JP7783888B2 - 半導体装置用ボンディングワイヤ - Google Patents

半導体装置用ボンディングワイヤ

Info

Publication number
JP7783888B2
JP7783888B2 JP2023529583A JP2023529583A JP7783888B2 JP 7783888 B2 JP7783888 B2 JP 7783888B2 JP 2023529583 A JP2023529583 A JP 2023529583A JP 2023529583 A JP2023529583 A JP 2023529583A JP 7783888 B2 JP7783888 B2 JP 7783888B2
Authority
JP
Japan
Prior art keywords
wire
concentration
bonding
coating layer
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023529583A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022270077A1 (https=
Inventor
大造 小田
基稀 江藤
隆 山田
照男 榛原
良 大石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Micrometal Corp
Original Assignee
Nippon Micrometal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Micrometal Corp filed Critical Nippon Micrometal Corp
Priority claimed from PCT/JP2022/013461 external-priority patent/WO2022270077A1/ja
Publication of JPWO2022270077A1 publication Critical patent/JPWO2022270077A1/ja
Application granted granted Critical
Publication of JP7783888B2 publication Critical patent/JP7783888B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07555—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
JP2023529583A 2021-06-25 2022-03-23 半導体装置用ボンディングワイヤ Active JP7783888B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021105515 2021-06-25
JP2021105515 2021-06-25
PCT/JP2022/013461 WO2022270077A1 (ja) 2021-06-25 2022-03-23 半導体装置用ボンディングワイヤ

Publications (2)

Publication Number Publication Date
JPWO2022270077A1 JPWO2022270077A1 (https=) 2022-12-29
JP7783888B2 true JP7783888B2 (ja) 2025-12-10

Family

ID=84543816

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2023529583A Active JP7783888B2 (ja) 2021-06-25 2022-03-23 半導体装置用ボンディングワイヤ
JP2023529815A Pending JPWO2022270313A1 (https=) 2021-06-25 2022-06-08
JP2023530437A Pending JPWO2022270440A1 (https=) 2021-06-25 2022-06-17

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023529815A Pending JPWO2022270313A1 (https=) 2021-06-25 2022-06-08
JP2023530437A Pending JPWO2022270440A1 (https=) 2021-06-25 2022-06-17

Country Status (7)

Country Link
US (1) US20240290744A1 (https=)
EP (1) EP4361301B1 (https=)
JP (3) JP7783888B2 (https=)
KR (1) KR20240026928A (https=)
CN (1) CN117546279A (https=)
TW (2) TW202313999A (https=)
WO (2) WO2022270313A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006190763A (ja) 2005-01-05 2006-07-20 Nippon Steel Corp 半導体装置用ボンディングワイヤ
JP2015119004A (ja) 2013-12-17 2015-06-25 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
WO2015163297A1 (ja) 2014-04-21 2015-10-29 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
WO2016204138A1 (ja) 2015-06-15 2016-12-22 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP2017092078A (ja) 2015-11-02 2017-05-25 田中電子工業株式会社 ボールボンディング用貴金属被覆銅ワイヤ
WO2019031498A1 (ja) 2017-08-09 2019-02-14 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
WO2020246094A1 (ja) 2019-06-04 2020-12-10 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ、パラジウム被覆銅ボンディングワイヤの製造方法、これを用いた半導体装置及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6148543A (ja) 1984-08-10 1986-03-10 Sumitomo Electric Ind Ltd 半導体素子結線用銅合金線
US20040245320A1 (en) * 2001-10-23 2004-12-09 Mesato Fukagaya Bonding wire
JP2005167020A (ja) 2003-12-03 2005-06-23 Sumitomo Electric Ind Ltd ボンディングワイヤーおよびそれを使用した集積回路デバイス
WO2015083661A1 (ja) * 2013-12-03 2015-06-11 国立大学法人広島大学 はんだ材料および接合構造体
SG10201408586XA (en) 2014-12-22 2016-07-28 Heraeus Materials Singapore Pte Ltd Corrosion and moisture resistant bonding wire
CN107004610B (zh) 2015-07-23 2020-07-17 日铁新材料股份有限公司 半导体装置用接合线
WO2017221434A1 (ja) 2016-06-20 2017-12-28 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006190763A (ja) 2005-01-05 2006-07-20 Nippon Steel Corp 半導体装置用ボンディングワイヤ
JP2015119004A (ja) 2013-12-17 2015-06-25 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
WO2015163297A1 (ja) 2014-04-21 2015-10-29 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
WO2016204138A1 (ja) 2015-06-15 2016-12-22 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP2017092078A (ja) 2015-11-02 2017-05-25 田中電子工業株式会社 ボールボンディング用貴金属被覆銅ワイヤ
WO2019031498A1 (ja) 2017-08-09 2019-02-14 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
WO2020246094A1 (ja) 2019-06-04 2020-12-10 田中電子工業株式会社 パラジウム被覆銅ボンディングワイヤ、パラジウム被覆銅ボンディングワイヤの製造方法、これを用いた半導体装置及びその製造方法

Also Published As

Publication number Publication date
KR20240026928A (ko) 2024-02-29
TW202313999A (zh) 2023-04-01
JPWO2022270313A1 (https=) 2022-12-29
EP4361301A4 (en) 2025-09-10
CN117546279A (zh) 2024-02-09
TW202324551A (zh) 2023-06-16
WO2022270440A1 (ja) 2022-12-29
EP4361301A1 (en) 2024-05-01
EP4361301B1 (en) 2026-05-06
JPWO2022270077A1 (https=) 2022-12-29
WO2022270313A1 (ja) 2022-12-29
US20240290744A1 (en) 2024-08-29
JPWO2022270440A1 (https=) 2022-12-29

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