JPWO2022270313A5 - - Google Patents
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- Publication number
- JPWO2022270313A5 JPWO2022270313A5 JP2023529815A JP2023529815A JPWO2022270313A5 JP WO2022270313 A5 JPWO2022270313 A5 JP WO2022270313A5 JP 2023529815 A JP2023529815 A JP 2023529815A JP 2023529815 A JP2023529815 A JP 2023529815A JP WO2022270313 A5 JPWO2022270313 A5 JP WO2022270313A5
- Authority
- JP
- Japan
- Prior art keywords
- wire
- bonding wire
- concentration
- coating layer
- wire according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021105515 | 2021-06-25 | ||
| PCT/JP2022/013461 WO2022270077A1 (ja) | 2021-06-25 | 2022-03-23 | 半導体装置用ボンディングワイヤ |
| PCT/JP2022/023127 WO2022270313A1 (ja) | 2021-06-25 | 2022-06-08 | 半導体装置用ボンディングワイヤ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022270313A1 JPWO2022270313A1 (https=) | 2022-12-29 |
| JPWO2022270313A5 true JPWO2022270313A5 (https=) | 2025-05-21 |
Family
ID=84543816
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529583A Active JP7783888B2 (ja) | 2021-06-25 | 2022-03-23 | 半導体装置用ボンディングワイヤ |
| JP2023529815A Pending JPWO2022270313A1 (https=) | 2021-06-25 | 2022-06-08 | |
| JP2023530437A Pending JPWO2022270440A1 (https=) | 2021-06-25 | 2022-06-17 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529583A Active JP7783888B2 (ja) | 2021-06-25 | 2022-03-23 | 半導体装置用ボンディングワイヤ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023530437A Pending JPWO2022270440A1 (https=) | 2021-06-25 | 2022-06-17 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20240290744A1 (https=) |
| EP (1) | EP4361301B1 (https=) |
| JP (3) | JP7783888B2 (https=) |
| KR (1) | KR20240026928A (https=) |
| CN (1) | CN117546279A (https=) |
| TW (2) | TW202313999A (https=) |
| WO (2) | WO2022270313A1 (https=) |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6148543A (ja) | 1984-08-10 | 1986-03-10 | Sumitomo Electric Ind Ltd | 半導体素子結線用銅合金線 |
| US20040245320A1 (en) * | 2001-10-23 | 2004-12-09 | Mesato Fukagaya | Bonding wire |
| JP2005167020A (ja) | 2003-12-03 | 2005-06-23 | Sumitomo Electric Ind Ltd | ボンディングワイヤーおよびそれを使用した集積回路デバイス |
| JP4672373B2 (ja) | 2005-01-05 | 2011-04-20 | 新日鉄マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
| WO2015083661A1 (ja) * | 2013-12-03 | 2015-06-11 | 国立大学法人広島大学 | はんだ材料および接合構造体 |
| JP6254841B2 (ja) | 2013-12-17 | 2017-12-27 | 新日鉄住金マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
| JP6167227B2 (ja) | 2014-04-21 | 2017-07-19 | 新日鉄住金マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
| SG10201408586XA (en) | 2014-12-22 | 2016-07-28 | Heraeus Materials Singapore Pte Ltd | Corrosion and moisture resistant bonding wire |
| KR20180008245A (ko) | 2015-06-15 | 2018-01-24 | 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 | 반도체 장치용 본딩 와이어 |
| CN107004610B (zh) | 2015-07-23 | 2020-07-17 | 日铁新材料股份有限公司 | 半导体装置用接合线 |
| JP6047214B1 (ja) | 2015-11-02 | 2016-12-21 | 田中電子工業株式会社 | ボールボンディング用貴金属被覆銅ワイヤ |
| WO2017221434A1 (ja) | 2016-06-20 | 2017-12-28 | 日鉄住金マイクロメタル株式会社 | 半導体装置用ボンディングワイヤ |
| WO2019031498A1 (ja) | 2017-08-09 | 2019-02-14 | 日鉄ケミカル＆マテリアル株式会社 | 半導体装置用Ｃｕ合金ボンディングワイヤ |
| PH12021553019A1 (en) | 2019-06-04 | 2022-11-07 | Tanaka Electronics Ind | Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, semiconductor device using the same, and manufacturing method thereof |
-
2022
- 2022-03-23 JP JP2023529583A patent/JP7783888B2/ja active Active
- 2022-03-23 KR KR1020237043813A patent/KR20240026928A/ko active Pending
- 2022-03-23 US US18/572,688 patent/US20240290744A1/en active Pending
- 2022-03-23 CN CN202280044503.1A patent/CN117546279A/zh active Pending
- 2022-03-23 EP EP22827996.4A patent/EP4361301B1/en active Active
- 2022-06-08 JP JP2023529815A patent/JPWO2022270313A1/ja active Pending
- 2022-06-08 WO PCT/JP2022/023127 patent/WO2022270313A1/ja not_active Ceased
- 2022-06-17 WO PCT/JP2022/024373 patent/WO2022270440A1/ja not_active Ceased
- 2022-06-17 TW TW111122578A patent/TW202313999A/zh unknown
- 2022-06-17 JP JP2023530437A patent/JPWO2022270440A1/ja active Pending
- 2022-06-23 TW TW111123375A patent/TW202324551A/zh unknown
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