JPWO2023042744A5 - - Google Patents
Info
- Publication number
- JPWO2023042744A5 JPWO2023042744A5 JP2023548439A JP2023548439A JPWO2023042744A5 JP WO2023042744 A5 JPWO2023042744 A5 JP WO2023042744A5 JP 2023548439 A JP2023548439 A JP 2023548439A JP 2023548439 A JP2023548439 A JP 2023548439A JP WO2023042744 A5 JPWO2023042744 A5 JP WO2023042744A5
- Authority
- JP
- Japan
- Prior art keywords
- curing
- curable organopolysiloxane
- organopolysiloxane composition
- laminate
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021149267 | 2021-09-14 | ||
| PCT/JP2022/033708 WO2023042744A1 (ja) | 2021-09-14 | 2022-09-08 | 硬化性オルガノポリシロキサン組成物、その硬化により得られるオルガノポリシロキサン粘着剤層および積層体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023042744A1 JPWO2023042744A1 (cg-RX-API-DMAC7.html) | 2023-03-23 |
| JPWO2023042744A5 true JPWO2023042744A5 (cg-RX-API-DMAC7.html) | 2025-09-10 |
Family
ID=85602861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023548439A Pending JPWO2023042744A1 (cg-RX-API-DMAC7.html) | 2021-09-14 | 2022-09-08 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240392165A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JPWO2023042744A1 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20240055834A (cg-RX-API-DMAC7.html) |
| CN (1) | CN117980364A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2023042744A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7655547B2 (ja) * | 2021-11-08 | 2025-04-02 | 協立化学産業株式会社 | 仮固定用、マスキング用又は成型用光硬化性樹脂組成物 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0726085B2 (ja) * | 1988-09-21 | 1995-03-22 | 信越化学工業株式会社 | シリコーン系感圧接着剤組成物 |
| JP2005053966A (ja) * | 2003-08-05 | 2005-03-03 | Shin Etsu Chem Co Ltd | 熱硬化性オルガノポリシロキサン組成物および接着剤 |
| JP6451165B2 (ja) | 2014-09-12 | 2019-01-16 | 信越化学工業株式会社 | 紫外線硬化型オルガノポリシロキサン組成物及びシリコーンゲル硬化物並びに圧力センサー |
| JP6586555B2 (ja) * | 2014-12-26 | 2019-10-09 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、それからなる半導体用封止剤および半導体装置 |
| EP3636723B1 (en) | 2017-06-06 | 2024-09-18 | Shin-Etsu Chemical Co., Ltd. | Ultraviolet-curable pressure-sensitive silicone adhesive composition and cured object obtained therefrom |
| CN111527151B (zh) | 2017-12-28 | 2022-06-24 | 信越化学工业株式会社 | 紫外线固化型有机聚硅氧烷组合物、有机硅凝胶固化物及其制造方法以及压力传感器 |
| US20210246337A1 (en) * | 2018-06-29 | 2021-08-12 | Dow Silicones Corporation | Solventless silicone pressure sensitive adhesive and methods for making and using same |
| WO2020092199A1 (en) | 2018-10-29 | 2020-05-07 | Intel Corporation | Connectivity enhancement |
| JP7424733B2 (ja) * | 2019-09-14 | 2024-01-30 | ダウ・東レ株式会社 | ホットメルト性を有する硬化性シリコーンシートの製造方法 |
| KR102841521B1 (ko) * | 2019-12-20 | 2025-08-04 | 맥셀 주식회사 | 다이싱용 점착 테이프 및 반도체칩의 제조 방법 |
| JP7450388B2 (ja) * | 2019-12-27 | 2024-03-15 | ダウ・東レ株式会社 | 電子装置用基板の封止方法及び封止された電子装置用基板 |
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2022
- 2022-09-08 KR KR1020247011799A patent/KR20240055834A/ko active Pending
- 2022-09-08 CN CN202280061991.7A patent/CN117980364A/zh active Pending
- 2022-09-08 JP JP2023548439A patent/JPWO2023042744A1/ja active Pending
- 2022-09-08 US US18/691,859 patent/US20240392165A1/en active Pending
- 2022-09-08 WO PCT/JP2022/033708 patent/WO2023042744A1/ja not_active Ceased