JPWO2022270440A1 - - Google Patents
Info
- Publication number
- JPWO2022270440A1 JPWO2022270440A1 JP2023530437A JP2023530437A JPWO2022270440A1 JP WO2022270440 A1 JPWO2022270440 A1 JP WO2022270440A1 JP 2023530437 A JP2023530437 A JP 2023530437A JP 2023530437 A JP2023530437 A JP 2023530437A JP WO2022270440 A1 JPWO2022270440 A1 JP WO2022270440A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
- H10W72/07555—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/521—Structures or relative sizes of bond wires
- H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021105515 | 2021-06-25 | ||
| PCT/JP2022/013461 WO2022270077A1 (ja) | 2021-06-25 | 2022-03-23 | 半導体装置用ボンディングワイヤ |
| PCT/JP2022/024373 WO2022270440A1 (ja) | 2021-06-25 | 2022-06-17 | 半導体装置用ボンディングワイヤ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022270440A1 true JPWO2022270440A1 (https=) | 2022-12-29 |
| JPWO2022270440A5 JPWO2022270440A5 (https=) | 2025-05-20 |
Family
ID=84543816
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529583A Active JP7783888B2 (ja) | 2021-06-25 | 2022-03-23 | 半導体装置用ボンディングワイヤ |
| JP2023529815A Pending JPWO2022270313A1 (https=) | 2021-06-25 | 2022-06-08 | |
| JP2023530437A Pending JPWO2022270440A1 (https=) | 2021-06-25 | 2022-06-17 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529583A Active JP7783888B2 (ja) | 2021-06-25 | 2022-03-23 | 半導体装置用ボンディングワイヤ |
| JP2023529815A Pending JPWO2022270313A1 (https=) | 2021-06-25 | 2022-06-08 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20240290744A1 (https=) |
| EP (1) | EP4361301B1 (https=) |
| JP (3) | JP7783888B2 (https=) |
| KR (1) | KR20240026928A (https=) |
| CN (1) | CN117546279A (https=) |
| TW (2) | TW202313999A (https=) |
| WO (2) | WO2022270313A1 (https=) |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6148543A (ja) | 1984-08-10 | 1986-03-10 | Sumitomo Electric Ind Ltd | 半導体素子結線用銅合金線 |
| US20040245320A1 (en) * | 2001-10-23 | 2004-12-09 | Mesato Fukagaya | Bonding wire |
| JP2005167020A (ja) | 2003-12-03 | 2005-06-23 | Sumitomo Electric Ind Ltd | ボンディングワイヤーおよびそれを使用した集積回路デバイス |
| JP4672373B2 (ja) | 2005-01-05 | 2011-04-20 | 新日鉄マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
| WO2015083661A1 (ja) * | 2013-12-03 | 2015-06-11 | 国立大学法人広島大学 | はんだ材料および接合構造体 |
| JP6254841B2 (ja) | 2013-12-17 | 2017-12-27 | 新日鉄住金マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
| JP6167227B2 (ja) | 2014-04-21 | 2017-07-19 | 新日鉄住金マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
| SG10201408586XA (en) | 2014-12-22 | 2016-07-28 | Heraeus Materials Singapore Pte Ltd | Corrosion and moisture resistant bonding wire |
| KR20180008245A (ko) | 2015-06-15 | 2018-01-24 | 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 | 반도체 장치용 본딩 와이어 |
| CN107004610B (zh) | 2015-07-23 | 2020-07-17 | 日铁新材料股份有限公司 | 半导体装置用接合线 |
| JP6047214B1 (ja) | 2015-11-02 | 2016-12-21 | 田中電子工業株式会社 | ボールボンディング用貴金属被覆銅ワイヤ |
| WO2017221434A1 (ja) | 2016-06-20 | 2017-12-28 | 日鉄住金マイクロメタル株式会社 | 半導体装置用ボンディングワイヤ |
| WO2019031498A1 (ja) | 2017-08-09 | 2019-02-14 | 日鉄ケミカル＆マテリアル株式会社 | 半導体装置用Ｃｕ合金ボンディングワイヤ |
| PH12021553019A1 (en) | 2019-06-04 | 2022-11-07 | Tanaka Electronics Ind | Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, semiconductor device using the same, and manufacturing method thereof |
-
2022
- 2022-03-23 JP JP2023529583A patent/JP7783888B2/ja active Active
- 2022-03-23 KR KR1020237043813A patent/KR20240026928A/ko active Pending
- 2022-03-23 US US18/572,688 patent/US20240290744A1/en active Pending
- 2022-03-23 CN CN202280044503.1A patent/CN117546279A/zh active Pending
- 2022-03-23 EP EP22827996.4A patent/EP4361301B1/en active Active
- 2022-06-08 JP JP2023529815A patent/JPWO2022270313A1/ja active Pending
- 2022-06-08 WO PCT/JP2022/023127 patent/WO2022270313A1/ja not_active Ceased
- 2022-06-17 WO PCT/JP2022/024373 patent/WO2022270440A1/ja not_active Ceased
- 2022-06-17 TW TW111122578A patent/TW202313999A/zh unknown
- 2022-06-17 JP JP2023530437A patent/JPWO2022270440A1/ja active Pending
- 2022-06-23 TW TW111123375A patent/TW202324551A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240026928A (ko) | 2024-02-29 |
| TW202313999A (zh) | 2023-04-01 |
| JPWO2022270313A1 (https=) | 2022-12-29 |
| EP4361301A4 (en) | 2025-09-10 |
| CN117546279A (zh) | 2024-02-09 |
| TW202324551A (zh) | 2023-06-16 |
| WO2022270440A1 (ja) | 2022-12-29 |
| EP4361301A1 (en) | 2024-05-01 |
| JP7783888B2 (ja) | 2025-12-10 |
| EP4361301B1 (en) | 2026-05-06 |
| JPWO2022270077A1 (https=) | 2022-12-29 |
| WO2022270313A1 (ja) | 2022-12-29 |
| US20240290744A1 (en) | 2024-08-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
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| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250512 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250512 |
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| A131 | Notification of reasons for refusal |
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