JPWO2022234829A5 - - Google Patents

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Publication number
JPWO2022234829A5
JPWO2022234829A5 JP2022564751A JP2022564751A JPWO2022234829A5 JP WO2022234829 A5 JPWO2022234829 A5 JP WO2022234829A5 JP 2022564751 A JP2022564751 A JP 2022564751A JP 2022564751 A JP2022564751 A JP 2022564751A JP WO2022234829 A5 JPWO2022234829 A5 JP WO2022234829A5
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JP
Japan
Prior art keywords
formula
chemical
repetitions
resin composition
curable resin
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JP2022564751A
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English (en)
Japanese (ja)
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JP7208705B1 (ja
JPWO2022234829A1 (https=
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Priority claimed from PCT/JP2022/019408 external-priority patent/WO2022234829A1/ja
Publication of JPWO2022234829A1 publication Critical patent/JPWO2022234829A1/ja
Application granted granted Critical
Publication of JP7208705B1 publication Critical patent/JP7208705B1/ja
Publication of JPWO2022234829A5 publication Critical patent/JPWO2022234829A5/ja
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JP2022564751A 2021-05-06 2022-04-28 マレイミド樹脂、硬化性樹脂組成物およびその硬化物 Active JP7208705B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021078279 2021-05-06
JP2021078279 2021-05-06
PCT/JP2022/019408 WO2022234829A1 (ja) 2021-05-06 2022-04-28 マレイミド樹脂、硬化性樹脂組成物およびその硬化物

Publications (3)

Publication Number Publication Date
JPWO2022234829A1 JPWO2022234829A1 (https=) 2022-11-10
JP7208705B1 JP7208705B1 (ja) 2023-01-19
JPWO2022234829A5 true JPWO2022234829A5 (https=) 2023-04-05

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ID=83932742

Family Applications (1)

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JP2022564751A Active JP7208705B1 (ja) 2021-05-06 2022-04-28 マレイミド樹脂、硬化性樹脂組成物およびその硬化物

Country Status (5)

Country Link
JP (1) JP7208705B1 (https=)
KR (1) KR102772152B1 (https=)
CN (1) CN117279962B (https=)
TW (1) TWI881218B (https=)
WO (1) WO2022234829A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7353412B1 (ja) * 2022-03-28 2023-09-29 日本化薬株式会社 マレイミド化合物、硬化性樹脂組成物及びその硬化物、並びにアミン化合物
WO2023243516A1 (ja) * 2022-06-14 2023-12-21 デンカ株式会社 反応性硬化剤
JP7781429B2 (ja) * 2022-07-13 2025-12-08 株式会社岐阜セラツク製造所 高分子化合物、樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板、及び半導体パッケージ
JP7534517B1 (ja) * 2023-03-23 2024-08-14 日本化薬株式会社 マレイミド樹脂混合物、硬化性樹脂組成物およびその硬化物
JP7744551B1 (ja) * 2023-12-25 2025-09-25 日本化薬株式会社 硬化性樹脂組成物、ワニスおよびその硬化物
WO2026070908A1 (ja) * 2024-09-26 2026-04-02 日本化薬株式会社 マレイミド樹脂混合物、硬化性樹脂組成物およびその硬化物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3245933A (en) * 1960-05-19 1966-04-12 Sinclair Research Inc Styrene-maleic anhydride copolymers cross-linked with aliphatic polyhydroxy compounds
JP2570923B2 (ja) 1991-06-07 1997-01-16 信越化学工業株式会社 熱硬化性樹脂組成物
JPH08318315A (ja) * 1995-05-26 1996-12-03 Howa Mach Ltd 溶断加工機のマーキング装置
JPH08319315A (ja) * 1995-05-29 1996-12-03 Sumitomo Chem Co Ltd スチレン系ランダム共重合体及びその製造方法
JP2002068429A (ja) * 2000-09-01 2002-03-08 Murata Mach Ltd 制震ラック
TWI242578B (en) * 2003-08-21 2005-11-01 Chi Mei Corp Rubber modified styrene system resin composition for extrusion molding
JP5649773B2 (ja) * 2007-05-31 2015-01-07 三菱瓦斯化学株式会社 硬化性樹脂組成物および硬化性フィルムならびにそれらの硬化物
ATE541879T1 (de) * 2008-06-09 2012-02-15 Mitsubishi Gas Chemical Co Bismaleaminsäure, bismaleinimid und gehärtetes produkt davon
JP5691312B2 (ja) * 2010-09-06 2015-04-01 横浜ゴム株式会社 シーラント用の硬化促進剤およびこれを用いるシーラントの施工方法
GB2511574B (en) 2013-03-08 2017-10-04 Magnomatics Ltd Permanent magnet assembly for mounting to a rotor
JP6744234B2 (ja) * 2016-02-04 2020-08-19 日本化薬株式会社 マレイミド樹脂組成物、プリプレグ及びその硬化物
KR102261470B1 (ko) * 2016-03-29 2021-06-07 닛뽄 가야쿠 가부시키가이샤 말레이미드 수지, 경화성 수지 조성물, 및 그 경화물
US10876000B2 (en) * 2016-06-02 2020-12-29 Showa Denko Materials Co., Ltd. Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module
CN110204862B (zh) * 2019-05-31 2021-11-30 广东生益科技股份有限公司 树脂组合物、预浸料、层压板、覆金属箔层压板以及印刷线路板

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