JPWO2022210433A5 - - Google Patents
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- Publication number
- JPWO2022210433A5 JPWO2022210433A5 JP2022548413A JP2022548413A JPWO2022210433A5 JP WO2022210433 A5 JPWO2022210433 A5 JP WO2022210433A5 JP 2022548413 A JP2022548413 A JP 2022548413A JP 2022548413 A JP2022548413 A JP 2022548413A JP WO2022210433 A5 JPWO2022210433 A5 JP WO2022210433A5
- Authority
- JP
- Japan
- Prior art keywords
- maleimide resin
- component
- resin mixture
- diamine
- derived
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims 13
- 239000011347 resin Substances 0.000 claims 13
- 229920005989 resin Polymers 0.000 claims 13
- 239000000203 mixture Substances 0.000 claims 9
- 150000004985 diamines Chemical class 0.000 claims 8
- 125000000962 organic group Chemical group 0.000 claims 7
- 239000002253 acid Substances 0.000 claims 6
- 125000004432 carbon atom Chemical group C* 0.000 claims 6
- 239000000539 dimer Substances 0.000 claims 6
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 5
- 239000011342 resin composition Substances 0.000 claims 4
- 125000002723 alicyclic group Chemical group 0.000 claims 3
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims 2
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims 2
- 125000003118 aryl group Chemical group 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 125000002950 monocyclic group Chemical group 0.000 claims 1
- 125000003367 polycyclic group Chemical group 0.000 claims 1
Claims (8)
前記成分(A)と前記成分(B)の重量比率が99/1~60/40であり、
前記成分(b)が炭素数4~60のジアミン(b-1)と、テトラカルボン酸二無水物(b-2)とを反応させて得られたものであり、
前記成分(b-1)がダイマー酸から誘導されたジアミン(b-1a)である、マレイミド樹脂混合物。
The weight ratio of the component (A) and the component (B) is 99/1 to 60/40,
The component (b) is obtained by reacting a diamine (b-1) having 4 to 60 carbon atoms with a tetracarboxylic dianhydride (b-2),
A maleimide resin mixture, wherein the component (b-1) is a diamine (b-1a) derived from a dimer acid.
前記成分(A)と前記成分(B)の重量比率が70/30~50/50であり、The weight ratio of the component (A) and the component (B) is 70/30 to 50/50,
前記成分(b)が炭素数4~60のジアミン(b-1)と、テトラカルボン酸二無水物(b-2)とを反応させて得られたものであり、The component (b) is obtained by reacting a diamine (b-1) having 4 to 60 carbon atoms with a tetracarboxylic dianhydride (b-2),
前記成分(b-1)がダイマー酸から誘導されたジアミン(b-1a)である、マレイミド樹脂混合物。A maleimide resin mixture, wherein the component (b-1) is a diamine (b-1a) derived from a dimer acid.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021056834 | 2021-03-30 | ||
JP2021056834 | 2021-03-30 | ||
PCT/JP2022/014705 WO2022210433A1 (en) | 2021-03-30 | 2022-03-25 | Maleimide resin mixture, curable resin composition, prepreg and cured product thereof |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2022210433A1 JPWO2022210433A1 (en) | 2022-10-06 |
JP7152839B1 JP7152839B1 (en) | 2022-10-13 |
JPWO2022210433A5 true JPWO2022210433A5 (en) | 2023-02-28 |
Family
ID=83456149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022548413A Active JP7152839B1 (en) | 2021-03-30 | 2022-03-25 | Maleimide resin mixture, curable resin composition, prepreg and cured product thereof |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7152839B1 (en) |
KR (1) | KR20230161451A (en) |
CN (1) | CN117098789A (en) |
TW (1) | TW202305038A (en) |
WO (1) | WO2022210433A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024079923A1 (en) * | 2022-10-14 | 2024-04-18 | 日本化薬株式会社 | Resin composition, cured product, semiconductor element, and dry film resist |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5430440A (en) | 1977-08-10 | 1979-03-06 | Japan Storage Battery Co Ltd | Inverter |
JPH03100016A (en) | 1989-09-14 | 1991-04-25 | Mitsui Toatsu Chem Inc | Preparation of polymaleimide compound |
JP2855138B2 (en) | 1990-07-17 | 1999-02-10 | 財団法人東北電気保安協会 | How to replace the operation cord of a pole switch etc. |
JP2570923B2 (en) | 1991-06-07 | 1997-01-16 | 信越化学工業株式会社 | Thermosetting resin composition |
JPH0637465A (en) | 1992-07-17 | 1994-02-10 | Mitsubishi Electric Corp | Fitting device for cover |
JP2001316429A (en) * | 2000-05-01 | 2001-11-13 | Mitsubishi Rayon Co Ltd | Bismaleimide resin composition |
JP5030297B2 (en) | 2007-05-18 | 2012-09-19 | 日本化薬株式会社 | Laminate resin composition, prepreg and laminate |
JP6964325B2 (en) * | 2017-05-22 | 2021-11-10 | ユニチカ株式会社 | Method for producing isomareimide |
JP7024548B2 (en) * | 2018-03-28 | 2022-02-24 | 昭和電工マテリアルズ株式会社 | Maleimide resin manufacturing method |
KR20210056996A (en) * | 2018-09-12 | 2021-05-20 | 니폰 가야꾸 가부시끼가이샤 | Maleimide resin, curable resin composition and cured product thereof |
JP7066918B2 (en) * | 2019-04-02 | 2022-05-13 | 日本化薬株式会社 | Bismaleimide compound, photosensitive resin composition using it, cured product thereof and semiconductor device |
KR20220043123A (en) * | 2019-08-01 | 2022-04-05 | 세키스이가가쿠 고교가부시키가이샤 | Resin material and multilayer printed wiring board |
JP2021025053A (en) * | 2019-08-01 | 2021-02-22 | 積水化学工業株式会社 | Resin material and multilayer printed wiring board |
JP2021116423A (en) * | 2020-01-21 | 2021-08-10 | 日本化薬株式会社 | Curable resin composition and cured product thereof |
WO2021149733A1 (en) * | 2020-01-24 | 2021-07-29 | 三菱瓦斯化学株式会社 | Resin composition, resin sheet, prepreg, and printed wiring board |
-
2022
- 2022-03-25 CN CN202280026458.7A patent/CN117098789A/en active Pending
- 2022-03-25 KR KR1020237032634A patent/KR20230161451A/en unknown
- 2022-03-25 WO PCT/JP2022/014705 patent/WO2022210433A1/en active Application Filing
- 2022-03-25 JP JP2022548413A patent/JP7152839B1/en active Active
- 2022-03-30 TW TW111112253A patent/TW202305038A/en unknown
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