TWI773759B - 紫外線硬化型聚矽氧黏著劑組成物及其硬化物 - Google Patents
紫外線硬化型聚矽氧黏著劑組成物及其硬化物 Download PDFInfo
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- TWI773759B TWI773759B TW107117335A TW107117335A TWI773759B TW I773759 B TWI773759 B TW I773759B TW 107117335 A TW107117335 A TW 107117335A TW 107117335 A TW107117335 A TW 107117335A TW I773759 B TWI773759 B TW I773759B
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- acrylate
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- mass
- adhesive composition
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- -1 polysiloxane Polymers 0.000 title claims abstract description 87
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 66
- 239000000203 mixture Substances 0.000 title claims abstract description 42
- 239000000853 adhesive Substances 0.000 title claims abstract description 41
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 41
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 8
- 229910004283 SiO 4 Inorganic materials 0.000 claims abstract description 6
- 125000004430 oxygen atom Chemical group O* 0.000 claims abstract description 6
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract 4
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 125000002947 alkylene group Chemical group 0.000 claims description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 4
- 125000004386 diacrylate group Chemical group 0.000 claims description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 claims description 2
- COORVRSSRBIIFJ-UHFFFAOYSA-N 2-[2-(2-hydroxyethoxy)ethoxy]-1-methoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(O)COCCOCCO COORVRSSRBIIFJ-UHFFFAOYSA-N 0.000 claims description 2
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 claims description 2
- ZVYGIPWYVVJFRW-UHFFFAOYSA-N 3-methylbutyl prop-2-enoate Chemical group CC(C)CCOC(=O)C=C ZVYGIPWYVVJFRW-UHFFFAOYSA-N 0.000 claims description 2
- OIRWCSXDSJUCJN-UHFFFAOYSA-N 4-ethyl-1-(2-hydroxyethoxy)octan-2-ol;prop-2-enoic acid Chemical compound OC(=O)C=C.CCCCC(CC)CC(O)COCCO OIRWCSXDSJUCJN-UHFFFAOYSA-N 0.000 claims description 2
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 claims description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 2
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 claims description 2
- FNVQPLCHYJQMHP-UHFFFAOYSA-N methyl prop-2-enoate oxolane Chemical compound C(C=C)(=O)OC.O1CCCC1 FNVQPLCHYJQMHP-UHFFFAOYSA-N 0.000 claims description 2
- 239000003505 polymerization initiator Substances 0.000 claims description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 claims 2
- IAMASUILMZETHW-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.OCCOCC(O)OC1=CC=CC=C1 IAMASUILMZETHW-UHFFFAOYSA-N 0.000 claims 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Substances OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 claims 1
- 239000003999 initiator Substances 0.000 abstract description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 abstract description 3
- 150000001875 compounds Chemical class 0.000 abstract description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 1
- 229920005591 polysilicon Polymers 0.000 abstract 1
- 239000000047 product Substances 0.000 description 18
- 150000002430 hydrocarbons Chemical group 0.000 description 14
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 3
- LESMLVDJJCWZAJ-UHFFFAOYSA-N 2-(diphenylphosphorylmethyl)-1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 LESMLVDJJCWZAJ-UHFFFAOYSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000006459 hydrosilylation reaction Methods 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 2
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 125000000219 ethylidene group Chemical group [H]C(=[*])C([H])([H])[H] 0.000 description 2
- 125000005816 fluoropropyl group Chemical group [H]C([H])(F)C([H])([H])C([H])([H])* 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
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- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
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- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 1
- HGCMSCWGVAYWHR-UHFFFAOYSA-N 1,3,5-trimethyl-2-[[phenyl-[(2,4,6-trimethylphenyl)methyl]phosphoryl]methyl]benzene Chemical compound CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)CC1=C(C)C=C(C)C=C1C HGCMSCWGVAYWHR-UHFFFAOYSA-N 0.000 description 1
- OBNIRVVPHSLTEP-UHFFFAOYSA-N 1-ethoxy-2-(2-hydroxyethoxy)ethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(O)COCCO OBNIRVVPHSLTEP-UHFFFAOYSA-N 0.000 description 1
- 125000006017 1-propenyl group Chemical group 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- IQQVCMQJDJSRFU-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO IQQVCMQJDJSRFU-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical group CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical group CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 1
- QOSMNYMQXIVWKY-UHFFFAOYSA-N Propyl levulinate Chemical compound CCCOC(=O)CCC(C)=O QOSMNYMQXIVWKY-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- PSGCQDPCAWOCSH-BREBYQMCSA-N [(1r,3r,4r)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] prop-2-enoate Chemical compound C1C[C@@]2(C)[C@H](OC(=O)C=C)C[C@@H]1C2(C)C PSGCQDPCAWOCSH-BREBYQMCSA-N 0.000 description 1
- VKPVUNFNWSJTBJ-UHFFFAOYSA-N [dimethyl(trimethylsilyloxy)silyl]methyl prop-2-enoate Chemical compound C[Si](C)(C)O[Si](C)(C)COC(=O)C=C VKPVUNFNWSJTBJ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000003872 anastomosis Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- TWXFLJCBBWFZQZ-UHFFFAOYSA-N benzene;ethenoxyethene Chemical group C=COC=C.C1=CC=CC=C1 TWXFLJCBBWFZQZ-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 125000005998 bromoethyl group Chemical group 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
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- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- YGHUUVGIRWMJGE-UHFFFAOYSA-N chlorodimethylsilane Chemical compound C[SiH](C)Cl YGHUUVGIRWMJGE-UHFFFAOYSA-N 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- UWGIJJRGSGDBFJ-UHFFFAOYSA-N dichloromethylsilane Chemical compound [SiH3]C(Cl)Cl UWGIJJRGSGDBFJ-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000005429 oxyalkyl group Chemical group 0.000 description 1
- 229960005222 phenazone Drugs 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
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- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- 239000003381 stabilizer Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
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Abstract
含有:(A)1分子中具有2個下述通式(1)(R1
表示碳數1~20之一價烴基,R2
表示氧原子等,R3
表示丙烯醯氧基烷基等,p表示滿足0≦p≦10、a表示滿足1≦a≦3之數) 表示之基的有機聚矽氧烷100份、 (B)不包含矽氧烷結構之單官能(甲基)丙烯酸酯化合物及(C)不包含矽氧烷結構之多官能(甲基)丙烯酸酯化合物之至少一方1~500份、 (D)由(a)R4 3
SiO1/2
單位(R4
表示碳數1~10之一價烴基)與(b)SiO4/2
單位所構成,且以莫耳比計(a):(b)=0.6~1.2:1之有機聚矽氧烷樹脂1~5000份 (E)光聚合起始劑0.01~20份 的紫外線硬化型聚矽氧黏著劑組成物,作業性、硬化性良好,會獲得作為臨時固定材而具有優良黏著性、強度之硬化物。
Description
本發明係關於紫外線硬化型聚矽氧黏著劑組成物及其硬化物,進一步詳述時,係關於可適合地使用於用以移送物體的臨時固定材之紫外線硬化型聚矽氧黏著劑組成物及其硬化物。
近年來,對以智慧型手機、液晶顯示器、車載零件等為代表般的電子機器,係要求不僅高性能化,亦同時要求省空間化、省能源化。因應如此的社會需求所搭載的電氣電子零件亦愈加小型化/微細化,其組裝步驟亦年年複雜化而變得困難。
可將如此之微細化之元件或零件予以選擇性且一次移送之技術近年來被開發,受到注目(非專利文獻1)。 該技術係稱為微轉移印刷技術,其係以彈性體之黏著力將微細之零件一次拾取,移送至黏著力更強的所期望之場所之技術。
用於該用途之黏著材料,已知有聚矽氧彈性體,並提出有多數加熱硬化型之無溶劑型聚矽氧系黏著劑(專利文獻1~3)。 但是,使用加熱硬化型之聚矽氧系黏著劑時,加熱步驟為必須,因此以能源為必要,又,材料之加熱及冷卻係需要許多時間。
為了節省如此之步驟,亦進行了能夠以紫外線短時間硬化之聚矽氧樹脂的開發(專利文獻4),但是因其係利用聚矽氧素材本身所具有的黏著力者,因此係有密合力不充分,可適用之元件或零件受限的問題。 因此,對於以上述專利文獻4之材料無法黏起之元件或零件亦可適用之具有更強力黏著力的紫外線硬化性黏著聚矽氧材料受到期望。
但是,單純只增加黏著力,係有容易招致將黏著劑由移送物剝離時之凝集破壞,並且黏著劑殘存於所移送之元件或零件的問題,故能夠進行紫外線硬化,可配合構件來調節由弱的黏著力至強的黏著力,又,具有強的黏著力同時,於剝離時卻不產生凝集破壞之材料的開發受到強烈期望。 [先前技術文獻] [專利文獻]
[專利文獻1] 日本專利第5825738號公報 [專利文獻2] 日本專利第2631098號公報 [專利文獻3] 日本專利第5234064號公報 [專利文獻4] 日本專利第5989417號公報 [非專利文獻]
[非專利文獻1] JOHN A. ROGERS、「Transfer printing by kinetic control of adhesion to an elastometric stamp」, nature materials, Nature Publishing Group,平成17(2005)年12月11日、第6卷、p.33-38
[發明所欲解決之課題]
本發明係有鑑於上述實情而為者,其目的為提供作業性及硬化性良好,會獲得作為臨時固定材而具有優良黏著性及強度之硬化物的紫外線硬化型聚矽氧黏著劑組成物及其硬化物。 [用以解決課題之手段]
本發明者等人,為了達成上述目的,進行努力探討的結果,發現藉由使用具有特定之含有(甲基)丙烯醯氧基之基的有機聚矽氧烷、不包含矽氧烷結構之單官能(甲基)丙烯酸酯化合物及/或不包含矽氧烷結構之多官能(甲基)丙烯酸酯化合物,及特定之有機聚矽氧烷樹脂,可得到藉由紫外線照射會迅速硬化,且具有良好之黏著性與強度的紫外線硬化型聚矽氧組成物,而完成本發明。
亦即,本發明提供 1. 一種紫外線硬化型聚矽氧黏著劑組成物,其特徵為含有下述(A)~(E)而成: (A) 1分子中具有2個下述通式(1)(式中,R1
係互相獨立地表示碳原子數1~20之一價烴基,R2
表示氧原子或碳原子數1~20之伸烷基,R3
表示丙烯醯氧基烷基、甲基丙烯醯氧基烷基、丙烯醯氧基烷氧基,或甲基丙烯醯氧基烷氧基,p表示滿足0≦p≦10之數,a表示滿足1≦a≦3之數) 表示之基的有機聚矽氧烷:100質量份、 (B)不包含矽氧烷結構之單官能(甲基)丙烯酸酯化合物及(C)不包含矽氧烷結構之多官能(甲基)丙烯酸酯化合物之任一方或雙方:1~500質量份、 (D)由(a)R4 3
SiO1/2
單位(式中,R4
表示碳原子數1~10之一價烴基)與(b)SiO4/2
單位所構成,且(a)單位與(b)單位之莫耳比為0.6~1.2:1的範圍之有機聚矽氧烷樹脂:1~5,000質量份,以及 (E)光聚合起始劑:0.01~20質量份; 2. 如1之紫外線硬化型聚矽氧黏著劑組成物,其中進一步含有相對於(A)成分100質量份而言,為0.1~1,000質量份的(F)1分子中具有1個丙烯醯氧基烷基或甲基丙烯醯氧基烷基之有機聚矽氧烷; 3. 如1或2之紫外線硬化型聚矽氧黏著劑組成物,其於23℃之黏度為100,000mPa・s以下; 4. 一種如1~3中任一項之紫外線硬化型聚矽氧黏著劑組成物之硬化物; 5. 一種黏著劑,其係由如4之硬化物所構成。 [發明之效果]
本發明之紫外線硬化型聚矽氧黏著劑組成物,作業性及硬化性良好,且其硬化物係作為臨時固定材而具有優良之黏著性及強度。
以下具體說明本發明。 本發明之紫外線硬化型聚矽氧黏著劑組成物,其特徵為含有下述(A)~(E)而成: (A)1分子中具有2個下述通式(1)表示之基的有機聚矽氧烷:100質量份、 (B)不包含矽氧烷結構之單官能(甲基)丙烯酸酯化合物及(C)不包含矽氧烷結構之多官能(甲基)丙烯酸酯化合物之任一方或雙方:1~500質量份、 (D)由(a)R4 3
SiO1/2
單位(式中,R4
表示碳原子數1~10之非取代或取代之一價烴基)與(b)SiO4/2
單位所構成,且(a)單位與(b)單位之莫耳比為0.6~1.2:1的範圍之有機聚矽氧烷樹脂:1~5000質量份,以及 (E)光聚合起始劑:0.01~20質量份。
(A)有機聚矽氧烷 本發明中所使用之(A)成分,為本組成物之交聯成分,其係1分子中具有2個下述通式(1)表示之基,且主鏈實質上由二有機矽氧烷單位之重複所構成的有機聚矽氧烷。
式(1)中,R1
係互相獨立地表示碳原子數1~20之一價烴基,較佳為表示脂肪族不飽和基以外之碳原子數1~10、更佳為1~8之一價烴基,R2
表示氧原子或碳原子數1~20、較佳為1~10、更佳為1~5之伸烷基,R3
表示丙烯醯氧基烷基、甲基丙烯醯氧基烷基、丙烯醯氧基烷氧基,或甲基丙烯醯氧基烷氧基,p表示滿足0≦p≦10之數,a表示滿足1≦a≦3之數。
式(1)中,R1
之碳原子數1~20之一價烴基,係直鏈、分支、環狀均可,其具體例子,可列舉甲基、乙基、n-丙基、異丙基、n-丁基、異丁基、tert-丁基、n-己基、環己基、n-辛基、2-乙基己基、n-癸基等之烷基;乙烯基、烯丙基(2-丙烯基)、1-丙烯基、異丙烯基、丁烯基等之烯基;苯基、甲苯基、二甲苯基、萘基等之芳基;苄基、苯基乙基、苯基丙基等之芳烷基等。 又,鍵結於此等一價烴基之碳原子的氫原子之一部分或全部,亦可被其他取代基取代,其具體例子,可列舉氯甲基、溴乙基、三氟丙基、氰基乙基等之鹵素取代烴基,或氰基取代烴基等。 此等之中,R1
尤以碳原子數1~5之烷基、苯基為佳,更佳為甲基、乙基、苯基。
又,R2
之碳原子數1~20之伸烷基,係直鏈、分支、環狀均可,其具體例子,可列舉亞甲基、伸乙基、伸丙基、三亞甲基、四亞甲基、伸異丁基、五亞甲基、六亞甲基、七亞甲基、八亞甲基、九亞甲基、伸癸基等。 此等之中,R2
尤以氧原子、亞甲基、伸乙基、伸丙基為佳,更佳為氧原子或伸乙基。
進一步地,R3
之丙烯醯氧基烷基、甲基丙烯醯氧基烷基、丙烯醯氧基烷氧基,或甲基丙烯醯氧基烷氧基中之烷(伸烷)基之碳數,並無特殊限定,較佳為1~10、更佳為1~5。此等烷基之具體例子,可列舉上述R1
所例示之基當中,碳原子數為1~10者。 R3
之具體例子,可列舉下述式表示者,但不限定於此等。
上述p表示滿足0≦p≦10之數,較佳為0或1,a表示滿足1≦a≦3之數,較佳為1或2。
本發明中使用的(A)成分之有機聚矽氧烷分子中的上述通式(1)表示之基的鍵結位置,可為分子鏈末端、可為分子鏈非末端(亦即,分子鏈途中或分子鏈側鏈),或亦可為此等兩者,但就柔軟性方面而言,較期望僅存在於末端。
(A)成分之有機聚矽氧烷分子中,鍵結於上述通式(1)表示之基以外的矽原子之有機基,例如可列舉與上述R1
相同之基,特別係以脂肪族不飽和基以外之碳數1~12、較佳為1~10之一價烴基為適宜。 此等之具體例子,可列舉與上述R1
所例示之基相同者,就合成之簡便性而言,較佳為烷基、芳基、鹵化烷基,更佳為甲基、苯基、三氟丙基。
又,(A)成分之分子結構,基本上為主鏈為由二有機矽氧烷單位之重複所構成的直鏈狀或分支鏈狀(包含於主鏈之一部分具有分支的直鏈狀),特佳為分子鏈兩末端經上述通式(1)表示之基封端的直鏈狀之二有機聚矽氧烷。 (A)成分可為具有此等之分子結構的單一聚合物、由此等之分子結構所構成的共聚物,或此等之聚合物的2種以上之混合物。
若考慮到更提高組成物之作業性或硬化物之力學特性,(A)成分之有機聚矽氧烷之於25℃之黏度,較佳為10~100,000mPa・s、更佳為10~50,000mPa・s。通常,直鏈狀有機聚矽氧烷的情況時,該黏度範圍,以數平均聚合度計,係相當於約10~2,000、較佳為約50~1,100左右者。再者,本發明中,黏度可藉由旋轉黏度計(例如BL型、BH型、BS型、錐板型、流變計等)測定(以下相同)。 本發明中,聚合度(或分子量)例如能夠以甲苯等為展開溶劑,以凝膠滲透層析(GPC)分析中之聚苯乙烯換算的數平均聚合度(或數平均分子量)的形式求得(以下相同)。
(A)成分之有機聚矽氧烷之具體例子,可列舉下述(2)~(4)表示者,但不限定於此等。
如此之有機聚矽氧烷,能夠以公知之方法製造。例如,上述式(2)表示之有機聚矽氧烷,可作為兩末端二甲基乙烯基矽烷氧基封端二甲基矽氧烷/二苯基矽氧烷共聚物與甲基丙烯酸3-(1,1,3,3-四甲基二矽氧烷基)丙酯(CAS No.96474-12-3)的矽氫化反應物而得到。 上述式(3)表示之有機聚矽氧烷,可使丙烯酸2-羥基乙酯反應於兩末端二甲基乙烯基矽烷氧基封端二甲基矽氧烷/二苯基矽氧烷共聚物與氯二甲基矽烷之矽氫化反應物而得到。 上述式(4)表示之有機聚矽氧烷,可使丙烯酸2-羥基乙酯反應於兩末端二甲基乙烯基矽烷氧基封端二甲基矽氧烷/二苯基矽氧烷共聚物與二氯甲基矽烷之矽氫化反應物而得到。
(B)不包含矽氧烷結構之單官能(甲基)丙烯酸酯化合物 不包含矽氧烷結構之單官能(甲基)丙烯酸酯化合物(B)之具體例子,可列舉丙烯酸異戊酯、丙烯酸月桂酯、丙烯酸硬脂酯、乙氧基-二乙二醇丙烯酸酯、甲氧基-三乙二醇丙烯酸酯、2-乙基己基-二甘醇丙烯酸酯、丙烯酸苯氧基乙酯、苯氧基二乙二醇丙烯酸酯、丙烯酸四氫呋喃甲酯、丙烯酸異莰酯等,此等可單獨使用亦可混合2種以上使用。 此等之中尤特別以丙烯酸異莰酯為佳。
(C)不包含矽氧烷結構之多官能(甲基)丙烯酸酯化合物 不包含矽氧烷結構之多官能(甲基)丙烯酸酯化合物(C)之具體例子,可列舉三乙二醇二丙烯酸酯、聚四亞甲二醇二丙烯酸酯、新戊二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、二羥甲基-三環癸烷二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、季戊四醇四丙烯酸酯等,此等可單獨使用亦可混合2種以上使用。 此等之中,尤特別以二羥甲基-三環癸烷二丙烯酸酯為佳。
本發明中,上述(B)成分及(C)成分之(甲基)丙烯酸酯化合物的添加量,相對於(A)成分100質量份而言,係1~500質量份之範圍。(B)成分及(C)成分之添加量,相對於(A)成分100質量份而言,未達1質量份時,組成物之硬化性、硬化物之強度或黏著性不足。另一方面,可藉由增加(B)成分及(C)成分之添加量,來調整組成物全體的黏度,但添加量相對於(A)成分100質量份而言,超過500質量份時,硬化物之硬度會必要以上地增高,而得不到所期望之黏著性。 特別地,(B)成分及(C)成分之添加量,相對於(A)成分100質量份而言,較佳為10~200質量份。
(D)有機聚矽氧烷樹脂 (D)成分為對硬化物賦予黏著性之成分,其係由(a)R4 3
SiO1/2
單位(式中,R4
為碳原子數1~10之一價烴基)與(b)SiO4/2
單位所構成,且(a)單位與(b)單位之莫耳比為0.6~1.2:1之範圍的有機聚矽氧烷樹脂。 R4
中之碳原子數1~10之一價烴基之具體例子,可列舉上述R1
所例示之基當中,碳原子數為1~10者,其中尤以甲基、乙基、n-丙基、n-丁基等之碳原子數2~6之烷基;苯基、甲苯基等之碳原子數6~10之芳基、苄基等之碳原子數7~10之芳烷基;乙烯基、烯丙基、丁烯基等之碳原子數2~6之烯基等為佳。 再者,上述R4
之一價烴基亦與R1
同樣地,鍵結於碳原子的氫原子之一部分或全部,可被上述之其他取代基取代。
本發明之(D)成分中,(a)R4 3
SiO1/2
單位(M單位)與(b)SiO4/2
單位(Q單位)之莫耳比係M單位:Q單位=0.6~1.2:1,M單位之莫耳比未達0.6時,硬化物之黏著力或黏性可能降低,超過1.2時,硬化物之黏著力或保持力可能降低。 考慮到使硬化物之黏著力、保持力及黏性處於更適當範圍時,M單位與Q單位之莫耳比,較佳係M單位:Q單位=0.7~1.2:1。
(E)光聚合起始劑 本發明中可使用之光聚合起始劑之具體例子,可列舉2,2-二乙氧基苯乙酮、2,2-二甲氧基-1,2-二苯基乙烷-1-酮(BASF製Irgacure 651)、1-羥基-環己基-苯基-酮(BASF製Irgacure 184)、2-羥基-2-甲基-1-苯基-丙烷-1-酮(BASF製Irgacure 1173)、2-羥基-1-{4-[4-(2-羥基-2-甲基-丙醯基)-苄基]-苯基}-2-甲基-丙烷-1-酮(BASF製Irgacure 127)、苯基乙醛酸甲酯(BASF製Irgacure MBF)、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基丙烷-1-酮(BASF製Irgacure 907)、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-1-丁酮(BASF製Irgacure 369)、雙(2,4,6-三甲基苄醯基)-苯基膦氧化物(BASF製Irgacure 819)、2,4,6-三甲基苄醯基-二苯基-膦氧化物(BASF製Irgacure TPO)等,此等可單獨使用、亦可組合2種以上使用。 此等之中,就與(A)成分之相溶性的觀點而言,尤以2,2-二乙氧基苯乙酮、2-羥基-2-甲基-1-苯基-丙烷-1-酮(BASF製Irgacure 1173)、雙(2,4,6-三甲基苄醯基)-苯基膦氧化物(BASF製Irgacure 819)、2,4,6-三甲基苄醯基-二苯基-膦氧化物(BASF製Irgacure TPO)為佳。
光聚合起始劑之添加量,相對於(A)100質量份而言,係0.1~20質量份之範圍。未達0.1質量份時硬化性不足,添加超過20質量份之量時,深部硬化性惡化。
(F)有機聚矽氧烷 本發明之紫外線硬化型聚矽氧黏著劑組成物,於上述必須成分以外,亦可依需要含有1分子中具有1個丙烯醯氧基烷基,或甲基丙烯醯氧基烷基之有機聚矽氧烷。藉由於組成物中含有本成分,可調節其硬化物之柔軟性或黏著性。 丙烯醯氧基烷基之具體例子,可列舉丙烯醯氧基丁基、丙烯醯氧基丙基,甲基丙烯醯氧基烷基之具體例子,可列舉甲基丙烯醯氧基丁基、甲基丙烯醯氧基丙基等,就合成之容易性而言,較佳為甲基丙烯醯氧基丙基或丙烯醯氧基丙基。
本成分之有機聚矽氧烷分子中,鍵結於丙烯醯氧基烷基,或甲基丙烯醯氧基烷基以外的矽原子之有機基,例如可列舉與上述R1
相同之基,特佳為脂肪族不飽和基以外之碳數1~12、較佳為1~10之一價烴基。 此等之具體例子,可列舉與上述R1
所例示之基相同者,就合成之簡便性而言,較佳為烷基、芳基、鹵化烷基,更佳為甲基、苯基、三氟丙基。
(F)成分之有機聚矽氧烷之於25℃之黏度,當考慮到更提高組成物之作業性或硬化物之力學特性時,較佳為1~100,000mPa・s、更佳為1~10,000mPa・s。通常,直鏈狀有機聚矽氧烷的情況時,該黏度範圍,以數平均聚合度計,係相當於約5~1,000、較佳為約5~500左右者。
(F)成分之有機聚矽氧烷分子中之丙烯醯氧基烷基,或甲基丙烯醯氧基烷基的鍵結位置,可為分子鏈末端、亦可為分子鏈非末端(亦即,分子鏈途中或分子鏈側鏈),就合成之容易性、成本方面而言,較佳為於1分子之單末端存在有1個丙烯醯氧基烷基,或甲基丙烯醯氧基烷基者。
如此之(F)成分之具體例子,可列舉下述式(5)、(6)表示者,但不限定於此等。
再者,本發明之組成物中,在不損及本發明之效果的範圍,可摻合色材(顏料或染料)、矽烷偶合劑、接著助劑、聚合抑制劑、抗氧化劑、耐光性安定劑即紫外線吸收劑、光安定劑等之添加劑。 又,本發明之組成物亦能夠與其他樹脂組成物適當混合來使用。
本發明之紫外線硬化型聚矽氧黏著劑組成物,可將上述(A)~(E)成分,以及依需要之(F)成分及其他成分,以任意順序混合、攪拌等而得到。攪拌等之操作所用的裝置並無特殊限定,可使用擂潰機(Raikai mixer)、3輥、球磨機、行星式混合機等。又,亦可適當組合此等裝置。
本發明之紫外線硬化型聚矽氧黏著劑組成物之黏度並無特殊限定,就作業性之觀點而言,於23℃較佳為100,000mPa・s以下、更佳為50,000mPa・s以下。再者,其下限值並無特殊限定,通常係100mPa・s左右。
本發明之黏著性紫外線硬化性聚矽氧組成物,藉由照射紫外線,會迅速地硬化。 此時,所照射之紫外線的光源,例如可列舉UVLED燈、高壓水銀燈、超高壓水銀燈、金屬鹵化物燈、碳弧燈、氙燈等。 紫外線之照射量(累積光量),例如對於將本發明之組成物成形為2.0mm左右的厚度之薄片,較佳為1~10,000mJ/cm2
、更佳為10~6,000mJ/cm2
。亦即,使用照度100mW/cm2
之紫外線時,係照射紫外線0.01~100秒左右即可。 本發明中,藉由紫外線照射所得到的硬化物之黏著力,並無特殊限定,考慮到移送物之剝離性與保持性的平衡時,較佳為0.01~100MPa、更佳為0.02~50MPa。
又,本發明之紫外線硬化型聚矽氧黏著劑組成物,亦可藉由塗佈於各種基材並進行紫外線硬化,而利用作為黏著性物品。 基材可無特殊限制地使用塑膠薄膜、玻璃、金屬等。 塑膠薄膜可列舉聚乙烯薄膜、聚丙烯薄膜、聚酯薄膜、聚醯亞胺薄膜、聚氯乙烯薄膜、聚偏二氯乙烯薄膜、聚乙烯醇薄膜、聚碳酸酯薄膜、聚苯乙烯薄膜、乙烯-乙酸乙烯基共聚物薄膜、乙烯-乙烯醇共聚物薄膜、三乙醯基纖維素薄膜等。 就玻璃而言,厚度或種類等亦無特殊限制,亦可為經化學強化處理等者。 再者,為了提高基材與黏著劑層之密合性,亦可使用對基材預先施以底塗劑處理、電漿處理等者。
塗覆方法例如可由旋轉塗佈器、缺角輪塗佈器、唇口塗佈器、輥塗佈器、模塗佈器、刀式塗佈器、刮刀塗佈器、棒塗佈器、吻合塗佈器、凹版塗佈器、網版塗覆、浸漬塗覆、流延塗覆等之公知塗覆方法中適當選擇來使用。
本發明之紫外線硬化型聚矽氧黏著劑組成物係無溶劑型,因此作為硬化物之製作方法,亦可為使用模具之灌封(potting)。 流入灌封之模具時可能包入氣泡,但可藉由減壓來脫泡。模具例如可使用於矽晶圓上藉由光阻賦予了所期望之凹凸的阻劑模。 硬化後,欲由模具中取出硬化物時,較佳為於流入組成物之前對容器實施脫模劑處理。脫模劑可使用氟系、聚矽氧系等者。
再者,本發明之紫外線硬化型聚矽氧黏著劑組成物,通常係直接使用,但以操作性、對基材之塗佈性等之改善為必要時,於不損及本發明之特性的範圍內亦容許以有機溶劑稀釋後使用。 [實施例]
以下,列舉實施例及比較例以更具體說明本發明,但本發明不限定於此等之實施例。 再者,實施例中使用之各成分的化合物係如以下所示。 (A)成分
(B)成分 (B-1) 丙烯酸異莰酯(共榮社化學(股)製LIGHT ACRYLATE IB-XA) (B-2) (丙烯醯氧基甲基)-五甲基二矽氧烷
(C)成分 (C-2) 二羥甲基-三環癸烷二丙烯酸酯(共榮社化學(股)製LIGHT ACRYLATE DCP-A) (D)成分 (D-1)含有Me3
SiO1/2
單位及SiO2
單位,且(Me3
SiO1/2
單位)/(SiO2
單位)之莫耳比為0.85之有機聚矽氧烷樹脂(數平均分子量3,500)之60質量%甲苯溶液 (E)成分 (E-1)2-羥基-2-甲基-1-苯基-丙烷-1-酮(BASF Japan(股)製Irgacure 1173) (F)成分
[實施例1~4及比較例1~3] 以表1之組成混合上述(A)~(F)成分,於減壓下100℃餾去甲苯,調製表1記載之各聚矽氧組成物。再者,表1中之組成物的黏度係使用旋轉黏度計於23℃所測定之值。 使用EYE GRAPHICS(股)製Eye UV電子控制裝置(型式UBX0601-01),將所調製之聚矽氧組成物,於氮環境下、室溫(25℃),以用波長365nm之紫外光的照射量成為4,000mJ/cm2
的方式照射紫外線,使其硬化。硬化物之硬度係根據日本橡膠協會標準規格SRIS0101來測定。 硬化物之黏著性,係藉由(股)島津製作所製小型桌上試驗機EZ-SX來測定。具體而言,係將1mm見方之SUS製探針以1MPa壓抵於1mm厚之硬化物15秒後,測定以200mm/min之速度拉伸時所施加的負荷之值。又,以目視亦評估試驗體之表面的凝集破壞之有無。該等結果一併示於表1。
如表1所示,實施例1~4中調製之紫外線硬化型聚矽氧黏著劑組成物,具有良好的作業性、硬化性,其硬化物具有優良的黏著性,並且不引起凝集破壞,故具有優良的強度,有用於作為用以移送元件等之微小物體的臨時固定材。 另一方面,不含有(B)成分及(C)成分之比較例1中,可知組成物極為高黏度,作業性不良。 又,(D)成分之摻合量在本發明之範圍外而過多之比較例2中,可知組成物固體化,操作變得困難。 進一步地,於(B)成分使用包含矽氧烷結構之單官能丙烯酸酯化合物的比較例3中,可知黏著性雖高,但黏著性試驗中引起凝集破壞,硬化物的強度不充分。
Claims (5)
- 一種紫外線硬化型聚矽氧黏著劑組成物,其特徵為含有下述(A)~(E)而成:(A)1分子中具有2個下述通式(1)
- 如請求項1之紫外線硬化型聚矽氧黏著劑組成物,其中進一步含有相對於(A)成分100質量份而言,為0.1~1,000質量份的(F)1分子中具有1個丙烯醯氧基烷基或甲基丙烯醯氧基烷基之有機聚矽氧烷。
- 如請求項1或2之紫外線硬化型聚矽氧黏著劑組成物,其於23℃之黏度為100,000mPa.s以下。
- 一種如請求項1~3中任一項之紫外線硬化型聚矽氧黏著劑組成物之硬化物。
- 一種黏著劑,其係由如請求項4之硬化物所構成。
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JPWO2018225430A1 (ja) | 2020-04-02 |
US20200131408A1 (en) | 2020-04-30 |
CN110709488A (zh) | 2020-01-17 |
KR20200015594A (ko) | 2020-02-12 |
TW201906955A (zh) | 2019-02-16 |
EP3636723A1 (en) | 2020-04-15 |
EP3636723A4 (en) | 2021-04-14 |
US11124680B2 (en) | 2021-09-21 |
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JP6927298B2 (ja) | 2021-08-25 |
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