JPWO2023032735A1 - - Google Patents
Info
- Publication number
- JPWO2023032735A1 JPWO2023032735A1 JP2023545464A JP2023545464A JPWO2023032735A1 JP WO2023032735 A1 JPWO2023032735 A1 JP WO2023032735A1 JP 2023545464 A JP2023545464 A JP 2023545464A JP 2023545464 A JP2023545464 A JP 2023545464A JP WO2023032735 A1 JPWO2023032735 A1 JP WO2023032735A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
- C08K5/5477—Silicon-containing compounds containing nitrogen containing nitrogen in a heterocyclic ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/016—Manufacture or treatment using moulds
- H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
- H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
- H10W74/476—Organic materials comprising silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021140798 | 2021-08-31 | ||
| PCT/JP2022/031579 WO2023032735A1 (ja) | 2021-08-31 | 2022-08-22 | 硬化性シリコーン組成物、その硬化物、およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023032735A1 true JPWO2023032735A1 (https=) | 2023-03-09 |
| JPWO2023032735A5 JPWO2023032735A5 (https=) | 2025-08-13 |
Family
ID=85412558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023545464A Pending JPWO2023032735A1 (https=) | 2021-08-31 | 2022-08-22 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250002719A1 (https=) |
| EP (1) | EP4397721A4 (https=) |
| JP (1) | JPWO2023032735A1 (https=) |
| KR (1) | KR20240051216A (https=) |
| CN (1) | CN117881748A (https=) |
| TW (1) | TW202319483A (https=) |
| WO (1) | WO2023032735A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024236999A1 (ja) * | 2023-05-12 | 2024-11-21 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物、およびその製造方法 |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS528854B2 (https=) | 1972-01-13 | 1977-03-11 | ||
| JP3831481B2 (ja) | 1996-11-18 | 2006-10-11 | 東レ・ダウコーニング株式会社 | カルバシラトラン誘導体、その製造方法、接着促進剤、および硬化性シリコーン組成物 |
| JP2001019933A (ja) | 1999-07-09 | 2001-01-23 | Dow Corning Toray Silicone Co Ltd | シリコーン系接着性シート、およびその製造方法 |
| WO2013051600A1 (ja) | 2011-10-04 | 2013-04-11 | 株式会社カネカ | 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード |
| KR101322326B1 (ko) | 2011-11-10 | 2013-10-28 | 주식회사 고려에프앤디 | 탁상용 제진장치 |
| JP5814175B2 (ja) | 2012-04-16 | 2015-11-17 | 信越化学工業株式会社 | Ｌｅｄのリフレクター用熱硬化性シリコーン樹脂組成物並びにこれを用いたｌｅｄ用リフレクター及び光半導体装置 |
| JP6212122B2 (ja) * | 2012-12-28 | 2017-10-11 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP6072662B2 (ja) | 2013-10-10 | 2017-02-01 | 信越化学工業株式会社 | シリコーン樹脂組成物、該組成物を用いた積層板、及び該積層板を有するｌｅｄ装置 |
| JP2015114390A (ja) | 2013-12-09 | 2015-06-22 | 住友ベークライト株式会社 | 接着シート、接着シート付き光導波路、光電気混載基板、光電気混載基板の製造方法、光モジュールおよび電子機器 |
| JP6658508B2 (ja) | 2014-03-25 | 2020-03-04 | 住友ベークライト株式会社 | エポキシ樹脂組成物および静電容量型指紋センサー |
| JP6018608B2 (ja) * | 2014-08-08 | 2016-11-02 | 日東電工株式会社 | 封止シート、その製造方法、光半導体装置および封止光半導体素子 |
| JP6455260B2 (ja) | 2015-03-19 | 2019-01-23 | 住友ベークライト株式会社 | コネクター付き光導波路およびコネクター付き光導波路の製造方法 |
| JP2017179185A (ja) | 2016-03-31 | 2017-10-05 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物および半導体装置 |
| WO2018030288A1 (ja) | 2016-08-08 | 2018-02-15 | 東レ・ダウコーニング株式会社 | 硬化性粒状シリコーン組成物、それからなる半導体用部材、およびその成型方法 |
| KR20180030288A (ko) | 2016-09-12 | 2018-03-22 | 삼성디스플레이 주식회사 | 각필터를 갖는 표시장치 |
| WO2018155253A1 (ja) * | 2017-02-23 | 2018-08-30 | 東レ株式会社 | 蛍光体シート、それを用いたｌｅｄチップおよびｌｅｄパッケージ、ｌｅｄパッケージの製造方法、ならびにｌｅｄパッケージを含む発光装置、バックライトユニットおよびディスプレイ |
| JP7135278B2 (ja) | 2017-04-28 | 2022-09-13 | 住友ベークライト株式会社 | 封止用樹脂組成物及び電子装置の製造方法 |
| WO2018235491A1 (ja) | 2017-06-19 | 2018-12-27 | 東レ・ダウコーニング株式会社 | 硬化性粒状シリコーン組成物、それからなる半導体用部材、およびその成型方法 |
| JP6950299B2 (ja) | 2017-06-26 | 2021-10-13 | 住友ベークライト株式会社 | 封止材用樹脂組成物及びこれを用いた電子装置 |
| JP2020023643A (ja) | 2018-08-08 | 2020-02-13 | 住友ベークライト株式会社 | 封止用樹脂組成物、ウエハーレベルパッケージ、パネルレベルパッケージおよび電子装置 |
| JP7155929B2 (ja) | 2018-11-20 | 2022-10-19 | 住友ベークライト株式会社 | モールドアンダーフィル材料および電子装置 |
| JP7247550B2 (ja) | 2018-11-29 | 2023-03-29 | 住友ベークライト株式会社 | 封止用エポキシ樹脂組成物、及び、電子装置 |
| JP7247563B2 (ja) | 2018-12-07 | 2023-03-29 | 住友ベークライト株式会社 | 封止用樹脂組成物およびパワーモジュール |
| JP7243186B2 (ja) | 2018-12-27 | 2023-03-22 | 住友ベークライト株式会社 | 封止用樹脂組成物、中空パッケージおよびその製造方法 |
| JP7283089B2 (ja) | 2019-01-30 | 2023-05-30 | 住友ベークライト株式会社 | 半導体パッケージおよびそれに用いる封止用エポキシ樹脂組成物 |
| JP2020125399A (ja) | 2019-02-04 | 2020-08-20 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物および半導体装置 |
| JP2020132750A (ja) | 2019-02-19 | 2020-08-31 | 住友ベークライト株式会社 | 封止用樹脂組成物およびそれを用いた電子装置 |
| JP2020132771A (ja) | 2019-02-21 | 2020-08-31 | 住友ベークライト株式会社 | 封止用樹脂組成物および電子装置 |
| JP2020152844A (ja) | 2019-03-20 | 2020-09-24 | 住友ベークライト株式会社 | 封止用樹脂組成物および電子装置 |
| JP7354567B2 (ja) | 2019-03-27 | 2023-10-03 | 住友ベークライト株式会社 | 封止用樹脂組成物および半導体装置 |
| EP3950846B1 (en) * | 2019-03-29 | 2025-12-24 | Dow Toray Co., Ltd. | Curable silicone composition, cured product of same, and method for producing same |
| JP7338287B2 (ja) | 2019-07-18 | 2023-09-05 | 住友ベークライト株式会社 | パッケージ構造体 |
| JP7562201B2 (ja) * | 2019-07-30 | 2024-10-07 | デュポン・東レ・スペシャルティ・マテリアル株式会社 | ホットメルト性硬化性シリコーン組成物、封止剤、フィルム、光半導体素子 |
| JP7838778B2 (ja) * | 2019-07-30 | 2026-04-01 | Ｄｕｒｏｐｔｉｘマテリアル株式会社 | 硬化性シリコーン組成物、光半導体装置、および光半導体装置の製造方法 |
| JP2021024945A (ja) | 2019-08-05 | 2021-02-22 | 住友ベークライト株式会社 | 顆粒状半導体封止用樹脂組成物および半導体装置 |
| JP7318422B2 (ja) | 2019-08-30 | 2023-08-01 | 住友ベークライト株式会社 | 樹脂組成物および成形品 |
| JP6828784B2 (ja) | 2019-09-13 | 2021-02-10 | 住友ベークライト株式会社 | 伸縮性配線基板およびウェアラブルデバイス |
| JP2021080411A (ja) | 2019-11-22 | 2021-05-27 | 住友ベークライト株式会社 | 樹脂成形材料、成形品および成形品の製造方法 |
| JP2021097123A (ja) | 2019-12-17 | 2021-06-24 | 住友ベークライト株式会社 | 半導体パッケージの製造方法 |
| JP2021015985A (ja) | 2020-10-14 | 2021-02-12 | 住友ベークライト株式会社 | 伸縮性配線基板およびウェアラブルデバイス |
| JP7230936B2 (ja) | 2021-01-06 | 2023-03-01 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物および半導体装置の製造方法 |
-
2022
- 2022-08-22 KR KR1020247010071A patent/KR20240051216A/ko active Pending
- 2022-08-22 US US18/687,566 patent/US20250002719A1/en active Pending
- 2022-08-22 EP EP22864319.3A patent/EP4397721A4/en active Pending
- 2022-08-22 CN CN202280058295.0A patent/CN117881748A/zh active Pending
- 2022-08-22 WO PCT/JP2022/031579 patent/WO2023032735A1/ja not_active Ceased
- 2022-08-22 JP JP2023545464A patent/JPWO2023032735A1/ja active Pending
- 2022-08-30 TW TW111132732A patent/TW202319483A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202319483A (zh) | 2023-05-16 |
| CN117881748A (zh) | 2024-04-12 |
| EP4397721A1 (en) | 2024-07-10 |
| US20250002719A1 (en) | 2025-01-02 |
| KR20240051216A (ko) | 2024-04-19 |
| EP4397721A4 (en) | 2025-09-10 |
| WO2023032735A1 (ja) | 2023-03-09 |
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