JPWO2022210433A5 - - Google Patents

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Publication number
JPWO2022210433A5
JPWO2022210433A5 JP2022548413A JP2022548413A JPWO2022210433A5 JP WO2022210433 A5 JPWO2022210433 A5 JP WO2022210433A5 JP 2022548413 A JP2022548413 A JP 2022548413A JP 2022548413 A JP2022548413 A JP 2022548413A JP WO2022210433 A5 JPWO2022210433 A5 JP WO2022210433A5
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JP
Japan
Prior art keywords
maleimide resin
component
resin mixture
diamine
derived
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022548413A
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English (en)
Japanese (ja)
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JPWO2022210433A1 (https=
JP7152839B1 (ja
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Priority claimed from PCT/JP2022/014705 external-priority patent/WO2022210433A1/ja
Publication of JPWO2022210433A1 publication Critical patent/JPWO2022210433A1/ja
Application granted granted Critical
Publication of JP7152839B1 publication Critical patent/JP7152839B1/ja
Publication of JPWO2022210433A5 publication Critical patent/JPWO2022210433A5/ja
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JP2022548413A 2021-03-30 2022-03-25 マレイミド樹脂混合物、硬化性樹脂組成物、プリプレグおよびその硬化物 Active JP7152839B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021056834 2021-03-30
JP2021056834 2021-03-30
PCT/JP2022/014705 WO2022210433A1 (ja) 2021-03-30 2022-03-25 マレイミド樹脂混合物、硬化性樹脂組成物、プリプレグおよびその硬化物

Publications (3)

Publication Number Publication Date
JPWO2022210433A1 JPWO2022210433A1 (https=) 2022-10-06
JP7152839B1 JP7152839B1 (ja) 2022-10-13
JPWO2022210433A5 true JPWO2022210433A5 (https=) 2023-02-28

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ID=83456149

Family Applications (1)

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JP2022548413A Active JP7152839B1 (ja) 2021-03-30 2022-03-25 マレイミド樹脂混合物、硬化性樹脂組成物、プリプレグおよびその硬化物

Country Status (5)

Country Link
JP (1) JP7152839B1 (https=)
KR (1) KR102798548B1 (https=)
CN (1) CN117098789B (https=)
TW (1) TWI894455B (https=)
WO (1) WO2022210433A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202415705A (zh) * 2022-10-14 2024-04-16 日商日本化藥股份有限公司 樹脂組成物、硬化物、半導體元件及乾膜抗蝕劑

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5430440A (en) 1977-08-10 1979-03-06 Japan Storage Battery Co Ltd Inverter
JP2855138B2 (ja) 1990-07-17 1999-02-10 財団法人東北電気保安協会 柱上開閉器等の操作紐取り換え方法
JPH0637465A (ja) 1992-07-17 1994-02-10 Mitsubishi Electric Corp カバーの取付装置
JP2001316429A (ja) * 2000-05-01 2001-11-13 Mitsubishi Rayon Co Ltd ビスマレイミド樹脂組成物
JP2003100016A (ja) 2001-09-26 2003-04-04 Matsushita Electric Ind Co Ltd ディスク媒体の記録再生装置及び記録再生方法
JP4248939B2 (ja) 2003-06-09 2009-04-02 三井化学株式会社 カレンダー成形性を改良したポリオレフィン組成物およびこれを用いた壁紙
JP5030297B2 (ja) 2007-05-18 2012-09-19 日本化薬株式会社 積層板用樹脂組成物、プリプレグ及び積層板
KR102261470B1 (ko) * 2016-03-29 2021-06-07 닛뽄 가야쿠 가부시키가이샤 말레이미드 수지, 경화성 수지 조성물, 및 그 경화물
JP6964325B2 (ja) * 2017-05-22 2021-11-10 ユニチカ株式会社 イソマレイミドの製造方法
JP7024548B2 (ja) * 2018-03-28 2022-02-24 昭和電工マテリアルズ株式会社 マレイミド樹脂の製造方法
WO2020054601A1 (ja) * 2018-09-12 2020-03-19 日本化薬株式会社 マレイミド樹脂、硬化性樹脂組成物およびその硬化物
US20220179310A1 (en) * 2019-04-02 2022-06-09 Nippon Kayaku Kabushiki Kaisha Bismaleimide compound, photosensitive resin composition using same, cured product thereof, and semiconductor element
WO2021020563A1 (ja) * 2019-08-01 2021-02-04 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7547109B2 (ja) * 2019-08-01 2024-09-09 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7570241B2 (ja) * 2020-01-21 2024-10-21 日本化薬株式会社 硬化性樹脂組成物およびその硬化物
EP4094940A1 (en) * 2020-01-24 2022-11-30 Mitsubishi Gas Chemical Company, Inc. Resin composition, resin sheet, prepreg, and printed wiring board
KR102727867B1 (ko) * 2020-03-11 2024-11-07 닛뽄 가야쿠 가부시키가이샤 말레이미드 수지 및 그의 제조 방법, 말레이미드 용액, 그리고, 경화성 수지 조성물 및 그의 경화물

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