JPWO2022124396A1 - - Google Patents

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Publication number
JPWO2022124396A1
JPWO2022124396A1 JP2022568346A JP2022568346A JPWO2022124396A1 JP WO2022124396 A1 JPWO2022124396 A1 JP WO2022124396A1 JP 2022568346 A JP2022568346 A JP 2022568346A JP 2022568346 A JP2022568346 A JP 2022568346A JP WO2022124396 A1 JPWO2022124396 A1 JP WO2022124396A1
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JP
Japan
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JP2022568346A
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Japanese (ja)
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JP7485088B2 (ja
JPWO2022124396A5 (https=
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Priority to JP2024073979A priority Critical patent/JP2024096290A/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/02—Inorganic compounds
    • C09K2200/0239—Oxides, hydroxides, carbonates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
    • C09K2200/0647—Polyepoxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Inorganic Insulating Materials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Details Of Aerials (AREA)
JP2022568346A 2020-12-11 2021-12-10 成形用樹脂組成物及び電子部品装置 Active JP7485088B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024073979A JP2024096290A (ja) 2020-12-11 2024-04-30 成形用樹脂組成物及び電子部品装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPPCT/JP2020/046412 2020-12-11
PCT/JP2020/046412 WO2022123792A1 (ja) 2020-12-11 2020-12-11 成形用樹脂組成物及び電子部品装置
JPPCT/JP2021/017047 2021-04-28
PCT/JP2021/017047 WO2022123807A1 (ja) 2020-12-11 2021-04-28 成形用樹脂組成物及び電子部品装置
PCT/JP2021/045521 WO2022124396A1 (ja) 2020-12-11 2021-12-10 成形用樹脂組成物及び電子部品装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024073979A Division JP2024096290A (ja) 2020-12-11 2024-04-30 成形用樹脂組成物及び電子部品装置

Publications (3)

Publication Number Publication Date
JPWO2022124396A1 true JPWO2022124396A1 (https=) 2022-06-16
JPWO2022124396A5 JPWO2022124396A5 (https=) 2024-02-14
JP7485088B2 JP7485088B2 (ja) 2024-05-16

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JP2024073979A Pending JP2024096290A (ja) 2020-12-11 2024-04-30 成形用樹脂組成物及び電子部品装置

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Country Status (7)

Country Link
US (1) US20240034833A1 (https=)
EP (1) EP4242268A4 (https=)
JP (2) JP7485088B2 (https=)
KR (1) KR20230118098A (https=)
CN (1) CN116529315A (https=)
TW (1) TWI911350B (https=)
WO (3) WO2022123792A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023189965A1 (ja) * 2022-03-30 2023-10-05 デンカ株式会社 球状チタン酸カルシウム粉末及びそれを用いた樹脂組成物
WO2024141855A1 (en) * 2022-12-27 2024-07-04 3M Innovative Properties Company Dielectric curable composition and dielectric curable composition component
CN121079271A (zh) 2023-05-29 2025-12-05 株式会社雅都玛科技 钛酸钙粒子材料、其制造方法、浆料组合物、树脂组合物
JP2025076889A (ja) * 2023-11-02 2025-05-16 株式会社レゾナック 成形用樹脂組成物及び電子部品装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH079609A (ja) * 1993-06-24 1995-01-13 Hitachi Chem Co Ltd 高誘電率積層板
JPH10158472A (ja) * 1996-11-28 1998-06-16 Hitachi Chem Co Ltd エポキシ樹脂組成物、エポキシ樹脂ワニス、エポキシ樹脂プリプレグ及びこのエポキシ樹脂プリプレグを接着用プリプレグとした多層プリント配線板
JP2001192536A (ja) * 2000-01-11 2001-07-17 Mitsubishi Gas Chem Co Inc 高比誘電率ｂステージシート、それを用いたプリント配線板
JP2003147171A (ja) * 2001-11-15 2003-05-21 Hitachi Chem Co Ltd 絶縁樹脂組成物の製造方法、絶縁樹脂組成物、該絶縁樹脂組成物を用いた銅箔付き絶縁材及び銅張積層板
JP2006089530A (ja) * 2004-09-21 2006-04-06 Murata Mfg Co Ltd 樹脂組成物、樹脂硬化物、および積層型電子部品
JP2006225484A (ja) * 2005-02-16 2006-08-31 Murata Mfg Co Ltd 複合誘電体材料及び電子部品
JP2017037287A (ja) * 2015-08-13 2017-02-16 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルムおよびプリント配線板

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345212A (ja) * 2000-05-31 2001-12-14 Tdk Corp 積層電子部品
JP4109500B2 (ja) * 2002-07-08 2008-07-02 株式会社カネカ 熱硬化性樹脂組成物、熱硬化性樹脂溶液、および熱硬化性樹脂シート
JP3947464B2 (ja) * 2002-12-27 2007-07-18 Ｔｄｋ株式会社 樹脂組成物、樹脂硬化物、シート状樹脂硬化物及び積層体
JP2009073987A (ja) * 2007-09-21 2009-04-09 Ajinomoto Co Inc 高誘電樹脂組成物
JP5727224B2 (ja) * 2008-09-05 2015-06-03 住友電気工業株式会社 セラミックス粉末、該セラミックス粉末を含有する誘電性複合材料、及び誘電体アンテナ
US20130337229A1 (en) * 2011-02-02 2013-12-19 Sekisui Chemical Co., Ltd. Roughed cured material and laminated
JP2012216685A (ja) * 2011-03-31 2012-11-08 Nippon Zeon Co Ltd 多層基板
JP6042054B2 (ja) * 2011-05-26 2016-12-14 Dic株式会社 熱硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム
JP6048734B2 (ja) * 2012-11-15 2016-12-21 Dic株式会社 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板
JP6070134B2 (ja) 2012-12-07 2017-02-01 Dic株式会社 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板
CN103351581B (zh) * 2013-07-19 2015-11-25 广东生益科技股份有限公司 一种高介电常数树脂组合物及其用途
JP6066865B2 (ja) 2013-08-15 2017-01-25 信越化学工業株式会社 高誘電率エポキシ樹脂組成物および半導体装置
CN105693141B (zh) * 2014-08-29 2017-08-04 天津德高化成新材料股份有限公司 一种用于指纹传感器感应层的介电复合材料的制备方法
JP6679849B2 (ja) * 2015-07-01 2020-04-15 味の素株式会社 樹脂組成物
JP6519424B2 (ja) 2015-09-16 2019-05-29 住友ベークライト株式会社 高誘電樹脂組成物
US10269732B2 (en) * 2016-07-20 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Info package with integrated antennas or inductors
US10594019B2 (en) * 2016-12-03 2020-03-17 International Business Machines Corporation Wireless communications package with integrated antenna array
JP6832193B2 (ja) 2017-02-27 2021-02-24 京セラ株式会社 樹脂組成物および樹脂封止型半導体装置
MY194474A (en) * 2017-03-14 2022-11-30 Mitsui Mining & Smelting Co Ltd Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor
JP7142233B2 (ja) * 2017-12-14 2022-09-27 パナソニックＩｐマネジメント株式会社 封止用エポキシ樹脂組成物、硬化物、及び半導体装置
CN111344351B (zh) * 2018-02-01 2024-02-09 三井金属矿业株式会社 树脂组合物、带树脂铜箔、介电层、覆铜层叠板、电容器元件以及内置电容器的印刷电路板
JP7354567B2 (ja) * 2019-03-27 2023-10-03 住友ベークライト株式会社 封止用樹脂組成物および半導体装置
JP6870778B1 (ja) * 2020-12-11 2021-05-12 昭和電工マテリアルズ株式会社 成形用樹脂組成物及び電子部品装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH079609A (ja) * 1993-06-24 1995-01-13 Hitachi Chem Co Ltd 高誘電率積層板
JPH10158472A (ja) * 1996-11-28 1998-06-16 Hitachi Chem Co Ltd エポキシ樹脂組成物、エポキシ樹脂ワニス、エポキシ樹脂プリプレグ及びこのエポキシ樹脂プリプレグを接着用プリプレグとした多層プリント配線板
JP2001192536A (ja) * 2000-01-11 2001-07-17 Mitsubishi Gas Chem Co Inc 高比誘電率ｂステージシート、それを用いたプリント配線板
JP2003147171A (ja) * 2001-11-15 2003-05-21 Hitachi Chem Co Ltd 絶縁樹脂組成物の製造方法、絶縁樹脂組成物、該絶縁樹脂組成物を用いた銅箔付き絶縁材及び銅張積層板
JP2006089530A (ja) * 2004-09-21 2006-04-06 Murata Mfg Co Ltd 樹脂組成物、樹脂硬化物、および積層型電子部品
JP2006225484A (ja) * 2005-02-16 2006-08-31 Murata Mfg Co Ltd 複合誘電体材料及び電子部品
JP2017037287A (ja) * 2015-08-13 2017-02-16 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルムおよびプリント配線板

Also Published As

Publication number Publication date
JP7485088B2 (ja) 2024-05-16
US20240034833A1 (en) 2024-02-01
WO2022123807A1 (ja) 2022-06-16
TWI911350B (zh) 2026-01-11
EP4242268A4 (en) 2024-05-01
EP4242268A1 (en) 2023-09-13
JP2024096290A (ja) 2024-07-12
WO2022124396A1 (ja) 2022-06-16
CN116529315A (zh) 2023-08-01
WO2022123792A1 (ja) 2022-06-16
KR20230118098A (ko) 2023-08-10
TW202237723A (zh) 2022-10-01

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