bonding the adherends together; Furthermore, the uncured composition layer is cured by one or more radical polymerization reactions selected from (i) a heat curing reaction and (ii) a photocuring reaction by irradiation with high energy rays, and the curing is performed between the adherends.
- the adherend can be adhered by forming a cured product of the flexible silicone sheet.
- the release film may be peeled off after heating the curable hot-melt silicone composition sheet to form a cured product.
- the timing of release from the curable silicone composition or cured product obtained therefrom may be selected.
- the curable organopolysiloxane composition sheet Since the curable organopolysiloxane composition sheet has hot-melt properties, it is softened or fluidized by heating the sheet before the final curing, and for example, unevenness and gaps are formed on the adherend surface of the adherend. However, the unevenness and gaps can be filled without any gaps to form a bonding surface with the adherend.
- various constant temperature baths, hot plates, electromagnetic heating devices, heating rolls, and the like can be used.
- an electric heat press, a diaphragm type laminator, a roll laminator, etc. are preferably used. .
- the hot-melt curable organopolysiloxane composition according to the present invention can be designed as a photocurable composition by irradiation with high-energy rays by selecting the component (C), while it can be designed to be a thermosetting composition by heating. It can also be designed as a composition.
- the curable silicone composition of the present invention can be applied to the composition of the present invention (or its semi-cured product) by high-energy rays such as ultraviolet rays. By irradiating with, a radical polymerization reaction proceeds to form a cured product.
- Usable high-energy rays include ultraviolet rays, gamma rays, X-rays, ⁇ -rays, electron beams, and the like.
- ultraviolet rays, X-rays, and electron beams emitted from a commercially available electron beam irradiation device can be mentioned, and ultraviolet rays are preferred from the viewpoint of practicality.
- High-pressure mercury lamps, medium-pressure mercury lamps, Xe—Hg lamps, deep UV lamps, and the like are suitable as the ultraviolet light source, and ultraviolet irradiation with a wavelength of 280 to 400 nm, preferably 300 to 400 nm, is preferred.
- Light sources with emission bands may also be used.
- the irradiation dose of high-energy rays varies depending on the type and amount of (C1) photoradical polymerization initiator and the degree of curing reaction. It is preferably within the range of 2 .
- Irradiation with high-energy rays may be performed with a substrate interposed therebetween as long as the substrate carrying the pressure-sensitive adhesive layer according to the present invention does not absorb electromagnetic waves in the above wavelength range. That is, if a certain amount of irradiation can be realized, high-energy rays may be irradiated through a base material or a cover material such as a protective film.
- low temperature means, for example, 100° C. or lower, specifically a temperature range of 15° C. to 100° C., and a temperature of 80° C. or lower can be selected.
- reaction of the composition of the present invention proceeds in a temperature range of 15 to 100 ° C., it is preferably around room temperature (a temperature range that can be reached without heating or cooling, and 20 to In particular, the temperature range of 25° C. is included), the composition may be left standing, may be cooled to room temperature or lower and 15° C.
- the time required for the curing reaction can be appropriately designed according to the irradiation dose of high-energy rays such as ultraviolet rays and the temperature. Furthermore, by interrupting the irradiation before reaching the predetermined cumulative irradiation dose, a cured product in the form of a semi-cured product that retains photocuring reactivity may be obtained. In addition, depending on the tolerance and necessity of the process, heating above 100° C. may be temporarily performed, or heat and pressure bonding may be performed at the same time to allow the curing reaction to proceed at the same time as the pressure bonding.
- the curable silicone composition of the present invention is heated to 100° C. or higher to promote radical polymerization reaction and cure. can form objects.
- the heating temperature can be appropriately selected according to the heat resistance of the base material, the sealing process, and the like. If the base material has high heat resistance, it can be heated at a high temperature of 150° C. or higher.
- the cured product of the hot-melt curable organopolysiloxane composition of the present invention has practical yellowing resistance under conditions of high temperature, high humidity, or exposure to ultraviolet rays, and is excellent in transparency. That is, by using the present composition, in a high temperature exposure test at 100 ° C. or an accelerated weathering test (hereinafter referred to as a QUV test) in accordance with ASTM G 154 Cycle 1, the thickness of the cured product is 200 um After 500 hours A cured product with a b * value of 2.0 or less, preferably 1.0 or less, can be obtained.
- the hot-melt curable organopolysiloxane composition of the present invention has hot-melt properties, is excellent in handling workability and curability when melted (hot-melt), and is obtained by curing the composition. Due to its excellent transparency and strong adhesion to substrates, it is useful for semiconductor members such as sealing materials for light emitting/optical devices, adhesive members, and light reflecting materials, and optical semiconductors having such cured products. Used. Furthermore, since the cured product has excellent mechanical properties, it can be used as a sealing agent for semiconductors; a sealing agent for power semiconductors such as SiC and GaN; suitable as an agent.
- the sheet-shaped curable hot-melt silicone composition of the present invention is also suitable as a material for sealing and bonding large-area substrates using press molding, compression molding, or a vacuum laminator.
- it is suitable for use as a sealing agent for semiconductors that use an overmolding method at the time of molding.
- the sheet of the present composition can be used as a curable film adhesive or as a stress buffer layer between two substrates having different coefficients of linear expansion.
- the hot-melt curable organopolysiloxane composition of the present invention can be used for large-area encapsulation of semiconductor substrates (including wafers). Furthermore, sheets obtained by molding the curable hot-melt silicone composition of the present invention into sheets can be used as die attach films, sealing of flexible devices, stress relaxation layers for bonding two different substrates, and the like. can. That is, the curable silicone composition of the present invention may be a sealant intended for single-sided encapsulation, or a sealant intended for double-sided encapsulation accompanied by adhesion between two substrates. and have favorable properties suitable for these applications.
- the use of the cured product obtained by curing the hot-melt curable organopolysiloxane composition of the present invention is not particularly limited.
- the composition of the present invention has hot-melt properties, excellent curability, excellent moldability and mechanical properties, and its cured product has practical yellowing resistance and maintains high transparency. It is possible to For this reason, the cured product obtained by curing the present composition can be suitably used as a member for semiconductor devices, such as sealing materials for semiconductor elements and IC chips, adhesives, adhesives, and bonding members for conductor devices. It can be suitably used as an adhesive member such as.
- the cured product can be designed with a very wide range of adhesion to the surface and substrate, and can be used for various purposes.
- the cured product according to the present invention has a low tack surface and excellent releasability of the cured layer, so it is suitable for use as a sealant; Cured products with a wide range of adhesion and adhesion capabilities, from those that result in interfacial delamination; to those that form permanent bonds/joints with cohesive failure of the cured product in the mode of peeling to substrates contacted during cure. Design is possible.
- the cured product or the surface of the substrate may be subjected to surface treatment such as primer treatment, corona treatment, etching treatment, plasma treatment, etc. good.
- the surface of the cured product that is not in contact with the substrate can be designed to have adhesion to other substrates, so that the surface of the cured product can be used as a pressure-sensitive adhesive surface, an adhesive surface, or a It can also be used as an adhesive surface, and is preferred.
- a semiconductor device comprising a member made of a cured product obtained by curing the hot-melt type curable organopolysiloxane composition of the present invention is not particularly limited.
- a transparent cured product it can be suitably used for applications that need to transmit light.
- it is preferably a light-emitting semiconductor device which is a light-emitting/optical device, an optical member for a display, a member for a solar panel, particularly a sealing material or an adhesive member used in these devices.
- the cured product of the present invention can be used more preferably as a sealing material or an adhesive member used in electronic materials in which transparency, light resistance, and heat resistance are important.
- the hot-melt curable organopolysiloxane composition according to the present invention is Step (E-1): A step of bringing the hot-melt curable organopolysiloxane composition of the present invention into close contact with a part or all of a base material that is a semiconductor device, an optical semiconductor device, or a precursor thereof; Step (E-2): A step of curing the hot-melt curable organopolysiloxane composition by one or more curing reactions selected from (i) heat-curing reaction and (ii) photo-curing reaction by irradiation with high-energy rays. It can be suitably used for a sealing method or a bonding method for a semiconductor device or an optical semiconductor device.
- the hot-melt curable organopolysiloxane composition according to the present invention is heated to flow to form unevenness or unevenness on the substrate, which is a semiconductor device, optical semiconductor device, or precursor thereof.
- the substrate which is a semiconductor device, optical semiconductor device, or precursor thereof.
- curable silicone composition (Preparation of curable silicone composition) Using the components shown below, curable reactive organopolysiloxane compositions shown in Examples and Comparative Examples in Table 1 were prepared as xylene solutions having a solid concentration of 70%. In addition, all % in the same table is the mass %. Also, the viscosity and plasticity of each component are measured values at 25°C.
- composition mass% of B component with respect to the total mass is defined as the content of component (B), and Table 1 shows "resin amount” (unit: mass%) ).
- resin/polymer ratio of composition Solid content of each composition (components that form a cured product, excluding organic solvents) relative to the total mass, the total mass% of the A component a, the synthetic mass% of the B component b, the total mass% of the D2 component
- the resin/polymer ratio of the composition is the weight ratio defined by b/(a+d2), where d2 is shown in Table 1.
- UV-LED ultraviolet irradiation device manufactured by JATEC
- ultraviolet rays with a wavelength of 405 nm are irradiated from the PET film side so that the ultraviolet irradiation amount (illuminance) is 4,000 mJ/ cm2 as an integrated light amount, and the composition is cured. Hardened. After cutting the same sample into a width of 25 mm, the release film was peeled off, and the cured composition surface was laminated to a SUS plate (manufactured by Paltec) using a roller to obtain a test piece.
- SUS plate manufactured by Paltec
- Table 1 shows the adhesive strength (gf/25 mm) of the test piece measured at a tensile speed of 300 mm/min using the 180° peeling test method according to JIS Z 0237.
- the rupture mode in peeling measurement was classified as "AF” when peeling occurred at the interface between the composition and SUS, and as “CF” when the composition itself was destroyed.
- the test pieces showing low workability of the release film laminate described later were not subjected to the peeling test and were evaluated as "NG”.
- the haze value of the test piece was measured with a spectral colorimeter CM-5 (manufactured by Konica Minolta). A haze value of less than 1 was classified as "O”, and a haze value of 1 or more was classified as "X”.
- the hot melt curable organopolysiloxane compositions of the present invention according to Examples 1-10 are solid to substantially non-flowing at room temperature (25°C), but at 80°C With a viscosity change of more than 80%, it is possible to achieve a melt viscosity suitable for sealing and adhesion, and furthermore, the cured product obtained by the photoradical polymerization reaction has excellent transparency and is practically sufficient for the substrate. It had a wide adhesive strength range.
- the composition of Example 1 or the like gives a cured product with low tackiness and excellent releasability (interfacial peelability) after hot-melt, so that the transparent sealing layer has excellent gap-filling properties and a non-sticky surface.
- the compositions of Example 3, etc. are useful only as a permanent adhesion between substrates and as a bonding layer, because the cured product after hot-melting exhibits cohesive failure at breakage in addition to strong adhesion.
- the cured product of Examples 9 and 10 maintained a haze value of 1 or more even under high humidity and dry conditions, and had good haze resistance.
- the hot-melt type curable organopolysiloxane composition according to the present invention is excellent at 80 ° C. when used in the manufacturing process of display devices or electronic devices including substrates with low stability at high temperatures. It is expected that a cured product that has sealing performance and adhesiveness, can be cured at room temperature by irradiation with high-energy rays, and has excellent appearance stability and transparency can be obtained.
- Comparative Examples 1 and 2 when the content of component (B) is small and the resin/polymer ratio in the composition is 1 or less, the composition has poor workability and is not practical. However, it was not possible to realize a good hot-melt property.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
(A)成分は、分子内に少なくとも2個のアルケニル基を有する鎖状のポリシロキサン分子であり、この組成物の主剤(ベースポリマー)である。(A)成分のオルガノポリシロキサンのアルケニル基としては、例えば、ビニル基、アリル基、ブテニル基、ペンテニル基、ヘキセニル基、ヘプテニル基などの炭素数2~10のアルケニル基が挙げられ、特にビニル基またはヘキセニル基であることが好ましい。(A)成分のアルケニル基の結合位置としては、例えば、分子鎖末端及び/又は分子鎖側鎖が挙げられる。本発明の技術的効果の見地から、(A)成分の少なくとも一部または全部が、分子鎖末端以外の部位のケイ素原子に結合したアルケニル基を有することが好ましく、分子鎖側鎖にアルケニル基を有する鎖状オルガノポリシロキサンの使用は、本発明の好適な実施形態の一つである。なお、(A)成分は、単一の成分のみを含んでいてもよく、2種以上の異なった成分の混合物であってもよい。
(A1)分子鎖両末端にのみ少なくとも2個のアルケニル基を有し、直鎖状又は分岐鎖状オルガノポリシロキサン、および
(A2)分子鎖末端以外の部位に少なくとも1個以上のアルケニル基を有し、かつ、分子内に少なくとも3個以上のアルケニル基を有する、直鎖状又は分岐鎖状オルガノポリシロキサン
から選ばれる1種類であってよく、両者を任意の質量比で含む混合物であってよい。また、これらの(A1)成分および(A2)成分は、さらに、粘度、シロキサン重合度またはアルケニル基の含有量が異なる2種類以上の成分の混合物であってもよく、かつ、好ましい。
(B)成分はオルガノポリシロキサン樹脂であり、組成物の固形分の全体質量に占める(B)成分の含有量が50質量%以上であることにより、組成物全体としてホットメルト性を実現するとともに、本発明にかかる組成物を硬化させてなる硬化生成物について、接着力、すなわち、基材への密着力を調整する成分である。すなわち、当該(B)成分の使用量応じて、本組成物の硬化物の硬さおよび基材に対する密着性を調整することが可能である。具体的には、(B)成分の含有量が少量であれば、硬化生成物は柔軟かつ基材表面への密着性は低く、基材間の剥離時に、界面剥離により、容易に基材表面から除去可能となる傾向がある。他方、(B)成分の含有量が多くなると、硬化生成物の基材表面に対する密着性が上昇する傾向があり、特に、本発明のように(A)成分100質量部に対して、100質量部を超える(B)成分を使用すると、粘着剤層が基材表面と強固な接合体を形成し、剥離時に接着剤層の凝集破壊を伴う、永久接着モードとなる傾向が認められる。
(B)成分中の水酸基またはアルコキシ基等の加水分解性基は、レジン構造中のシロキサン単位のうち、T単位またはQ単位などのケイ素に直接結合しており、原料となるシラン由来またはシランが加水分解した結果、生じた基であるので、合成したオルガノポリシロキサンレジンをトリメチルシラン等のシリル化剤で加水分解処理することで水酸基または加水分解性基の含有量を低減することができる。これにより、硬化物中において分子量の大きいオルガノポリシロキサンレジン構造が形成されることを抑制し、当該組成物の低温における硬化性および得られる硬化物層の貯蔵弾性率をさらに改善でき、基材に対する良好な密着性と高温に曝した後の基材表面からの除去性を改善できる場合がある。
(Me3SiO1/2)0.45(SiO4/2)0.55(HO1/2)0.05
(Me3SiO1/2)0.40(SiO4/2)0.60(HO1/2)0.10
(Me3SiO1/2)0.52(SiO4/2)0.48(HO1/2)0.01
(Me3SiO1/2)0.40(Me2ViSiO1/2)0.05 (SiO4/2)0.55(HO1/2)0.05
(Me3SiO1/2)0.45(SiO4/2)0.55(MeO1/2)0.10
(Me3SiO1/2)0.25(Me2PhSiO1/2)0.20(SiO4/2)0.55(HO1/2)0.05
(Me3SiO1/2)0.40(Me2SiO2/2)0.05(SiO4/2)0.55(HO1/2)0.05
(Me3SiO1/2)0.40(MeSiO3/2)0.05(SiO4/2)0.55(HO1/2)0.05
(Me3SiO1/2)0.40(Me2SiO2/2)0.05(MeSiO3/2)0.05(SiO4/2)0.50(HO1/2)0.05
(Me:メチル基、Ph:フェニル基、MeO:メトキシ基、HO:ケイ素原子結合水酸基。なお、ケイ素原子に対する水酸基の相対量を表すために、ケイ素原子含有単位の添字の合計量を1としており、(HO)1/2単位の添字が当該相対量を示す)
を挙げることができる。なお、接点障害防止等の見地から、(B)成分中の低分子量のシロキサンオリゴマーが低減ないし除去されていても良い。
(B)成分は、本発明にかかる組成物のホットメルト性を実現し、かつ、硬化生成物の貯蔵弾性率を調整し、所望の基材に対する密着性を付与する成分であるから、配合量は組成物の(A)成分の質量1~50質量部とした場合、50~99質量部の範囲であり、配合量が少ない場合においては、粘着剤層は比較的弱い基材に対する密着力を有し、配合量が多いと粘着剤層の基材に対する密着力が強く、強い接着性を示す。これにより、本発明にかかる硬化生成物は、基材への密着性と粘着力を、広い範囲で設計可能であるという利点を有する。
本発明に係る硬化性オルガノポリシロキサン組成物はホットメルト性および基材への密着性と粘着力を広い範囲で設計可能な硬化生成物を与えるため、鎖状の反応性シロキサン成分である(A)成分および後述する(D2)成分の和に対する、オルガノポリシロキサン樹脂である(B)成分の質量比(=[(B)成分の質量]/[(A)成分+(D2)成分の質量和])が1.0よりも大きいことが必要であり、1.1~5.0の範囲にあることが好ましい。(B)成分として、上記のオルガノポリシロキサン樹脂を選択し、かつ、鎖状のシロキサンポリマー成分に対して上記のレジン成分が前記範囲となるように配合されていると、組成物は全体として良好なホットメルト性を示し、かつ、その硬化により得られる硬化生成物において、室温における高い貯蔵弾性率および応力等の粘弾特性が好適に実現される傾向がある。
(C)成分はラジカル重合開始剤であり、(C1)光ラジカル重合開始剤、(C2)熱ラジカル重合開始剤、およびこれらの組み合わせであってよく、本発明にかかる硬化性オルガノポリシロキサン組成物の硬化および接着プロセス、基材の耐熱性や低エネルギー化の要求などに応じて、(C)成分の種類および硬化方法、硬化温度を適宜選択してよい。本発明にかかる組成物は、主剤である(A)成分中にアルケニル基を有するので、(C)成分の存在下、高エネルギー線の照射および/または加熱により、良好な硬化性を実現することができる。
過酸化ジアシル類としては、ベンゾイルパーオキサイド、ラウロイルパーオキサイド、デカノイルパーオキサイドが例示される。過酸化エステル類としては、1,1,3,3-テトラメチルブチルパーオキシネオデカノエート、α-クミルパーオキシネオデカノエート、tert-ブチルパーオキシネオデカノエート、tert-ブチルパーオキシネオヘプタノエート、tert-ブチルパーオキシピバレート、tert-ヘキシルパーオキシピバレート、1,1,3,3-テトラメチルブチルパーオキシ-2-エチルヘキサノエート、tert-アミルパーオキシル-2-エチルヘキサノエート、tert-ブチルパーオキシ-2-エチルヘキサノエート、tert-ブチルパーオキシイソブチレート、ジ-tert-ブチルパーオキシヘキサヒドロテレフタレート、tert-アミルパーオキシ-3,5,5―トリメチルヘキサノエート、tert-ブチルパーオキシ-3,5,5―トリメチルヘキサノエート、tert-ブチルパーオキシアセテート、tert-ブチルパーオキシベンゾエート、ジ-ブチルパーオキシトリメチルアディペートが例示される。過酸化カーボネート類としては、ジ-3-メトキシブチルパーオキシジカーボネート、ジ(2-エチルヘキシル)パーオキシジカーボネート、ジイソプロピルパーオキシカーボネート、tert-ブチルパーオキシイソプロピルカーボネート、ジ(4-tert-ブチルシクロヘキシル)パーオキシジカーボネート、ジセチルパーオキシジカーボネート、ジミリスチルパーオキシジカーボネートが例示される。
本組成物は、任意選択により、(C1)光ラジカル重合開始剤と組み合わせて(C´)光増感剤を用いることもできる。増感剤の使用は、重合反応の光量子効率を高めることができ、光開始剤のみを用いた場合と比べて、より長波長の光を重合反応に利用できるようになるために、組成物のコーティング厚さが比較的厚い場合、又は比較的長波長のLED光源を使用する場合に特に有効であることが知られている。増感剤としては、アントラセン系化合物、フェノチアジン系化合物、ペリレン系化合物、シアニン系化合物、メロシアニン系化合物、クマリン系化合物、ベンジリデンケトン系化合物、(チオ)キサンテンあるいは(チオ)キサントン系化合物、例えば、イソプロピルチオキサントン、2,4-ジエチルチオキサントン、スクアリウム系化合物、(チア)ピリリウム系化合物、ポルフィリン系化合物などが知られており、これらに限らず任意の光増感剤を本発明の硬化性オルガノポリシロキサン組成物および粘着剤組成物に用いることができる。その使用量は任意であるが、(C1)成分に対する(C´)の成分の質量比が0~10となる範囲であり、使用する場合には0.01~5となる範囲で選択するのが一般的である。
本組成物は、上記の(A)成分および任意で後述する(E)成分を含むため、ラジカル重合反応により、硬化生成物を形成する。ここで、(C)成分の少なくとも一部が(C1)光ラジカル重合開始剤である場合、本組成物は紫外線等の高エネルギー線を照射することで硬化させることができる。同様に、(C)成分の少なくとも一部が(C2)熱ラジカル重合開始剤である場合、本組成物は加熱により硬化させることができる。さらに、両者を組み合わせることで、加熱および高エネルギー線照射を選択または組み合わせて硬化させることが可能であり、所望とする硬化方法および封止/接着プロセスにより、適宜選択することができる。
本発明にかかる組成物は、さらに、任意で、(D1)単官能または多官能のビニル系単量体、および(D2)分子内に少なくとも1個のアクリル基またはメタクリル基を含む有機基を有するオルガノポリシロキサン化合物から選ばれる1種類以上のラジカル反応性成分を含んでもよい。なお、以下、「(メタ)アクリル酸」とは、アクリル酸およびメタクリル酸の双方を含むことを示す。同様に、「(メタ)アクリレート」、「(メタ)アクリロキシ」、「(メタ)アクリルアミド」もそれぞれ、アクリレート及びメタアクリレート、アクリロキシ及びメタアクリロキシ、アクリルアミド及びメタアクリルアミドの双方を含むことを示す。
一般式(1):
-R3-C(=O)-O-R4-で示される2価の有機基{式中、R3は炭素原子数2~22のアルキレン基であり、R4はエチレン基、プロピレン基、メチルエチレン基又はヘキシレン基から選択される基である}、
-Z1-X-C(=O)-X-Z2-で示される2価の有機基{式中、Z1は-O(CH2)k-(kは0~3の範囲の数)を表し、Xは酸素原子、窒素原子、または硫黄原子をあらわす。Z2は*であるポリシロキサンの主鎖を構成するケイ素原子に結合する-[(CH2)2O]m(CnH2n)-(mは0~3の範囲の数、nは2~10の範囲の数)で表される2価の有機基である}、および
後述する ―Z1-R2 2Si-O-R2 2Si―Z2-
で表される2価の連結基
から選ばれるいずれか1種類の基であることが好ましい。
(RA’R1 2SiO1/2)x(R1 2SiO2/2)y1(RA’R1SiO2/2)y2(R1SiO3/2)z1(RA’SiO3/2)z2 (I-2)
(RA’R1 2SiO1/2)a(R1 2SiO2/2)b1(RA’R1SiO2/2)b2(R1SiO3/2)c1(RA’SiO3/2)c2
(式中、R1,RA’は前記同様の基)
で表した場合、0<a≦10、15≦b1+b2<2000、0<c1+c2≦10であり、b2+c2=0の場合、RA’の少なくとも一つは、前記のアクリル基またはメタクリル基を含むケイ素原子結合官能基(RA)である。
(RA’R1 2SiO1/2)a(R1 2SiO2/2)b1(R1SiO3/2)c1
式中、R1,RA’は前記同様の基であり、0<a≦10、15≦b1<2000、0<c1≦10であり、RA’の少なくとも一つは、前記のアクリル基またはメタクリル基を含むケイ素原子結合官能基(RA)である。
本発明にかかる組成物は、上記の(B)成分としてオルガノポリシロキサン樹脂を含むものであるが、(B)成分の一部として、(B―2)分子内にRB 3SiO1/2およびRA aRB (3-a)SiO1/2で表されるM単位、及びQ単位を、Q単位に対するM単位の物質量の比が0.5~2.0の範囲で含むオルガノポリシロキサン樹脂を含んでよい。式中、aは1~3の整数を表し、RAはアクリル基またはメタクリル基を含むケイ素原子結合官能基であり、RBはRAを除く一価有機基であり、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基等のアルキル基;フェニル基、トリル基、キシリル基、ナフチル基等のアリール基;ベンジル基、フェネチル基等のアラルキル基;クロロメチル基、3-クロロプロピル基、3,3,3-トリフロロプロピル基等のハロゲン化アルキル基;ビニル基、アリル基、ブテニル基、ペンテニル基、ヘキセニル基等のアルケニル基を含んでも良い。工業的見地から、特に、メチル基、フェニル基、ビニル基、ヘキセニル基のいずれか1種類以上を含むことが好ましい。また、RBの少なくとも一部は炭素原子数2~12のアルケニル基であってよく、かつ、好ましい。また、(B-2)成分を構成するM単位のうち、少なくとも1個はRA aRB (3-a)SiO1/2で表される、官能基RAを含むトリオルガノシロキシ単位である。
本発明に係る組成物は、さらに、(E)分子内に少なくとも2個以上のチオール基(-SH)を有する多官能チオール化合物を含んでもよい。多官能のチオール化合物は連鎖移動剤として、ラジカル重合反応を促進するため、特に、本発明にかかる(C)成分の一部が光ラジカル重合開始剤であり、本組成物を紫外線等の高エネルギー線照射によって硬化させる場合、高エネルギー線の照射量が少ない場合でも硬化速度および硬化物の深部硬化性を改善できるほか、本組成物における架橋点としても機能する。
本組成物は、さらに、(F)成分として公知の接着付与剤を含んでもよい。(G)成分は、本組成物を硬化させてなる硬化物の基材に対する接着強度を向上させるものであり、公知の接着付与剤から1種類または2種類以上を選択して使用することができる。特に(F)成分の少なくとも一部として、分子内に2個以上のアルコキシシリル基を有する化合物を使用することで、接着力が一定時間経過後に大きく改善される場合がある。
(MeO)3SiCH2CH2(Me)2Si-O-SiMe(CH2CH2Si(OMe)3)-O-Si(Me)2CH2CH2Si(OMe)3
である(上式中、Meはメチル基である)。
本発明にかかる硬化性オルガノポリシロキサン組成物には、アルケニル基、アクリル基、メタクリル基等の炭素-炭素二重結合含有反応性基を含まないポリジメチルシロキサンまたはポリジメチルジフェニルシロキサンなどの非反応性のオルガノポリシロキサンを配合することができ、これにより、硬化生成物の損失係数(tanδ)、貯蔵弾性率(G’)および損失弾性率(G’’)を改善することができる場合がある。例えば、水酸基末端を有するポリジメチルシロキサンまたはポリジメチルジフェニルシロキサンの使用により、硬化生成物の損失係数を増加させることができ、そのような組成物は、本発明の範囲に包含される。
本発明にかかるホットメルト型硬化性オルガノポリシロキサン組成物は、25℃において固形または流動性に乏しい性質を有するので、本質的に、低溶剤型乃至無溶剤型の組成物である。一方、本組成物の基材への濡れ性改良や、(B)成分に付随する溶媒として不可避的に含まれる場合、有機溶剤を少量含むことは許容される。さらに、各成分を均一混合したり、後述するシート状乃至フィルム状のホットメルト型硬化性オルガノポリシロキサン組成物を得るために本組成物を塗工する必要がある場合には、一時的に本発明にかかるホットメルト型硬化性オルガノポリシロキサン組成物を1種類以上の有機溶媒を希釈剤または分散媒として分散させて混合してよく、さらに、分散液の形態でフィルム状またはシート状に塗工してもよい。この場合、最終的な混合組成物、フィルム状またはシート状に成型された組成物から、加熱乾燥等の手段により、有機溶媒は除去され、乾固した形態となることが好ましい。
本発明のホットメルト型硬化性オルガノポリシロキサン組成物はシート又はフィルム状にして使用することができ、特に、剥離層を備える2枚のフィルム状基材間に、上記の組成物からなるシート状材料が介装された構造を有する積層体として使用可能である。この剥離層を備えたフィルム状基材(一般に剥離フィルムという)は、ホットメルト型硬化性オルガノポリシロキサン組成物からなるシート状材料を接着剤あるいは封止剤等として用いるときに、シート状材料から剥離することができる。以下では、この積層体を剥離性積層体ともいう。
工程(I):上記のホットメルト型硬化性オルガノポリシロキサン組成物を基材上に塗布する工程、
工程(II):工程(I)で塗布した組成物を加熱乾燥させ、シート又はフィルム状に成形された組成物を得る工程
により得ることができる。ここで、工程(I)におけるホットメルト型硬化性オルガノポリシロキサン組成物を塗布する際には、それ自体を加熱溶融させて流動性のある状態で基材上に塗布してもよく、有機溶媒を用いて分散溶液の形態で基材上に塗布し、工程(II)において有機溶媒を除去してもよい。なお、基材上に剥離層が存在する場合、硬化性ホットメルトシリコーン組成物のシート又はフィルムは、次に述べる剥離性積層体の一部として得ることができる。なお、(C)成分の種類に応じ、本組成物は加熱によりラジカル重合性を有する場合があるので、そのような場合には、好適には150℃未満の温度条件で加熱乾燥を行うことが特に好ましい。
工程1:上記のホットメルト型硬化性オルガノポリシロキサン組成物の構成成分を混合する工程、
工程2:工程1で得た混合物を、加熱溶融しながら混練する工程、
工程3:工程2で得た加熱溶融後の混合物を、少なくとも1の剥離面を備えた2つの剥離フィルム間に、前記の混合物が剥離面と接するように積層して積層体を形成する工程、
工程4:工程3で得た積層体をロール間で加圧し、2つの剥離フィルムの間に介装された上記混合物を圧延して、特定の膜厚を有するホットメルト型硬化性オルガノポリシロキサン組成物シート又はフィルムを形成する工程
を含む方法を挙げることができる。さらに、任意選択により工程4において、冷却又は温度調節機能を有するロールを使用してもよい。また、工程4の後に、得られたホットメルト型硬化性オルガノポリシロキサン組成物のシート又はフィルムを含む積層体を裁断する工程を加えてもよい。また、工程2に代えて、工程1で得た混合物を有機溶媒に分散させた形態で剥離フィルム上に塗布し、工程3の前に有機溶媒を加熱等で除去してもよい。
本発明の製造方法により得られるシートは、上述した各成分を含むホットメルト型硬化性オルガノポリシロキサン組成物であり、かつホットメルト性を有する。本発明の硬化性ホットメルトシリコーン組成物シートは、加熱溶融性を有する粘着材、封止剤、及び/又は接着剤等として使用することができる。特に、当該硬化性ホットメルトシリコーン組成物シートは、成形性、ギャップフィル性、及び粘着力に優れ、ダイアタッチフィルムやフィルム接着剤として使用することができる。また、オーバーモールド成型用、コンプレッション成型用またはプレス成型用のホットメルト型硬化性オルガノポリシロキサン組成物シートとしても好適に使用することができ、半導体等の基材間の弾性粘着部材として好適に使用してもよい。
既に述べた通り、本発明にかかるホットメルト型硬化性オルガノポリシロキサン組成物は、(C)成分の選択により、高エネルギー線の照射による光硬化性組成物として設計できる一方、加熱による熱硬化性組成物として設計することもできる。
本発明のホットメルト型硬化性オルガノポリシロキサン組成物は、ホットメルト性を有し、溶融(ホットメルト)時の取扱い作業性および硬化性に優れ、かつ、本組成物を硬化させて得られる硬化物の透明性に優れ、かつ基材への粘着力が強いため、発光/光学デバイス用の封止材、粘着部材、光反射材等の半導体用部材および当該硬化物を有する光半導体に有用に用いられる。さらに、当該硬化物は機械的特性に優れているので、半導体用の封止剤;SiC、GaN等のパワー半導体用の封止剤;電気・電子用の接着剤、ポッティング剤、保護剤、コーティング剤として好適である。また、シート形状にした本発明の硬化性ホットメルトシリコーン組成物は、プレス成型、コンプレッション成型、あるいは真空ラミネーターなどを用いて大面積の基板の封止や接着するための材料として好適である。特に、成型時にオーバーモールド成型法を用いる半導体用の封止剤として用いることが好適である。さらに、本組成物をシート状にしたものは硬化性のフィルム接着剤や線膨張係数の違う2種類の基材の間の応力の緩衝層として使用する事ができる。
本発明のホットメルト型硬化性オルガノポリシロキサン組成物を硬化させて得られる硬化生成物の用途は特に制限されない。本発明の組成物は、ホットメルト性を有し、硬化性に優れ、成形性、機械的物性に優れ、かつ、その硬化生成物は実用的な耐黄変性を有し、透明性を高く維持することが可能である。このため、本組成物を硬化してなる硬化物は、半導体装置用部材として好適に利用することができ、半導体素子やICチップ等の封止材、導体装置の粘着剤、接着剤、結合部材等の接着部材として好適に用いることができる。特に、当該硬化生成物は、その表面および基材への密着力を非常に広い範囲で設計可能であり、様々な用途に利用できる。具体的には、本発明にかかる硬化生成物は、その表面が低タックとなり、硬化層の離型性に優れるため、封止剤用途に適合するもの;硬化時に接触した基材に対する剥離モードが界面剥離となるもの;硬化時に接触した基材に対する剥離モードにおいて、硬化生成物の凝集破壊を伴う永久接着/接合体を形成するものまで、幅広い範囲の密着性および接着能を有する硬化生成物を設計可能である。ここで、被着体と当該硬化生成物の密着性を向上させるために、硬化生成物または基材の表面に対してプライマー処理、コロナ処理、エッチング処理、プラズマ処理等の表面処理を行ってもよい。さらに、上記の場合、基材と接していない硬化生成物表面は他の基材への密着性を有するように設計することもできるので、当該硬化生成物表面を感圧接着面、粘着面または接着面として利用することもでき、かつ、好ましい。
本発明にかかるホットメルト型硬化性オルガノポリシロキサン組成物は、
工程(E-1):本発明にかかるホットメルト型硬化性オルガノポリシロキサン組成物と、半導体装置、光半導体装置またはそれらの前駆体である基材の一部または全部と密着させる工程、
工程(E-2):(i)加熱硬化反応および(ii)高エネルギー線の照射による光硬化反応から選ばれる1種類以上の硬化反応によりホットメルト型硬化性オルガノポリシロキサン組成物を硬化させる工程
を含む、半導体装置または光半導体装置の封止方法または接着方法に好適に利用可能である。
Waters社製ゲルパーミエーションクロマトグラフィー(GPC)を用い、テトラヒドロフラン(トルエン)を溶媒として、標準ポリスチレン換算で、オルガノポリシロキサンレジン等のオルガノポリシロキサン成分の重量平均分子量(Mw)、数平均分子量(Mn)を求めた。
下記に示す各成分を用いて、表1の各実施例、比較例に示す硬化反応性のオルガノポリシロキサン組成物を、固形分濃度70%のキシレン溶液として調製した。なお、同表における%は全て質量%である。また、各成分の粘度および可塑度は25℃における測定値である。
(A1)可塑度が125の両末端トリメチルシロキシ基封鎖ジメチルシロキサン・(5-ヘキセニル)メチルシロキサン共重合物生ゴム(ビニル基含有量:0.79質量%)
(A2)可塑度が120の両末端トリメチルシロキシ基封鎖ジメチルシロキサン・メチルビニルシロキサン共重合物生ゴム(ビニル基含有量:0.84質量%)
(A3)粘度37Pa・sの両末端ジメチルビニルシロキシ基封鎖ジメチルシロキサン重合物(ビニル基含有量:0.10質量%)
(B1)分子内にMe3SiO1/2で表されるシロキサン単位(M単位)、及び、SiO4/2で表されるシロキサン単位(Q単位)を1.0:1.0のモル比で含むオルガノポリシロキサン樹脂(トルエンを溶媒として用いたGPCにより測定される重量平均分子量(Mw)は7,000)
(B2)分子内にMe2RSiO1/2(Rはメチル基またはビニル基)で表されるシロキサン単位(M単位)、及び、SiO4/2で表されるシロキサン単位(Q単位)を1.0:1.0のモル比で含むオルガノポリシロキサン樹脂(ビニル基含有量:1.90質量%、トルエンを溶媒として用いたGPCにより測定される重量平均分子量(Mw)は8,000)
(C1-1)2,4,6-トリメチルベンゾイルジフェニルフォスフィンオキサイド(製品名Omnirad TPO、IGM Resins社製)
(D1-1)アクリル酸ドデシル(=ドデシルアクリレート)(東京化成工業製)
(D1-2)二メタクリル酸1,3-ブタンジオール(=1,3―ブタンジオールジメタクリレート)(和光純薬工業製)
(D1-3)1,12-ビス(メタクリロイルオキシ)ドデカン(東京化成工業製)
(D1-4)トリエチレングリコールジ(メタ)アクリレート(東京化成工業製)
(D1-5)ポリエチレングリコールジ(メタ)アクリラート(平均重合度9)(東京化成工業製)
(D2-1)両末端ジメチル(アクリロイルオキシオクチル)シロキシ基封鎖ジメチルシロキサン重合物(C3H3O2基含有量:8.43質量%)
(D2-2)両末端トリメチルシロキシ基封鎖ジメチルシロキサン・メチル{6-[3-(3-メタクリロイルオキシプロピル)-1,1,3,3-テトラメチルジシロキシ]ヘキセニル}シロキサン重合物(C4H5O2基含有量:2.49質量%)
各組成物の固形分(有機溶媒を除く、硬化物を形成する成分)全体質量に対するB成分の合成質量%を(B)成分の含有量とし、表1に「レジン量」(単位:質量%)として記載した。
(組成物のレジン/ポリマー比)
各組成物の固形分(有機溶媒を除く、硬化物を形成する成分)全体質量に対して、A成分の合計質量%をa、B成分の合成質量%をb、D2成分の合計質量%をd2としたとき、当該組成物のレジン/ポリマー比は、b/(a+d2)により定義される質量比であり、表1中に示した。
厚みが200ミクロンのフィルム状硬化前組成物をせん断回転治具-試料台間に密着させ、アントンパール製MCR302を用い、試料の温度を25℃から100℃まで2℃/minの速度で昇温しながら、試料にせん断応力をかけ(せん断ひずみ0.05%、周波数1Hz)複素粘度を測定した。表1中の複素粘度の単位は103Pa・sであり、粘度変化率は、25℃の複素粘度に対する80℃の複素粘度の比を百分率表記した値である。
各組成物を、PETフィルム(東レ製、ルミラー(登録商標)S10、厚さ50μm)に硬化後の厚みが55μmとなるように塗工し、100℃のオーブン中で10分間乾燥させ、室温冷却後、離型フィルム(ニッパ製、FSC-6、厚さ50μm)を組成物面に被せ離型フィルム積層体を作製した。UV-LED紫外線照射装置(JATEC製)を用いて、PETフィルム側から、紫外線照射量(照度)が積算光量として4,000mJ/cm2となるように波長405nmの紫外線を照射し、組成物を硬化させた。同試料を幅25mmに切断後、離型フィルムを剥がし、硬化組成物面をSUS板(パルテック製)にローラーを用いて貼り合せて試験片とした。同試験片に対し、JIS Z 0237に従う180°引き剥がし試験方法を用いて引張速度300mm/minにより測定された粘着力(gf/25mm)を表1に示した。引きはがし測定における破断モードは、組成物とSUSの界面で剥離した場合を「AF」、組成物自体が破壊された場合を「CF」に分類した。また、後述の離型フィルム積層体の作業性が低かった試験片については引き剥がし試験を実施せず「NG」とした。
前段の(紫外線硬化性組成物のフィルム作製)と同様にして、実施例1~10,比較例1~2について未硬化の紫外線硬化性組成物のフィルムを含む離型フィルム積層体を作製した。紫外線照射を行うことなく、紫外線硬化性組成物のフィルムを離型フィルムから引き剥がしたところ、実施例1~10については紫外線硬化性組成物のフィルムを破損等を生じることなく、離型層から界面剥離することができ、良好な作業性を有することが確認できた。他方、比較例1~2については、紫外線硬化性組成物のフィルムを離型フィルムから引き剥がす際に、離型層において紫外線硬化性組成物のフィルムの泣き別れおよび破損を生じ、界面剥離を行うことができなかった。
各組成物を、離型フィルム(ニッパ製、FSC-6、厚さ50μm)に硬化後の厚みが200μmとなるように塗工し、100℃のオーブン中で10分間乾燥させた。2枚の無アルカリガラス板(コーニング製)を該フィルム状組成物で貼り合わせ、紫外線照射量(照度)が積算光量として4,000mJ/cm2となるように波長405nmの紫外線を照射し、組成物を硬化させた試験片を作製した。2時間後、該試験片のヘイズ値を分光側色計CM-5(コニカミノルタ製)で測定した。ヘイズ値が1未満を「〇」、1以上を「×」に分類した。
Claims (12)
- (A)分子内に2以上のアルケニル基を有する鎖状オルガノポリシロキサン 1~50質量部、
(B)分子内にR3SiO1/2(式中、Rは互いに独立して一価有機基を表す)で表されるシロキサン単位(M単位)、およびSiO4/2表されるシロキサン単位(Q単位)を含有してなり、Q単位1モルに対するM単位の物質量比が0.5~2.0の範囲にあるオルガノポリシロキサン樹脂 50~99質量部、および
(C)ラジカル重合開始剤 0.1~10質量部
(D)以下の(D1)成分および(D2)成分から選ばれる1種類以上のラジカル反応性成分 0~50質量部
(D1)単官能または多官能のビニル系単量体、および
(D2)分子内に少なくとも1個のアクリル基またはメタクリル基を含む有機基を有するオルガノポリシロキサン化合物
を含有し、組成物の固形分の全体質量に対して、(B)成分の含有量が50質量%以上であり、かつ、(A)成分および(D2)成分の質量の和に対する(B2)成分の質量の比が1.0より大きい、ホットメルト型硬化性オルガノポリシロキサン組成物。 - (D)成分の少なくとも一部が、(D1-1)炭素原子数8~30の単官能または多官能のビニル系単量体である、請求項1に記載のホットメルト型硬化性オルガノポリシロキサン組成物。
- (C)成分の少なくとも一部が(C1)光ラジカル重合開始剤であり、高エネルギー線の照射による光硬化性を有することを特徴とする、請求項1~請求項3のいずれか1項に記載のホットメルト型硬化性オルガノポリシロキサン組成物。
- (C)成分の少なくとも一部が(C2)熱ラジカル重合開始剤であり、加熱硬化性を有することを特徴とする、請求項1~請求項4のいずれか1項に記載のホットメルト型硬化性オルガノポリシロキサン組成物。
- 80℃における硬化前組成物の複素粘度が500,000Pa・s以下である、請求項1~請求項5のいずれか1項に記載のホットメルト型硬化性オルガノポリシロキサン組成物。
- 請求項1~請求項6のいずれか1項に記載のホットメルト型硬化性オルガノポリシロキサン組成物を硬化または半硬化させてなる、硬化生成物。
- シート状又はフィルム状に成形された、請求項1~請求項6のいずれか1項に記載のホットメルト型硬化性オルガノポリシロキサン組成物。
- 請求項8に記載のホットメルト型硬化性オルガノポリシロキサン組成物のシート又はフィルムと、当該組成物のシート又はフィルムの片面または両面に貼付された、当該組成物のシート又はフィルムに対向する剥離面を備えたシート又はフィルム状基材とを有し、当該組成物のシート又はフィルムが、剥離面を備えたシート又はフィルム状基材から剥離可能である、剥離性積層体。
- 請求項7に記載の硬化生成物を有する半導体装置または光半導体装置。
- 工程(I):任意で有機溶媒に分散した形態で、請求項1~請求項6のいずれか1項に記載のホットメルト型硬化性オルガノポリシロキサン組成物を基材上に塗布する工程、
工程(II):工程(I)で塗布した組成物を加熱乾燥させ、シート又はフィルム状に成形された組成物を得る工程
を有する、請求項8に記載の硬化性ホットメルトシリコーン組成物のシート又はフィルムの製造方法。 - 工程(E-I):請求項1~請求項6のいずれか1項に記載のホットメルト型硬化性オルガノポリシロキサン組成物と、半導体装置、光半導体装置またはそれらの前駆体である基材の一部または全部と密着させる工程、
工程(E-2):(i)加熱硬化反応および(ii)高エネルギー線の照射による光硬化反応から選ばれる1種類以上の硬化反応によりホットメルト型硬化性オルガノポリシロキサン組成物を硬化させる工程を含む、半導体装置または光半導体装置の封止方法または接着方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020247011798A KR20240055833A (ko) | 2021-09-14 | 2022-09-08 | 핫멜트형 경화성 오가노폴리실록산 조성물, 당해 조성물의 경화 생성물 및 당해 조성물로 이루어진 필름 등의 제조방법 |
JP2023548438A JPWO2023042743A1 (ja) | 2021-09-14 | 2022-09-08 | |
CN202280061375.1A CN117940471A (zh) | 2021-09-14 | 2022-09-08 | 热熔型固化性聚有机硅氧烷组合物、该组合物的固化产物、以及由该组合物形成的膜等的制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021149269 | 2021-09-14 | ||
JP2021-149269 | 2021-09-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2023042743A1 true WO2023042743A1 (ja) | 2023-03-23 |
Family
ID=85602832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2022/033707 WO2023042743A1 (ja) | 2021-09-14 | 2022-09-08 | ホットメルト型硬化性オルガノポリシロキサン組成物、該組成物の硬化生成物、および該組成物からなるフィルム等の製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2023042743A1 (ja) |
KR (1) | KR20240055833A (ja) |
CN (1) | CN117940471A (ja) |
WO (1) | WO2023042743A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0286678A (ja) * | 1988-09-21 | 1990-03-27 | Shin Etsu Chem Co Ltd | シリコーン系感圧接着剤組成物 |
JP2005053966A (ja) * | 2003-08-05 | 2005-03-03 | Shin Etsu Chem Co Ltd | 熱硬化性オルガノポリシロキサン組成物および接着剤 |
JP2016124967A (ja) * | 2014-12-26 | 2016-07-11 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、それからなる半導体用封止剤および半導体装置 |
JP2020523422A (ja) * | 2018-06-29 | 2020-08-06 | ダウ シリコーンズ コーポレーション | 無溶剤シリコーン感圧接着剤並びにその製造方法及び使用方法 |
JP2021045953A (ja) * | 2019-09-14 | 2021-03-25 | ダウ・東レ株式会社 | ホットメルト性を有する硬化性シリコーンシートの製造方法 |
WO2021124724A1 (ja) * | 2019-12-20 | 2021-06-24 | マクセルホールディングス株式会社 | ダイシング用粘着テープおよび半導体チップの製造方法 |
JP2021108319A (ja) * | 2019-12-27 | 2021-07-29 | ダウ・東レ株式会社 | 電子装置用基板の封止方法及び封止された電子装置用基板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102370815B1 (ko) | 2014-06-20 | 2022-03-08 | 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 | 핫 멜트성 실리콘 및 경화성 핫 멜트 조성물 |
WO2017068762A1 (en) | 2015-10-19 | 2017-04-27 | Dow Corning Toray Co., Ltd. | Active energy ray curable hot melt silicone composition, cured product thereof, and method of producing film |
KR102458788B1 (ko) | 2020-04-24 | 2022-10-26 | 주식회사 케이씨씨 | 미서기창 구조 |
-
2022
- 2022-09-08 KR KR1020247011798A patent/KR20240055833A/ko unknown
- 2022-09-08 WO PCT/JP2022/033707 patent/WO2023042743A1/ja active Application Filing
- 2022-09-08 CN CN202280061375.1A patent/CN117940471A/zh active Pending
- 2022-09-08 JP JP2023548438A patent/JPWO2023042743A1/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0286678A (ja) * | 1988-09-21 | 1990-03-27 | Shin Etsu Chem Co Ltd | シリコーン系感圧接着剤組成物 |
JP2005053966A (ja) * | 2003-08-05 | 2005-03-03 | Shin Etsu Chem Co Ltd | 熱硬化性オルガノポリシロキサン組成物および接着剤 |
JP2016124967A (ja) * | 2014-12-26 | 2016-07-11 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、それからなる半導体用封止剤および半導体装置 |
JP2020523422A (ja) * | 2018-06-29 | 2020-08-06 | ダウ シリコーンズ コーポレーション | 無溶剤シリコーン感圧接着剤並びにその製造方法及び使用方法 |
JP2021045953A (ja) * | 2019-09-14 | 2021-03-25 | ダウ・東レ株式会社 | ホットメルト性を有する硬化性シリコーンシートの製造方法 |
WO2021124724A1 (ja) * | 2019-12-20 | 2021-06-24 | マクセルホールディングス株式会社 | ダイシング用粘着テープおよび半導体チップの製造方法 |
JP2021108319A (ja) * | 2019-12-27 | 2021-07-29 | ダウ・東レ株式会社 | 電子装置用基板の封止方法及び封止された電子装置用基板 |
Also Published As
Publication number | Publication date |
---|---|
CN117940471A (zh) | 2024-04-26 |
KR20240055833A (ko) | 2024-04-29 |
JPWO2023042743A1 (ja) | 2023-03-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108026373B (zh) | 活性能量射线可固化的热熔融有机硅组合物、该组合物的固化产物和制备膜的方法 | |
KR102539917B1 (ko) | 경화성 및 광학적으로 투명한 감압성 접착제 및 그의 용도 | |
CN108472926B (zh) | 可剥离组合物 | |
TW201134857A (en) | Process for preparing clustered functional polyorganosiloxanes, and methods for their use | |
TWI791076B (zh) | 附離型膜之黏著片材及其製造方法 | |
JP2010132755A (ja) | 電離放射線硬化性再剥離粘着剤組成物 | |
JP2017088853A (ja) | 分枝状ポリオルガノシロキサン並びに関連する硬化性組成物、方法、使用及びデバイス | |
JP2013216726A (ja) | 光学用粘着剤組成物及びこれを用いた光学機能性フィルム | |
WO2022181446A1 (ja) | ポリオキシアルキレン鎖を有する化合物及び(メタ)アクリルアミド化合物を含有する組成物 | |
US20240132645A1 (en) | Composition containing compound having polyoxyalkylene chain and compound having poly(meth)acrylate chain | |
CN117043236A (zh) | 共改性有机聚硅氧烷以及包含其的固化性有机聚硅氧烷组合物 | |
JP2012025808A (ja) | アクリル系粘着剤、粘着シート、アクリル系樹脂組成物 | |
WO2023042745A1 (ja) | 硬化性オルガノポリシロキサン組成物、その硬化により得られる微粘着性のオルガノポリシロキサン粘着剤層および積層体 | |
WO2019044046A1 (ja) | フィルム状透明接着剤、及び赤外線センサーモジュール | |
KR20170023010A (ko) | 1k uv 및 열 경화성 고온 탈결합가능한 접착제 | |
WO2023042743A1 (ja) | ホットメルト型硬化性オルガノポリシロキサン組成物、該組成物の硬化生成物、および該組成物からなるフィルム等の製造方法 | |
JP2021516280A (ja) | 粘着剤組成物 | |
JP7173258B2 (ja) | 接着剤組成物及び構造体 | |
JP6821580B2 (ja) | 熱硬化性樹脂フィルム及び第1保護膜形成用シート | |
JPH03234721A (ja) | 放射線硬化性組成物 | |
WO2023017746A1 (ja) | 硬化性ホットメルトシリコーン組成物、該組成物の硬化生成物、および該組成物からなるフィルム等の製造方法 | |
CN110651016B (zh) | 粘接剂组合物、固化物、叠层体以及装置 | |
WO2023042744A1 (ja) | 硬化性オルガノポリシロキサン組成物、その硬化により得られるオルガノポリシロキサン粘着剤層および積層体 | |
WO2017078087A1 (ja) | 接着剤組成物及び構造体 | |
WO2023223978A1 (ja) | ポリオキシアルキレン鎖を有する化合物及びエステル系チキソ付与剤を含有する組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22869890 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2023548438 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 202280061375.1 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 18691858 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 20247011798 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |