JPWO2023249037A5 - - Google Patents
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- Publication number
- JPWO2023249037A5 JPWO2023249037A5 JP2024529041A JP2024529041A JPWO2023249037A5 JP WO2023249037 A5 JPWO2023249037 A5 JP WO2023249037A5 JP 2024529041 A JP2024529041 A JP 2024529041A JP 2024529041 A JP2024529041 A JP 2024529041A JP WO2023249037 A5 JPWO2023249037 A5 JP WO2023249037A5
- Authority
- JP
- Japan
- Prior art keywords
- wire
- elements
- less
- bonding wire
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022101612 | 2022-06-24 | ||
| PCT/JP2023/022861 WO2023249037A1 (ja) | 2022-06-24 | 2023-06-21 | 半導体装置用ボンディングワイヤ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023249037A1 JPWO2023249037A1 (https=) | 2023-12-28 |
| JPWO2023249037A5 true JPWO2023249037A5 (https=) | 2025-03-06 |
Family
ID=89379961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024529041A Pending JPWO2023249037A1 (https=) | 2022-06-24 | 2023-06-21 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250372565A1 (https=) |
| EP (1) | EP4546401A1 (https=) |
| JP (1) | JPWO2023249037A1 (https=) |
| KR (1) | KR20250027657A (https=) |
| CN (1) | CN119422234A (https=) |
| TW (1) | TW202409305A (https=) |
| WO (1) | WO2023249037A1 (https=) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6148543A (ja) | 1984-08-10 | 1986-03-10 | Sumitomo Electric Ind Ltd | 半導体素子結線用銅合金線 |
| JPS6148534A (ja) | 1984-08-15 | 1986-03-10 | Toshiba Corp | 線材加熱炉 |
| JPS6297360A (ja) * | 1985-10-24 | 1987-05-06 | Mitsubishi Metal Corp | 半導体装置のボンデイングワイヤ用表面被覆高純度銅極細線 |
| JP2004064033A (ja) * | 2001-10-23 | 2004-02-26 | Sumitomo Electric Wintec Inc | ボンディングワイヤー |
| JP2005167020A (ja) | 2003-12-03 | 2005-06-23 | Sumitomo Electric Ind Ltd | ボンディングワイヤーおよびそれを使用した集積回路デバイス |
| JP4672373B2 (ja) * | 2005-01-05 | 2011-04-20 | 新日鉄マテリアルズ株式会社 | 半導体装置用ボンディングワイヤ |
| US8102061B2 (en) * | 2007-07-24 | 2012-01-24 | Nippon Steel Materials Co., Ltd. | Semiconductor device bonding wire and wire bonding method |
| SG10201408586XA (en) | 2014-12-22 | 2016-07-28 | Heraeus Materials Singapore Pte Ltd | Corrosion and moisture resistant bonding wire |
| CN107004610B (zh) | 2015-07-23 | 2020-07-17 | 日铁新材料股份有限公司 | 半导体装置用接合线 |
| WO2017221434A1 (ja) | 2016-06-20 | 2017-12-28 | 日鉄住金マイクロメタル株式会社 | 半導体装置用ボンディングワイヤ |
| JP2020150116A (ja) | 2019-03-13 | 2020-09-17 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
-
2023
- 2023-06-21 KR KR1020247041948A patent/KR20250027657A/ko active Pending
- 2023-06-21 JP JP2024529041A patent/JPWO2023249037A1/ja active Pending
- 2023-06-21 WO PCT/JP2023/022861 patent/WO2023249037A1/ja not_active Ceased
- 2023-06-21 US US18/874,745 patent/US20250372565A1/en active Pending
- 2023-06-21 EP EP23827220.7A patent/EP4546401A1/en active Pending
- 2023-06-21 CN CN202380049084.5A patent/CN119422234A/zh active Pending
- 2023-06-21 TW TW112123413A patent/TW202409305A/zh unknown
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