JPWO2022260094A1 - - Google Patents

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Publication number
JPWO2022260094A1
JPWO2022260094A1 JP2023527903A JP2023527903A JPWO2022260094A1 JP WO2022260094 A1 JPWO2022260094 A1 JP WO2022260094A1 JP 2023527903 A JP2023527903 A JP 2023527903A JP 2023527903 A JP2023527903 A JP 2023527903A JP WO2022260094 A1 JPWO2022260094 A1 JP WO2022260094A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2023527903A
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Japanese (ja)
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JP7722451B2 (ja
JPWO2022260094A5 (https=
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Publication of JPWO2022260094A5 publication Critical patent/JPWO2022260094A5/ja
Application granted granted Critical
Publication of JP7722451B2 publication Critical patent/JP7722451B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • B32B17/10431—Specific parts for the modulation of light incorporated into the laminated safety glass or glazing
    • B32B17/10467—Variable transmission
    • B32B17/10495—Variable transmission optoelectronic, i.e. optical valve
    • B32B17/10504—Liquid crystal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • C09K19/3804—Polymers with mesogenic groups in the main chain
    • C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/55—Liquid crystals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K2019/0444—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit characterized by a linking chain between rings or ring systems, a bridging chain between extensive mesogenic moieties or an end chain group
    • C09K2019/0448—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit characterized by a linking chain between rings or ring systems, a bridging chain between extensive mesogenic moieties or an end chain group the end chain group being a polymerizable end group, e.g. -Sp-P or acrylate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/54—Improvements relating to the production of bulk chemicals using solvents, e.g. supercritical solvents or ionic liquids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
JP2023527903A 2021-06-09 2022-06-08 導体層付き樹脂フィルム、積層基板、及び、導体層付き樹脂フィルムの製造方法 Active JP7722451B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021096549 2021-06-09
JP2021096549 2021-06-09
PCT/JP2022/023160 WO2022260094A1 (ja) 2021-06-09 2022-06-08 導体層付き樹脂フィルム、積層基板、及び、導体層付き樹脂フィルムの製造方法

Publications (3)

Publication Number Publication Date
JPWO2022260094A1 true JPWO2022260094A1 (https=) 2022-12-15
JPWO2022260094A5 JPWO2022260094A5 (https=) 2023-08-09
JP7722451B2 JP7722451B2 (ja) 2025-08-13

Family

ID=84426093

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023527901A Pending JPWO2022260092A1 (https=) 2021-06-09 2022-06-08
JP2023527903A Active JP7722451B2 (ja) 2021-06-09 2022-06-08 導体層付き樹脂フィルム、積層基板、及び、導体層付き樹脂フィルムの製造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2023527901A Pending JPWO2022260092A1 (https=) 2021-06-09 2022-06-08

Country Status (4)

Country Link
US (2) US12330392B2 (https=)
JP (2) JPWO2022260092A1 (https=)
CN (2) CN116249617A (https=)
WO (2) WO2022260094A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022260092A1 (https=) * 2021-06-09 2022-12-15
WO2023002766A1 (ja) * 2021-07-20 2023-01-26 住友電気工業株式会社 プリント配線板及びプリント配線板の製造方法
JP2024071004A (ja) * 2022-11-14 2024-05-24 日東電工株式会社 積層体、及び積層体の製造方法
WO2025022820A1 (ja) * 2023-07-25 2025-01-30 株式会社村田製作所 樹脂積層基板及び樹脂積層基板の製造方法
CN117415514A (zh) * 2023-11-17 2024-01-19 江苏奥匠新材料科技有限公司 一种助焊膏以及应用所述助焊膏的锡膏
JPWO2025169634A1 (https=) * 2024-02-07 2025-08-14
TWI859075B (zh) * 2024-02-19 2024-10-11 欣興電子股份有限公司 線路板結構
WO2026014245A1 (ja) * 2024-07-12 2026-01-15 株式会社村田製作所 樹脂シート体、導体層付樹脂シート体及び多層回路基板
WO2026014243A1 (ja) * 2024-07-12 2026-01-15 株式会社村田製作所 樹脂シート体、導体層付樹脂シート体、多層回路基板及び多層回路基板の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003008233A (ja) * 2001-06-19 2003-01-10 Nitto Denko Corp 多層配線基板
WO2017110618A1 (ja) * 2015-12-24 2017-06-29 株式会社村田製作所 樹脂シート、樹脂シートの製造方法および樹脂多層基板の製造方法
WO2021059586A1 (ja) * 2019-09-25 2021-04-01 富士フイルム株式会社 液晶ポリマーフィルム及びその製造方法、フレキシブル銅張積層板、並びにフレキシブルプリント回路基板
WO2022071527A1 (ja) * 2020-09-30 2022-04-07 ダイキン工業株式会社 フッ素樹脂材料、積層体、チューブおよびチューブの製造方法
WO2022113591A1 (ja) * 2020-11-30 2022-06-02 株式会社村田製作所 伝送線路及び電子機器

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5494858A (en) 1994-06-07 1996-02-27 Texas Instruments Incorporated Method for forming porous composites as a low dielectric constant layer with varying porosity distribution electronics applications
JP2005142473A (ja) * 2003-11-10 2005-06-02 Semiconductor Leading Edge Technologies Inc 半導体装置の製造方法
JP4577715B2 (ja) 2005-01-05 2010-11-10 株式会社神戸製鋼所 パターン電極を備えた多孔質誘電体基板の製造方法
CN101223835B (zh) * 2005-07-27 2012-07-04 株式会社可乐丽 热塑性液晶聚合物薄膜覆盖的线路板的制造方法
JP5154055B2 (ja) 2006-10-19 2013-02-27 株式会社プライマテック 電子回路基板の製造方法
WO2015064437A1 (ja) * 2013-11-01 2015-05-07 株式会社クラレ 熱可塑性液晶ポリマーフィルムの製造方法、並びに回路基板及びその製造方法
JP6135825B2 (ja) 2014-06-02 2017-05-31 株式会社村田製作所 伝送線路部材
CN206332152U (zh) * 2014-06-02 2017-07-14 株式会社村田制作所 传输线路构件
JP6854124B2 (ja) * 2016-12-28 2021-04-07 株式会社クラレ 熱可塑性液晶ポリマーフィルムおよびそれを用いた回路基板
CN210840269U (zh) 2017-02-16 2020-06-23 株式会社村田制作所 多层基板
WO2020013106A1 (ja) * 2018-07-10 2020-01-16 デンカ株式会社 熱可塑性液晶ポリマーフィルム、その製造方法およびフレキシブル銅張積層板
JP7024142B2 (ja) * 2019-04-23 2022-02-22 株式会社クラレ 熱可塑性液晶ポリマーフィルム、積層体、および成形体、ならびにそれらの製造方法
TW202229426A (zh) 2020-09-30 2022-08-01 日商富士軟片股份有限公司 液晶聚合物薄膜、柔性覆銅積層板及液晶聚合物薄膜之製造方法
JP2022086176A (ja) * 2020-11-30 2022-06-09 東レ株式会社 液晶性ポリエステル樹脂組成物、積層体、その製造方法および液晶性ポリエステル樹脂フィルム
JPWO2022260092A1 (https=) * 2021-06-09 2022-12-15

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003008233A (ja) * 2001-06-19 2003-01-10 Nitto Denko Corp 多層配線基板
WO2017110618A1 (ja) * 2015-12-24 2017-06-29 株式会社村田製作所 樹脂シート、樹脂シートの製造方法および樹脂多層基板の製造方法
WO2021059586A1 (ja) * 2019-09-25 2021-04-01 富士フイルム株式会社 液晶ポリマーフィルム及びその製造方法、フレキシブル銅張積層板、並びにフレキシブルプリント回路基板
WO2022071527A1 (ja) * 2020-09-30 2022-04-07 ダイキン工業株式会社 フッ素樹脂材料、積層体、チューブおよびチューブの製造方法
WO2022113591A1 (ja) * 2020-11-30 2022-06-02 株式会社村田製作所 伝送線路及び電子機器

Also Published As

Publication number Publication date
JP7722451B2 (ja) 2025-08-13
US12330392B2 (en) 2025-06-17
WO2022260094A1 (ja) 2022-12-15
US12507340B2 (en) 2025-12-23
US20230262876A1 (en) 2023-08-17
JPWO2022260092A1 (https=) 2022-12-15
US20230235229A1 (en) 2023-07-27
US20240076552A9 (en) 2024-03-07
WO2022260092A1 (ja) 2022-12-15
CN116249617A (zh) 2023-06-09
CN116323184A (zh) 2023-06-23

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