JPWO2023248491A5 - - Google Patents
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- Publication number
- JPWO2023248491A5 JPWO2023248491A5 JP2023509507A JP2023509507A JPWO2023248491A5 JP WO2023248491 A5 JPWO2023248491 A5 JP WO2023248491A5 JP 2023509507 A JP2023509507 A JP 2023509507A JP 2023509507 A JP2023509507 A JP 2023509507A JP WO2023248491 A5 JPWO2023248491 A5 JP WO2023248491A5
- Authority
- JP
- Japan
- Prior art keywords
- wire
- less
- concentration
- width
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023094836A JP2024002933A (ja) | 2022-06-24 | 2023-06-08 | 半導体装置用ボンディングワイヤ |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022101611 | 2022-06-24 | ||
| JP2022101611 | 2022-06-24 | ||
| PCT/JP2022/038688 WO2023248491A1 (ja) | 2022-06-24 | 2022-10-18 | 半導体装置用ボンディングワイヤ |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023094836A Division JP2024002933A (ja) | 2022-06-24 | 2023-06-08 | 半導体装置用ボンディングワイヤ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7295352B1 JP7295352B1 (ja) | 2023-06-20 |
| JPWO2023248491A1 JPWO2023248491A1 (https=) | 2023-12-28 |
| JPWO2023248491A5 true JPWO2023248491A5 (https=) | 2024-05-28 |
Family
ID=86772634
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023509507A Active JP7295352B1 (ja) | 2022-06-24 | 2022-10-18 | 半導体装置用ボンディングワイヤ |
| JP2023094836A Pending JP2024002933A (ja) | 2022-06-24 | 2023-06-08 | 半導体装置用ボンディングワイヤ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023094836A Pending JP2024002933A (ja) | 2022-06-24 | 2023-06-08 | 半導体装置用ボンディングワイヤ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12166006B2 (https=) |
| EP (1) | EP4365931B1 (https=) |
| JP (2) | JP7295352B1 (https=) |
| KR (2) | KR20250016058A (https=) |
| CN (1) | CN117836918A (https=) |
| MY (1) | MY204166A (https=) |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6148543A (ja) | 1984-08-10 | 1986-03-10 | Sumitomo Electric Ind Ltd | 半導体素子結線用銅合金線 |
| JP2005167020A (ja) | 2003-12-03 | 2005-06-23 | Sumitomo Electric Ind Ltd | ボンディングワイヤーおよびそれを使用した集積回路デバイス |
| US20070235887A1 (en) | 2003-10-20 | 2007-10-11 | Shingo Kaimori | Bonding Wire and Integrated Circuit Device Using the Same |
| JP4672373B2 (ja) * | 2005-01-05 | 2011-04-20 | 新日鉄マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
| KR101019811B1 (ko) | 2005-01-05 | 2011-03-04 | 신닛테츠 마테리알즈 가부시키가이샤 | 반도체 장치용 본딩 와이어 |
| JP4885117B2 (ja) * | 2007-12-03 | 2012-02-29 | 新日鉄マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
| EP2239766B1 (en) | 2008-01-25 | 2013-03-20 | Nippon Steel & Sumikin Materials Co., Ltd. | Bonding wire for semiconductor device |
| KR101707244B1 (ko) * | 2009-07-30 | 2017-02-15 | 신닛테츠스미킹 마테리알즈 가부시키가이샤 | 반도체용 본딩 와이어 |
| JP6254841B2 (ja) * | 2013-12-17 | 2017-12-27 | 新日鉄住金マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
| JP6167227B2 (ja) * | 2014-04-21 | 2017-07-19 | 新日鉄住金マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
| SG10201408586XA (en) | 2014-12-22 | 2016-07-28 | Heraeus Materials Singapore Pte Ltd | Corrosion and moisture resistant bonding wire |
| WO2016189752A1 (ja) | 2015-05-26 | 2016-12-01 | 日鉄住金マイクロメタル株式会社 | 半導体装置用ボンディングワイヤ |
| KR20180008245A (ko) * | 2015-06-15 | 2018-01-24 | 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 | 반도체 장치용 본딩 와이어 |
| CN107004610B (zh) | 2015-07-23 | 2020-07-17 | 日铁新材料股份有限公司 | 半导体装置用接合线 |
| CN105762129B (zh) * | 2016-04-27 | 2018-03-30 | 山东科大鼎新电子科技有限公司 | 一种铜基表面镀镍钯金键合丝的制备方法 |
| WO2017221434A1 (ja) | 2016-06-20 | 2017-12-28 | 日鉄住金マイクロメタル株式会社 | 半導体装置用ボンディングワイヤ |
| CN112376090A (zh) | 2020-11-10 | 2021-02-19 | 烟台一诺电子材料有限公司 | 一种铜基镀钯镍合金键合丝的制备方法 |
| CN117038618A (zh) | 2021-06-25 | 2023-11-10 | 日铁新材料股份有限公司 | 半导体装置用接合线 |
| JP7157280B1 (ja) | 2021-06-25 | 2022-10-19 | 日鉄マイクロメタル株式会社 | 半導体装置用ボンディングワイヤ |
-
2022
- 2022-10-18 KR KR1020247017577A patent/KR20250016058A/ko active Pending
- 2022-10-18 CN CN202280057456.4A patent/CN117836918A/zh active Pending
- 2022-10-18 MY MYPI2024001000A patent/MY204166A/en unknown
- 2022-10-18 EP EP22948050.4A patent/EP4365931B1/en active Active
- 2022-10-18 KR KR1020247005677A patent/KR102671200B1/ko active Active
- 2022-10-18 JP JP2023509507A patent/JP7295352B1/ja active Active
- 2022-10-18 US US18/685,871 patent/US12166006B2/en active Active
-
2023
- 2023-06-08 JP JP2023094836A patent/JP2024002933A/ja active Pending
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