JPWO2022210096A1 - - Google Patents
Info
- Publication number
- JPWO2022210096A1 JPWO2022210096A1 JP2023511017A JP2023511017A JPWO2022210096A1 JP WO2022210096 A1 JPWO2022210096 A1 JP WO2022210096A1 JP 2023511017 A JP2023511017 A JP 2023511017A JP 2023511017 A JP2023511017 A JP 2023511017A JP WO2022210096 A1 JPWO2022210096 A1 JP WO2022210096A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
- C08G65/4006—(I) or (II) containing elements other than carbon, oxygen, hydrogen or halogen as leaving group (X)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/062—Polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/142—Polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
- C08G65/4012—Other compound (II) containing a ketone group, e.g. X-Ar-C(=O)-Ar-X for polyetherketones
- C08G65/4031—(I) or (II) containing nitrogen
- C08G65/4037—(I) or (II) containing nitrogen in ring structure, e.g. pyridine group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
- C08G65/485—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L79/085—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021063607 | 2021-04-02 | ||
JP2021063606 | 2021-04-02 | ||
PCT/JP2022/013159 WO2022210096A1 (ja) | 2021-04-02 | 2022-03-22 | 絶縁膜形成用感放射線性組成物、パターンを有する樹脂膜および半導体回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022210096A1 true JPWO2022210096A1 (ja) | 2022-10-06 |
JPWO2022210096A5 JPWO2022210096A5 (ja) | 2024-01-11 |
Family
ID=83455279
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023511016A Pending JPWO2022210095A1 (ja) | 2021-04-02 | 2022-03-22 | |
JP2023511017A Pending JPWO2022210096A1 (ja) | 2021-04-02 | 2022-03-22 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023511016A Pending JPWO2022210095A1 (ja) | 2021-04-02 | 2022-03-22 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20240026069A1 (ja) |
EP (1) | EP4316814A1 (ja) |
JP (2) | JPWO2022210095A1 (ja) |
KR (2) | KR20230165903A (ja) |
TW (2) | TW202239815A (ja) |
WO (2) | WO2022210095A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW202330717A (zh) * | 2021-09-21 | 2023-08-01 | 日商日產化學股份有限公司 | 非感光性絕緣膜形成組成物 |
Family Cites Families (33)
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FR1527714A (fr) * | 1966-07-01 | 1968-06-07 | Inst Francais Du Petrole | Polyéthers dérivés de la pyridine |
JPS5347496A (en) * | 1976-10-14 | 1978-04-27 | Kanegafuchi Chem Ind Co Ltd | Active halogen atom-containing polyether and its preparation |
FR2587348B1 (fr) * | 1985-09-16 | 1988-02-05 | Mat Organ Technolog Centre | Compositions d'oligomeres de polyaryloxypyridine a terminaisons phtalonitriles, leur preparation, leur utilisation dans la fabrication de reseaux de polyaryloxypyridine co-polyphtalocyanines, et les reseaux obtenus |
JP2540521B2 (ja) * | 1986-08-01 | 1996-10-02 | 三井東圧化学株式会社 | 熱可塑性芳香族ポリエ−テルピリジンおよびその製造方法 |
JPH0713142B2 (ja) * | 1986-11-06 | 1995-02-15 | 三井東圧化学株式会社 | 熱可塑性芳香族ポリエ−テルピリジンおよびその製造方法 |
FR2605010B1 (fr) * | 1986-10-09 | 1988-12-30 | Etu Materiaux Organiques Centr | Compositions d'oligomeres de polyaryloxypyridines a terminaisons acetyleniques, leur preparation, et les reseaux obtenus par leur polymerisation thermique |
JPH0673003A (ja) * | 1992-08-28 | 1994-03-15 | Toshiba Corp | ビスマレイミド化合物及び感光性樹脂組成物 |
JPH07188362A (ja) | 1993-12-27 | 1995-07-25 | Asahi Chem Ind Co Ltd | 硬化ポリフェニレンエーテル系樹脂フィルム |
JP3414556B2 (ja) | 1995-07-24 | 2003-06-09 | 昭和高分子株式会社 | ポリビニルベンジルエーテル化合物およびその製造方法 |
JP4190093B2 (ja) * | 1999-06-24 | 2008-12-03 | 株式会社Adeka | ピペリジン誘導体重合物及びこれを含有する高分子組成物 |
JP2003306591A (ja) | 2002-02-13 | 2003-10-31 | Showa Highpolymer Co Ltd | 硬化性樹脂組成物およびそれを用いた層間絶縁材料 |
JP3801117B2 (ja) | 2002-08-26 | 2006-07-26 | 株式会社日立製作所 | 低誘電正接フィルムおよび配線フィルム |
JP2005060507A (ja) | 2003-08-11 | 2005-03-10 | Sumitomo Bakelite Co Ltd | 樹脂組成物 |
JP2006076950A (ja) * | 2004-09-10 | 2006-03-23 | Asahi Denka Kogyo Kk | ピペリジル基含有化合物、該化合物の重合体及び共重合体、並びに該化合物の製造方法 |
JP3891441B2 (ja) * | 2004-10-21 | 2007-03-14 | 独立行政法人 宇宙航空研究開発機構 | 繊維強化ポリイミド複合材料の製造方法 |
JP2006178059A (ja) | 2004-12-21 | 2006-07-06 | Hitachi Chemical Dupont Microsystems Ltd | ネガ型感光性樹脂組成物、パターンの製造方法及び電子部品 |
JP5649773B2 (ja) | 2007-05-31 | 2015-01-07 | 三菱瓦斯化学株式会社 | 硬化性樹脂組成物および硬化性フィルムならびにそれらの硬化物 |
US20110003955A1 (en) * | 2008-02-07 | 2011-01-06 | Daiwa Can Company | Imide Oligomer And Polyimide Resin Obtained By Thermal Curing Thereof |
JP2009260232A (ja) * | 2008-03-26 | 2009-11-05 | Hitachi Chem Co Ltd | 半導体封止用フィルム状接着剤、半導体装置及びその製造方法 |
JP5522479B2 (ja) * | 2008-09-03 | 2014-06-18 | 株式会社カネカ | 2−フェニル−4,4’−ジアミノジフェニルエーテル類を用いた可溶性末端変性イミドオリゴマー、およびワニス、およびその硬化物、およびそのイミドプリプレグ、および耐熱性に優れる繊維強化積層板 |
JP5807523B2 (ja) | 2011-04-08 | 2015-11-10 | 大日本印刷株式会社 | レジスト帯電防止膜積層体及びレリーフパターン製造方法 |
JP2014215440A (ja) * | 2013-04-25 | 2014-11-17 | 日立化成株式会社 | 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、及び半導体装置 |
JP2015147907A (ja) * | 2014-02-07 | 2015-08-20 | 日立化成デュポンマイクロシステムズ株式会社 | 樹脂組成物、樹脂組成物を用いた硬化膜の製造方法及び電子部品 |
CN106104381B (zh) * | 2014-03-17 | 2019-12-13 | 旭化成株式会社 | 感光性树脂组合物、固化浮雕图案的制造方法、以及半导体装置 |
JP6866737B2 (ja) * | 2016-04-20 | 2021-04-28 | Jsr株式会社 | 重合体、組成物及び成形体 |
JP6919290B2 (ja) | 2016-04-27 | 2021-08-18 | Jsr株式会社 | 組成物、硬化物及び積層体 |
KR102354532B1 (ko) * | 2016-08-22 | 2022-02-08 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 및 경화 릴리프 패턴의 제조 방법 |
WO2020004500A1 (ja) * | 2018-06-26 | 2020-01-02 | 旭化成株式会社 | 感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置 |
JP2020029504A (ja) | 2018-08-22 | 2020-02-27 | 日立化成株式会社 | 硬化性組成物 |
WO2020226131A1 (ja) * | 2019-05-08 | 2020-11-12 | 富士フイルム株式会社 | 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス |
WO2020226132A1 (ja) * | 2019-05-08 | 2020-11-12 | 富士フイルム株式会社 | 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス |
JPWO2021079977A1 (ja) * | 2019-10-25 | 2021-04-29 | ||
KR20220155258A (ko) * | 2020-03-18 | 2022-11-22 | 닛산 가가쿠 가부시키가이샤 | 감광성 절연막 형성 조성물 |
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2022
- 2022-03-22 EP EP22780310.3A patent/EP4316814A1/en active Pending
- 2022-03-22 WO PCT/JP2022/013158 patent/WO2022210095A1/ja active Application Filing
- 2022-03-22 WO PCT/JP2022/013159 patent/WO2022210096A1/ja active Application Filing
- 2022-03-22 JP JP2023511016A patent/JPWO2022210095A1/ja active Pending
- 2022-03-22 JP JP2023511017A patent/JPWO2022210096A1/ja active Pending
- 2022-03-22 KR KR1020237031974A patent/KR20230165903A/ko unknown
- 2022-03-22 KR KR1020237031975A patent/KR20230165904A/ko unknown
- 2022-04-01 TW TW111112728A patent/TW202239815A/zh unknown
- 2022-04-01 TW TW111112903A patent/TW202305034A/zh unknown
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2023
- 2023-09-27 US US18/373,415 patent/US20240026069A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20230165904A (ko) | 2023-12-05 |
EP4316814A1 (en) | 2024-02-07 |
KR20230165903A (ko) | 2023-12-05 |
JPWO2022210095A1 (ja) | 2022-10-06 |
US20240026069A1 (en) | 2024-01-25 |
TW202239815A (zh) | 2022-10-16 |
WO2022210095A1 (ja) | 2022-10-06 |
WO2022210096A1 (ja) | 2022-10-06 |
TW202305034A (zh) | 2023-02-01 |
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