JPWO2022210096A1 - - Google Patents

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Publication number
JPWO2022210096A1
JPWO2022210096A1 JP2023511017A JP2023511017A JPWO2022210096A1 JP WO2022210096 A1 JPWO2022210096 A1 JP WO2022210096A1 JP 2023511017 A JP2023511017 A JP 2023511017A JP 2023511017 A JP2023511017 A JP 2023511017A JP WO2022210096 A1 JPWO2022210096 A1 JP WO2022210096A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2023511017A
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JPWO2022210096A5 (ja
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Publication of JPWO2022210096A1 publication Critical patent/JPWO2022210096A1/ja
Publication of JPWO2022210096A5 publication Critical patent/JPWO2022210096A5/ja
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C08G65/4006(I) or (II) containing elements other than carbon, oxygen, hydrogen or halogen as leaving group (X)
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/285Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/06Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • C08F290/062Polyethers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14Polymers provided for in subclass C08G
    • C08F290/142Polyethers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C08G65/4012Other compound (II) containing a ketone group, e.g. X-Ar-C(=O)-Ar-X for polyetherketones
    • C08G65/4031(I) or (II) containing nitrogen
    • C08G65/4037(I) or (II) containing nitrogen in ring structure, e.g. pyridine group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48Polymers modified by chemical after-treatment
    • C08G65/485Polyphenylene oxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12Unsaturated polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/14Peroxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415Five-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085Unsaturated polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0346Organic insulating material consisting of one material containing N
JP2023511017A 2021-04-02 2022-03-22 Pending JPWO2022210096A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021063607 2021-04-02
JP2021063606 2021-04-02
PCT/JP2022/013159 WO2022210096A1 (ja) 2021-04-02 2022-03-22 絶縁膜形成用感放射線性組成物、パターンを有する樹脂膜および半導体回路基板

Publications (2)

Publication Number Publication Date
JPWO2022210096A1 true JPWO2022210096A1 (ja) 2022-10-06
JPWO2022210096A5 JPWO2022210096A5 (ja) 2024-01-11

Family

ID=83455279

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023511016A Pending JPWO2022210095A1 (ja) 2021-04-02 2022-03-22
JP2023511017A Pending JPWO2022210096A1 (ja) 2021-04-02 2022-03-22

Family Applications Before (1)

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JP2023511016A Pending JPWO2022210095A1 (ja) 2021-04-02 2022-03-22

Country Status (6)

Country Link
US (1) US20240026069A1 (ja)
EP (1) EP4316814A1 (ja)
JP (2) JPWO2022210095A1 (ja)
KR (2) KR20230165903A (ja)
TW (2) TW202239815A (ja)
WO (2) WO2022210095A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202330717A (zh) * 2021-09-21 2023-08-01 日商日產化學股份有限公司 非感光性絕緣膜形成組成物

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1527714A (fr) * 1966-07-01 1968-06-07 Inst Francais Du Petrole Polyéthers dérivés de la pyridine
JPS5347496A (en) * 1976-10-14 1978-04-27 Kanegafuchi Chem Ind Co Ltd Active halogen atom-containing polyether and its preparation
FR2587348B1 (fr) * 1985-09-16 1988-02-05 Mat Organ Technolog Centre Compositions d'oligomeres de polyaryloxypyridine a terminaisons phtalonitriles, leur preparation, leur utilisation dans la fabrication de reseaux de polyaryloxypyridine co-polyphtalocyanines, et les reseaux obtenus
JP2540521B2 (ja) * 1986-08-01 1996-10-02 三井東圧化学株式会社 熱可塑性芳香族ポリエ−テルピリジンおよびその製造方法
JPH0713142B2 (ja) * 1986-11-06 1995-02-15 三井東圧化学株式会社 熱可塑性芳香族ポリエ−テルピリジンおよびその製造方法
FR2605010B1 (fr) * 1986-10-09 1988-12-30 Etu Materiaux Organiques Centr Compositions d'oligomeres de polyaryloxypyridines a terminaisons acetyleniques, leur preparation, et les reseaux obtenus par leur polymerisation thermique
JPH0673003A (ja) * 1992-08-28 1994-03-15 Toshiba Corp ビスマレイミド化合物及び感光性樹脂組成物
JPH07188362A (ja) 1993-12-27 1995-07-25 Asahi Chem Ind Co Ltd 硬化ポリフェニレンエーテル系樹脂フィルム
JP3414556B2 (ja) 1995-07-24 2003-06-09 昭和高分子株式会社 ポリビニルベンジルエーテル化合物およびその製造方法
JP4190093B2 (ja) * 1999-06-24 2008-12-03 株式会社Adeka ピペリジン誘導体重合物及びこれを含有する高分子組成物
JP2003306591A (ja) 2002-02-13 2003-10-31 Showa Highpolymer Co Ltd 硬化性樹脂組成物およびそれを用いた層間絶縁材料
JP3801117B2 (ja) 2002-08-26 2006-07-26 株式会社日立製作所 低誘電正接フィルムおよび配線フィルム
JP2005060507A (ja) 2003-08-11 2005-03-10 Sumitomo Bakelite Co Ltd 樹脂組成物
JP2006076950A (ja) * 2004-09-10 2006-03-23 Asahi Denka Kogyo Kk ピペリジル基含有化合物、該化合物の重合体及び共重合体、並びに該化合物の製造方法
JP3891441B2 (ja) * 2004-10-21 2007-03-14 独立行政法人 宇宙航空研究開発機構 繊維強化ポリイミド複合材料の製造方法
JP2006178059A (ja) 2004-12-21 2006-07-06 Hitachi Chemical Dupont Microsystems Ltd ネガ型感光性樹脂組成物、パターンの製造方法及び電子部品
JP5649773B2 (ja) 2007-05-31 2015-01-07 三菱瓦斯化学株式会社 硬化性樹脂組成物および硬化性フィルムならびにそれらの硬化物
US20110003955A1 (en) * 2008-02-07 2011-01-06 Daiwa Can Company Imide Oligomer And Polyimide Resin Obtained By Thermal Curing Thereof
JP2009260232A (ja) * 2008-03-26 2009-11-05 Hitachi Chem Co Ltd 半導体封止用フィルム状接着剤、半導体装置及びその製造方法
JP5522479B2 (ja) * 2008-09-03 2014-06-18 株式会社カネカ 2−フェニル−4,4’−ジアミノジフェニルエーテル類を用いた可溶性末端変性イミドオリゴマー、およびワニス、およびその硬化物、およびそのイミドプリプレグ、および耐熱性に優れる繊維強化積層板
JP5807523B2 (ja) 2011-04-08 2015-11-10 大日本印刷株式会社 レジスト帯電防止膜積層体及びレリーフパターン製造方法
JP2014215440A (ja) * 2013-04-25 2014-11-17 日立化成株式会社 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、及び半導体装置
JP2015147907A (ja) * 2014-02-07 2015-08-20 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物、樹脂組成物を用いた硬化膜の製造方法及び電子部品
CN106104381B (zh) * 2014-03-17 2019-12-13 旭化成株式会社 感光性树脂组合物、固化浮雕图案的制造方法、以及半导体装置
JP6866737B2 (ja) * 2016-04-20 2021-04-28 Jsr株式会社 重合体、組成物及び成形体
JP6919290B2 (ja) 2016-04-27 2021-08-18 Jsr株式会社 組成物、硬化物及び積層体
KR102354532B1 (ko) * 2016-08-22 2022-02-08 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 경화 릴리프 패턴의 제조 방법
WO2020004500A1 (ja) * 2018-06-26 2020-01-02 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
JP2020029504A (ja) 2018-08-22 2020-02-27 日立化成株式会社 硬化性組成物
WO2020226131A1 (ja) * 2019-05-08 2020-11-12 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
WO2020226132A1 (ja) * 2019-05-08 2020-11-12 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
JPWO2021079977A1 (ja) * 2019-10-25 2021-04-29
KR20220155258A (ko) * 2020-03-18 2022-11-22 닛산 가가쿠 가부시키가이샤 감광성 절연막 형성 조성물

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Publication number Publication date
KR20230165904A (ko) 2023-12-05
EP4316814A1 (en) 2024-02-07
KR20230165903A (ko) 2023-12-05
JPWO2022210095A1 (ja) 2022-10-06
US20240026069A1 (en) 2024-01-25
TW202239815A (zh) 2022-10-16
WO2022210095A1 (ja) 2022-10-06
WO2022210096A1 (ja) 2022-10-06
TW202305034A (zh) 2023-02-01

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