JPWO2022231753A5 - - Google Patents

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Publication number
JPWO2022231753A5
JPWO2022231753A5 JP2023546542A JP2023546542A JPWO2022231753A5 JP WO2022231753 A5 JPWO2022231753 A5 JP WO2022231753A5 JP 2023546542 A JP2023546542 A JP 2023546542A JP 2023546542 A JP2023546542 A JP 2023546542A JP WO2022231753 A5 JPWO2022231753 A5 JP WO2022231753A5
Authority
JP
Japan
Prior art keywords
photocurable composition
monomer
photocurable
polymerizable material
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023546542A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024516479A5 (https=
JP2024516479A (ja
Publication date
Priority claimed from US17/244,508 external-priority patent/US11753497B2/en
Application filed filed Critical
Publication of JP2024516479A publication Critical patent/JP2024516479A/ja
Publication of JP2024516479A5 publication Critical patent/JP2024516479A5/ja
Publication of JPWO2022231753A5 publication Critical patent/JPWO2022231753A5/ja
Pending legal-status Critical Current

Links

JP2023546542A 2021-04-29 2022-03-30 光硬化性組成物 Pending JP2024516479A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/244,508 US11753497B2 (en) 2021-04-29 2021-04-29 Photocurable composition
US17/244,508 2021-04-29
PCT/US2022/022536 WO2022231753A1 (en) 2021-04-29 2022-03-30 Photocurable composition

Publications (3)

Publication Number Publication Date
JP2024516479A JP2024516479A (ja) 2024-04-16
JP2024516479A5 JP2024516479A5 (https=) 2025-04-04
JPWO2022231753A5 true JPWO2022231753A5 (https=) 2025-04-04

Family

ID=83847288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023546542A Pending JP2024516479A (ja) 2021-04-29 2022-03-30 光硬化性組成物

Country Status (5)

Country Link
US (1) US11753497B2 (https=)
JP (1) JP2024516479A (https=)
KR (1) KR102899614B1 (https=)
TW (1) TWI833173B (https=)
WO (1) WO2022231753A1 (https=)

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1275668B1 (en) * 2000-03-30 2011-05-11 Mitsubishi Chemical Corporation Photocurable composition, cured object, and process for producing the same
US7745505B2 (en) * 2004-12-29 2010-06-29 Henkel Ag & Co. Kgaa Photoinitiators and UV-crosslinkable acrylic polymers for pressure sensitive adhesives
US7759407B2 (en) 2005-07-22 2010-07-20 Molecular Imprints, Inc. Composition for adhering materials together
JP2008138160A (ja) * 2006-11-08 2008-06-19 Sumitomo Osaka Cement Co Ltd ハードコート膜形成用塗料とハードコート膜及びハードコート膜付きプラスチック基材並びにポリビニル樹脂組成物の製造方法
US8106134B2 (en) 2008-08-28 2012-01-31 Bridgestone Sports Co., Ltd. Golf ball and method of improving golf ball performance
US20100109195A1 (en) 2008-11-05 2010-05-06 Molecular Imprints, Inc. Release agent partition control in imprint lithography
US20120016050A1 (en) 2008-12-26 2012-01-19 Leon Joseph A Monoisocyanate-Acrylate Monomers and Products Ulitilizing the Same
KR20110007687A (ko) * 2009-07-17 2011-01-25 공주대학교 산학협력단 무용제 자외선 경화형 아크릴 점착제 조성물 및 그 제조방법
EP2484706A1 (de) 2011-02-03 2012-08-08 Sika Technology AG Haftvermittlerzusammensetzung
IN2014DN00290A (https=) 2011-06-17 2015-06-05 Materia Inc
WO2013019821A1 (en) 2011-08-01 2013-02-07 Sun Chemical Corporation High-stretch energy curable inks & method of use in heat transfer label applications
CN103946998B (zh) * 2011-11-18 2017-03-29 Lg化学株式会社 用于封装有机电子器件的光可固化压敏粘合剂膜,有机电子器件及其封装方法
JP2016002683A (ja) * 2014-06-16 2016-01-12 コニカミノルタ株式会社 3d造形物の製造方法、3d造形用光硬化性組成物および3d造形用インクセット
JP2016183304A (ja) * 2015-03-26 2016-10-20 デクセリアルズ株式会社 アクリル系粘着テープの製造方法及びアクリル系粘着テープ
KR102047291B1 (ko) * 2016-09-23 2019-11-21 주식회사 엘지화학 접착제 조성물
KR101903906B1 (ko) * 2017-09-22 2018-10-02 주식회사 엘지화학 편광판 보호층용 무용제형 광경화성 수지 조성물, 이의 경화물을 포함하는 편광판 및 화상표시장치
CN108003802B (zh) * 2017-12-07 2021-03-30 烟台德邦科技股份有限公司 一种基于逐步聚合机理热致自愈合紫外光固化胶黏剂
US20200123408A1 (en) * 2017-12-15 2020-04-23 Rohm And Haas Electronic Materials Llc Uv-curing acrylic resin compositions for thermoformable hard coat applications
JP7211713B2 (ja) * 2018-04-12 2023-01-24 積水化学工業株式会社 接着剤樹脂組成物
US20200339828A1 (en) 2019-04-26 2020-10-29 Canon Kabushiki Kaisha Photocurable composition
US11549020B2 (en) * 2019-09-23 2023-01-10 Canon Kabushiki Kaisha Curable composition for nano-fabrication

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