JPWO2024247286A5 - - Google Patents

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Publication number
JPWO2024247286A5
JPWO2024247286A5 JP2023539793A JP2023539793A JPWO2024247286A5 JP WO2024247286 A5 JPWO2024247286 A5 JP WO2024247286A5 JP 2023539793 A JP2023539793 A JP 2023539793A JP 2023539793 A JP2023539793 A JP 2023539793A JP WO2024247286 A5 JPWO2024247286 A5 JP WO2024247286A5
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JP
Japan
Prior art keywords
coating layer
less
mass
wire
concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2023539793A
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English (en)
Japanese (ja)
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JP7494400B1 (ja
JPWO2024247286A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/023777 external-priority patent/WO2024247286A1/ja
Priority to JP2024083026A priority Critical patent/JP2024173736A/ja
Application granted granted Critical
Publication of JP7494400B1 publication Critical patent/JP7494400B1/ja
Publication of JPWO2024247286A1 publication Critical patent/JPWO2024247286A1/ja
Publication of JPWO2024247286A5 publication Critical patent/JPWO2024247286A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023539793A 2023-05-30 2023-06-27 ボンディングワイヤ Active JP7494400B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024083026A JP2024173736A (ja) 2023-05-30 2024-05-22 ボンディングワイヤ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023088808 2023-05-30
JP2023088808 2023-05-30
PCT/JP2023/023777 WO2024247286A1 (ja) 2023-05-30 2023-06-27 ボンディングワイヤ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024083026A Division JP2024173736A (ja) 2023-05-30 2024-05-22 ボンディングワイヤ

Publications (3)

Publication Number Publication Date
JP7494400B1 JP7494400B1 (ja) 2024-06-03
JPWO2024247286A1 JPWO2024247286A1 (https=) 2024-12-05
JPWO2024247286A5 true JPWO2024247286A5 (https=) 2025-05-13

Family

ID=91321817

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023539793A Active JP7494400B1 (ja) 2023-05-30 2023-06-27 ボンディングワイヤ
JP2024083026A Pending JP2024173736A (ja) 2023-05-30 2024-05-22 ボンディングワイヤ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024083026A Pending JP2024173736A (ja) 2023-05-30 2024-05-22 ボンディングワイヤ

Country Status (5)

Country Link
US (1) US12290883B2 (https=)
EP (1) EP4495982A4 (https=)
JP (2) JP7494400B1 (https=)
KR (2) KR102758326B1 (https=)
CN (1) CN119452459A (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6148543A (ja) 1984-08-10 1986-03-10 Sumitomo Electric Ind Ltd 半導体素子結線用銅合金線
JP2005167020A (ja) 2003-12-03 2005-06-23 Sumitomo Electric Ind Ltd ボンディングワイヤーおよびそれを使用した集積回路デバイス
US20070235887A1 (en) 2003-10-20 2007-10-11 Shingo Kaimori Bonding Wire and Integrated Circuit Device Using the Same
CN102884615A (zh) 2010-04-14 2013-01-16 大自达电线株式会社 焊线
JP5088981B1 (ja) * 2011-12-21 2012-12-05 田中電子工業株式会社 Ｐｄ被覆銅ボールボンディングワイヤ
SG10201408586XA (en) 2014-12-22 2016-07-28 Heraeus Materials Singapore Pte Ltd Corrosion and moisture resistant bonding wire
KR20180008245A (ko) 2015-06-15 2018-01-24 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 반도체 장치용 본딩 와이어
CN107004610B (zh) 2015-07-23 2020-07-17 日铁新材料股份有限公司 半导体装置用接合线
WO2017221434A1 (ja) 2016-06-20 2017-12-28 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
DE112017000346T5 (de) * 2017-12-28 2019-08-29 Nippon Micrometal Corporation Bonddraht für Halbleiterbauelement
JP7157280B1 (ja) 2021-06-25 2022-10-19 日鉄マイクロメタル株式会社 半導体装置用ボンディングワイヤ
CN117038618A (zh) 2021-06-25 2023-11-10 日铁新材料股份有限公司 半导体装置用接合线

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