KR20250056887A - 글리시딜기 함유 화합물, 경화성 수지 조성물, 경화물 및 적층체 - Google Patents

글리시딜기 함유 화합물, 경화성 수지 조성물, 경화물 및 적층체 Download PDF

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Publication number
KR20250056887A
KR20250056887A KR1020257002059A KR20257002059A KR20250056887A KR 20250056887 A KR20250056887 A KR 20250056887A KR 1020257002059 A KR1020257002059 A KR 1020257002059A KR 20257002059 A KR20257002059 A KR 20257002059A KR 20250056887 A KR20250056887 A KR 20250056887A
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KR
South Korea
Prior art keywords
group
glycidyl
resin composition
curable resin
resin
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Pending
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KR1020257002059A
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English (en)
Korean (ko)
Inventor
가즈오 아리타
에츠코 스즈키
Original Assignee
디아이씨 가부시끼가이샤
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Publication of KR20250056887A publication Critical patent/KR20250056887A/ko
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D405/00Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom
    • C07D405/14Heterocyclic compounds containing both one or more hetero rings having oxygen atoms as the only ring hetero atoms, and one or more rings having nitrogen as the only ring hetero atom containing three or more hetero rings
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D491/00Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00
    • C07D491/12Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00 in which the condensed system contains three hetero rings
    • C07D491/18Bridged systems
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/027Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/26Di-epoxy compounds heterocyclic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/3236Heterocylic compounds
    • C08G59/3245Heterocylic compounds containing only nitrogen as a heteroatom
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/34Epoxy compounds containing three or more epoxy groups obtained by epoxidation of an unsaturated polymer
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
KR1020257002059A 2022-09-06 2023-08-24 글리시딜기 함유 화합물, 경화성 수지 조성물, 경화물 및 적층체 Pending KR20250056887A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022141291 2022-09-06
JPJP-P-2022-141291 2022-09-06
PCT/JP2023/030419 WO2024053402A1 (ja) 2022-09-06 2023-08-24 グリシジル基含有化合物、硬化性樹脂組成物、硬化物及び積層体

Publications (1)

Publication Number Publication Date
KR20250056887A true KR20250056887A (ko) 2025-04-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257002059A Pending KR20250056887A (ko) 2022-09-06 2023-08-24 글리시딜기 함유 화합물, 경화성 수지 조성물, 경화물 및 적층체

Country Status (6)

Country Link
EP (1) EP4585594A1 (https=)
JP (1) JP7568172B2 (https=)
KR (1) KR20250056887A (https=)
CN (1) CN119384417A (https=)
TW (1) TW202411223A (https=)
WO (1) WO2024053402A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025249176A1 (ja) * 2024-05-27 2025-12-04 Dic株式会社 エポキシ樹脂組成物、その硬化物及び積層体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013256557A (ja) 2012-06-11 2013-12-26 Hitachi Ltd 接着剤組成物及び接着構造体の解体方法
JP2017041496A (ja) 2015-08-18 2017-02-23 富士電機株式会社 半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4017571B1 (https=) * 1963-05-06 1965-08-10
JP4087602B2 (ja) * 2001-12-14 2008-05-21 横浜ゴム株式会社 硬化性化合物およびそれを含む硬化性樹脂組成物
CN107474234B (zh) * 2017-08-01 2019-10-29 大连理工大学 功能化/热可逆交联聚醚及其制备方法
CN109748907B (zh) * 2018-12-28 2022-04-12 中国林业科学研究院林产化学工业研究所 桐油源酰亚胺基缩水甘油酯及其制备方法和应用
JP7619080B2 (ja) * 2020-03-24 2025-01-22 Dic株式会社 エポキシ樹脂、エポキシ樹脂組成物、その硬化物、及び積層体
WO2021251099A1 (ja) * 2020-06-12 2021-12-16 国立大学法人九州大学 易解体性接着材料、物品および解体方法
CN112409298B (zh) * 2020-11-17 2022-11-15 中国科学院宁波材料技术与工程研究所 一种基于对羟基肉桂酸的环氧树脂单体及其制备方法和应用
JP7763242B2 (ja) * 2021-03-23 2025-10-31 綜研化学株式会社 エポキシ樹脂組成物、エポキシ樹脂硬化物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013256557A (ja) 2012-06-11 2013-12-26 Hitachi Ltd 接着剤組成物及び接着構造体の解体方法
JP2017041496A (ja) 2015-08-18 2017-02-23 富士電機株式会社 半導体装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Amendola, E., Iacono, S.D., Pastore, A., Curcio, M., Giordano, M. and Iadonisi, A. "Epoxy Thermosets with Self-Healing Ability", Journal of Materials Science and Chemical Engineering, 2015, 3, p162-167

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Publication number Publication date
JP7568172B2 (ja) 2024-10-16
CN119384417A (zh) 2025-01-28
EP4585594A1 (en) 2025-07-16
WO2024053402A1 (ja) 2024-03-14
JPWO2024053402A1 (https=) 2024-03-14
TW202411223A (zh) 2024-03-16

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Patent event date: 20250120

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application