JPWO2024053402A5 - - Google Patents

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Publication number
JPWO2024053402A5
JPWO2024053402A5 JP2024524566A JP2024524566A JPWO2024053402A5 JP WO2024053402 A5 JPWO2024053402 A5 JP WO2024053402A5 JP 2024524566 A JP2024524566 A JP 2024524566A JP 2024524566 A JP2024524566 A JP 2024524566A JP WO2024053402 A5 JPWO2024053402 A5 JP WO2024053402A5
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JP
Japan
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group
glycidyl
containing compound
resin composition
curable resin
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JP2024524566A
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English (en)
Japanese (ja)
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JP7568172B2 (ja
JPWO2024053402A1 (https=
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Priority claimed from PCT/JP2023/030419 external-priority patent/WO2024053402A1/ja
Publication of JPWO2024053402A1 publication Critical patent/JPWO2024053402A1/ja
Publication of JPWO2024053402A5 publication Critical patent/JPWO2024053402A5/ja
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JP2024524566A 2022-09-06 2023-08-24 グリシジル基含有化合物、硬化性樹脂組成物、硬化物及び積層体 Active JP7568172B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022141291 2022-09-06
JP2022141291 2022-09-06
PCT/JP2023/030419 WO2024053402A1 (ja) 2022-09-06 2023-08-24 グリシジル基含有化合物、硬化性樹脂組成物、硬化物及び積層体

Publications (3)

Publication Number Publication Date
JPWO2024053402A1 JPWO2024053402A1 (https=) 2024-03-14
JPWO2024053402A5 true JPWO2024053402A5 (https=) 2024-08-14
JP7568172B2 JP7568172B2 (ja) 2024-10-16

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JP2024524566A Active JP7568172B2 (ja) 2022-09-06 2023-08-24 グリシジル基含有化合物、硬化性樹脂組成物、硬化物及び積層体

Country Status (6)

Country Link
EP (1) EP4585594A1 (https=)
JP (1) JP7568172B2 (https=)
KR (1) KR20250056887A (https=)
CN (1) CN119384417A (https=)
TW (1) TW202411223A (https=)
WO (1) WO2024053402A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025249176A1 (ja) * 2024-05-27 2025-12-04 Dic株式会社 エポキシ樹脂組成物、その硬化物及び積層体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4017571B1 (https=) * 1963-05-06 1965-08-10
JP4087602B2 (ja) * 2001-12-14 2008-05-21 横浜ゴム株式会社 硬化性化合物およびそれを含む硬化性樹脂組成物
JP2013256557A (ja) 2012-06-11 2013-12-26 Hitachi Ltd 接着剤組成物及び接着構造体の解体方法
JP6575220B2 (ja) 2015-08-18 2019-09-18 富士電機株式会社 半導体装置
CN107474234B (zh) * 2017-08-01 2019-10-29 大连理工大学 功能化/热可逆交联聚醚及其制备方法
CN109748907B (zh) * 2018-12-28 2022-04-12 中国林业科学研究院林产化学工业研究所 桐油源酰亚胺基缩水甘油酯及其制备方法和应用
JP7619080B2 (ja) * 2020-03-24 2025-01-22 Dic株式会社 エポキシ樹脂、エポキシ樹脂組成物、その硬化物、及び積層体
WO2021251099A1 (ja) * 2020-06-12 2021-12-16 国立大学法人九州大学 易解体性接着材料、物品および解体方法
CN112409298B (zh) * 2020-11-17 2022-11-15 中国科学院宁波材料技术与工程研究所 一种基于对羟基肉桂酸的环氧树脂单体及其制备方法和应用
JP7763242B2 (ja) * 2021-03-23 2025-10-31 綜研化学株式会社 エポキシ樹脂組成物、エポキシ樹脂硬化物

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