CN105762129B - 一种铜基表面镀镍钯金键合丝的制备方法 - Google Patents

一种铜基表面镀镍钯金键合丝的制备方法 Download PDF

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CN105762129B
CN105762129B CN201610267813.6A CN201610267813A CN105762129B CN 105762129 B CN105762129 B CN 105762129B CN 201610267813 A CN201610267813 A CN 201610267813A CN 105762129 B CN105762129 B CN 105762129B
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copper
plating
bonding wire
nickel
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李天祥
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Make Innovations Electronic Science And Technology Co Ltd In University Of Science And Technology Shandong
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Abstract

本发明涉及一种铜基表面镀镍钯金键合丝及其制备方法，它包括铜丝基材(1)，所述铜丝基材(1)的外表面依次镀覆有镀镍层(2)、镀钯层(3)和镀金层(4)；实现了结合力高，键合力强，方便镍钯金框架的焊接且焊点无变形缺陷，能够防止后续拉丝过程中剥落和裂纹的效果。

Description

一种铜基表面镀镍钯金键合丝的制备方法
技术领域
本发明涉及一种铜基表面镀镍钯金键合丝及其制备方法。
背景技术
对于当前半导体封装用键合丝替代材料的选择，市场主要选择镀钯铜线。镀钯铜线具有高电导率和导热率，并能形成更可靠的金属间结合层，由此带来高温环境下的产品可靠性优势。相对于金线，具有较高的杨氏模量，因此，镀铜线具有更好的线弧特性。然而，由于钯和铜结合力较弱，容易产生漏镀或脱落，给后续的拉拔带来质量隐患。镍和铜有很好的结合力，钯和镍的结合力也很高，外层镀金解决了钯塑性差的问题，很好的解决了后续拉丝过程中剥落和裂纹的情况。普通的金线，铜线，镀钯线不容易在镍钯金框架上键合，而镀镍钯金键合丝则可以解决这个问题。目前绝大部分的镀钯键合铜丝基材采用高于5N纯度的单晶铜，而由于铜晶粒在变型时各向异性，往往引起第二焊点的变型缺陷。
发明内容
本发明解决的技术问题是提供一种结合力高，键合力强，方便镍钯金框架的焊接且焊点无变形缺陷，能够防止后续拉丝过程中剥落和裂纹的铜基表面镀镍钯金键合丝。
本发明的技术方案是一种铜基表面镀镍钯金键合丝，它包括铜丝基材1，其特征在于：所述铜丝基材1的外表面依次镀覆有镀镍层2、镀钯层3和镀金层4。
本发明的技术方案还可以是经镀覆后的所述表面镀镍钯金键合丝的镀镍层(2)厚度为0.05μm～0.1μm，镀钯层(3)厚度为2μm～4.0μm，镀金层(4)厚度为0.05μm～0.1μm。
本发明的技术方案还可以是镀覆有所述镀镍层2、镀钯层3和镀金层4的铜丝基材1经拉伸后形成直径为15～50μm的表面镀镍钯金键合丝。
本发明的第二目的是提供一种制备上述铜基表面镀镍钯金键合丝的方法。
为实现上述第二目的，本发明的技术方案是制备一种铜基表面镀镍钯金键合丝的方法，包括铜为主组分的銅丝基材，具体制备铜基表面镀镍钯金键合丝的步骤如下：
第一步：由6N铜为主组分的所述銅丝基材添加细化晶粒的微量元素，所述细化晶粒的微量元素与主组分的銅的重量百万分比(ppm)分别如下：镧：10～30ppm，铈：12～30ppm，铬：5～60ppm；经过抽高真空氩气保护下引法熔炼拉伸成4N銅丝基材其直径为0.25mm；
第二步：将上述第一步的銅丝基材的外表面使用电镀或化学镀或真空镀依次镀覆镀镍层2、镀钯层3和镀金层4，然后再经过拉伸成直径为15～50μm的表面镀镍钯金键合丝。
本发明的技术方案还可以优选为：
第一步：由6N铜为主组分的所述銅丝基材添加细化晶粒的微量元素，所述细化晶粒的微量元素与主组分的銅的重量百万分比(ppm)分别如下：镧：20ppm，铈：20ppm，铬：30ppm，经过抽高真空氩气保护下引法熔炼并拉伸成直径为Ф0.25mm的4N銅丝基材卷绕在中转卷轴上；
第二步：将第一步获得的銅丝基材传送至电镀设备中进行连续电镀，在銅丝基材表面镀覆形成厚度为0.05μm的镀镍层，经过高压清洗后进入镀钯槽在銅丝基材表面镀覆形成3μm的镀钯层，再经高压清洗后进入镀金槽在銅丝基材表面镀覆形成0.05μm的镀金层；将表面镀镍钯金的銅丝基材进行超细拉伸，获得最终直径为Ф15μm的表面镀镍钯金键合丝；将表面镀镍钯金键合丝进行动态连续退火，退火温度为500±5℃，恒温控制，温区总长度700mm，退火速度1.5m/sec。
本发明的有益效果是所述铜丝基材1的外表面依次镀覆有镀镍层2、镀钯层3和镀金层4；由于铜和镍的结合力很好，镍和钯的结合力也很好，该镀层方式解决了铜钯结合力差，大大提高了成品率和生产效率；实现了结合力高，键合力强，方便镍钯金框架的焊接且焊点无变形缺陷，能够防止后续拉丝过程中剥落和裂纹的效果。
附图说明
图1为本发明的结构示意图
图1中1、铜丝基材，2、镀镍层，3、镀钯层，4镀金层。
具体实施方式
根据图1所示，本发明涉及一种铜基表面镀镍钯金键合丝，它包括铜丝基材1，所述铜丝基材1的外表面依次镀覆有镀镍层2、镀钯层3和镀金层4, 经镀覆后的所述表面镀镍钯金键合丝的镀镍层(2)厚度为0.05μm～0.1μm，镀钯层(3)厚度为2μm～4.0μm，镀金层(4)厚度为0.05μm～0.1μm；镀覆有所述镀镍层2、镀钯层3和镀金层4的铜丝基材1经拉伸后形成直径为15～50μm的表面镀镍钯金键合丝；由于铜和镍的结合力很好，由于表面镀镍钯金键合丝在后续的超细拉伸过程中不必进行中间退火镀层和基体就具有较好的结合力和最终塑性变形能力，镀层在压力加工过程中变形一致，表面均匀，致密完整，镍和钯的结合力也很好；该镀层方式解决了铜钯结合力差，大大提高了成品率和生产效率；实现了结合力高，键合力强，方便镍钯金框架的焊接且焊点无变形缺陷，能够防止后续拉丝过程中剥落和裂纹的效果。
本发明还涉及一种制备上述铜基表面镀镍钯金键合丝的方法，包括铜为主组分的銅丝基材，具体制备铜基表面镀镍钯金键合丝的步骤如下：
第一步：由6N铜为主组分的所述銅丝基材添加细化晶粒的微量元素，也就是所述主组分的銅芯材原料是6N銅，即纯度为99.9999％的高纯銅；所述细化晶粒的微量元素与主组分的銅的重量百万分比(ppm)分别如下：镧：10～30ppm，铈：12～30ppm，铬：5～60ppm；由于微量元素晶粒的细化使等截面积的晶粒数量明显增多，在后续的键合中克服了单晶铜变形时各向异性即第二焊点变形不均匀的缺陷，有利于焊接键合时充分变形；然后经过抽高真空氩气保护下引法熔炼并拉伸成4N銅丝基材其直径为0.25mm；
第二步：将上述第一步的铜丝基材的外表面使用电镀或化学镀或真空镀依次镀覆镀镍层2、镀钯层3和镀金层4，然后再经过拉伸成直径为15～50μm的表面镀镍钯金键合丝。
本发明的技术方案还可以优选为：
第一步：由6N铜为主组分的所述銅丝基材添加细化晶粒的微量元素，所述细化晶粒的微量元素与主组分的銅的重量百万分比(ppm)分别如下：镧：20ppm，铈：20ppm，铬：30ppm，经过抽高真空氩气保护下引法熔炼并拉伸成直径为Ф0.25mm的4N銅丝基材卷绕在中转卷轴上；
第二步：将第一步获得的銅丝基材传送至电镀设备中进行连续电镀，在銅丝基材表面镀覆形成厚度为0.05μm的镀镍层，经过高压清洗后进入镀钯槽在銅丝基材表面镀覆形成3μm的镀钯层，再经高压清洗后进入镀金槽在銅丝基材表面镀覆形成0.05μm的镀金层；将表面镀镍钯金的銅丝基材进行超细拉伸，获得最终直径为Ф15μm的表面镀镍钯金键合丝。
实验1：
选取6N高纯铜原料，添加20ppm的镧、20ppm的铈、30ppm的铬进行熔炼，经化学分析其组分的重量百万分（ppm）比分别如下：
熔炼拉伸而成的直径为Ф0.25mm的铜合金芯线卷绕在中转卷轴上，传送至电镀设备中进行连续电镀，在铜丝表面镀覆形成厚度为0.05μm的镍层，经过高压清洗后进入镀钯槽在铜丝表面镀覆形成3μm的镀钯层，再经高压清洗后进入镀金槽在铜丝表面镀覆形成0.05μm的镀金层。
将表面镀镍钯金键合丝进行超细拉伸，获得最终直径为Ф15μm的表面镀镍钯金键合丝成品。
镀层表面检查采用200倍的金相显微镜，结果如下：
表面的钯镀层均匀光亮，致密完整，无裂痕、起皮、脱落。
将表面镀镍钯金键合丝进行动态连续退火，退火温度为500±5℃，恒温控制，温区总长度700mm，退火速度1.5m/sec。
焊线试验采用型号为ASM的焊线机，焊线框架为镀镍钯金QFN
退火后材料物理性能测试结果如下：
以上多项测试结果表明：本具体实施方式的表面镀镍钯金键合丝能够满足现代封装的高端键合要求。

Claims (2)

1.一种铜基表面镀镍钯金键合丝的制备方法，其特征在于：包括铜为主组分的銅丝基材，具体制备铜基表面镀镍钯金键合丝的步骤如下：
第一步：由6N铜为主组分的所述銅丝基材添加细化晶粒的微量元素，所述细化晶粒的微量元素与主组分的銅的重量百万分比(ppm)分别如下：镧：10～30ppm，铈：12～30ppm，铬：5～60ppm；经过抽高真空氩气保护下引法熔炼并拉伸成4N铜丝基材其直径为0.25mm；
第二步：将上述第一步的铜丝基材的外表面使用电镀或化学镀或真空镀依次镀覆镀镍层(2)、镀钯层(3)和镀金层(4)，经镀覆后的所述表面镀镍钯金键合丝的镀镍层(2)厚度为0.05μm～0.1μm，镀钯层(3)厚度为2μm～4.0μm，镀金层(4)厚度为0.05μm～0.1μm，然后再拉伸成直径为15～50μm的表面镀镍钯金键合丝。
2.根据权利要求1所述的一种铜基表面镀镍钯金键合丝的制备方法：其特征在于：上述方法优选为：
第一步：由6N铜为主组分的所述銅丝基材添加细化晶粒的微量元素，所述细化晶粒的微量元素与主组分的銅的重量百万分比(ppm)分别如下：镧：20ppm，铈：20ppm，铬：30ppm，经过拉伸成直径为Ф0.25mm的4N銅丝基材卷绕在中转卷轴上；
第二步：将第一步获得的銅丝基材传送至电镀设备中进行连续电镀，在銅丝基材表面镀覆形成厚度为0.05μm的镀镍层，经过高压清洗后进入镀钯槽在銅丝基材表面镀覆形成3μm的镀钯层，再经高压清洗后进入镀金槽在銅丝基材表面镀覆形成0.05μm的镀金层；将表面镀镍钯金的銅丝基材进行超细拉伸，获得最终直径为Ф15μm的表面镀镍钯金键合丝；将所述表面镀镍钯金键合丝进行动态连续退火，退火温度为500±5℃，恒温控制，温区总长度700mm，退火速度1.5m/sec。
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