JPWO2022113818A5 - - Google Patents
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- Publication number
- JPWO2022113818A5 JPWO2022113818A5 JP2022565249A JP2022565249A JPWO2022113818A5 JP WO2022113818 A5 JPWO2022113818 A5 JP WO2022113818A5 JP 2022565249 A JP2022565249 A JP 2022565249A JP 2022565249 A JP2022565249 A JP 2022565249A JP WO2022113818 A5 JPWO2022113818 A5 JP WO2022113818A5
- Authority
- JP
- Japan
- Prior art keywords
- hollow portions
- transmission line
- orthogonal
- viewed
- hollow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 59
- 230000005540 biological transmission Effects 0.000 claims description 38
- 239000004020 conductor Substances 0.000 claims description 36
- 239000012212 insulator Substances 0.000 claims description 28
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims 2
- 239000011148 porous material Substances 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 230000000694 effects Effects 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020198385 | 2020-11-30 | ||
| JP2020198385 | 2020-11-30 | ||
| JP2021033558 | 2021-03-03 | ||
| JP2021033558 | 2021-03-03 | ||
| PCT/JP2021/042035 WO2022113818A1 (ja) | 2020-11-30 | 2021-11-16 | 伝送線路及び電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022113818A1 JPWO2022113818A1 (https=) | 2022-06-02 |
| JPWO2022113818A5 true JPWO2022113818A5 (https=) | 2023-07-13 |
| JP7355256B2 JP7355256B2 (ja) | 2023-10-03 |
Family
ID=81756010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022565249A Active JP7355256B2 (ja) | 2020-11-30 | 2021-11-16 | 伝送線路及び電子機器 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US12230423B2 (https=) |
| JP (1) | JP7355256B2 (https=) |
| WO (1) | WO2022113818A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026048599A1 (ja) * | 2024-09-02 | 2026-03-05 | 株式会社村田製作所 | 多層基板及び電子機器 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE27089E (en) * | 1969-10-24 | 1971-03-23 | Planar coaxial circuitry | |
| JPS62269401A (ja) * | 1986-05-16 | 1987-11-21 | Mitsubishi Electric Corp | サスペンデツド線路 |
| US5844450A (en) * | 1996-03-05 | 1998-12-01 | Motorola, Inc. | Integrated microstrip to suspend stripline transition structure and method of fabrication |
| US5712607A (en) | 1996-04-12 | 1998-01-27 | Dittmer; Timothy W. | Air-dielectric stripline |
| US6624729B2 (en) * | 2000-12-29 | 2003-09-23 | Hewlett-Packard Development Company, L.P. | Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board |
| JP2007123740A (ja) * | 2005-10-31 | 2007-05-17 | Sony Corp | フレキシブル基板、光送受信モジュール及び光送受信装置 |
| US8889999B2 (en) * | 2011-10-24 | 2014-11-18 | Cisco Technology, Inc. | Multiple layer printed circuit board with unplated vias |
| JP2017123740A (ja) * | 2016-01-07 | 2017-07-13 | シャープ株式会社 | スイッチング電源 |
| CN208608339U (zh) * | 2016-01-27 | 2019-03-15 | 株式会社村田制作所 | 信号传输线路 |
-
2021
- 2021-11-16 WO PCT/JP2021/042035 patent/WO2022113818A1/ja not_active Ceased
- 2021-11-16 JP JP2022565249A patent/JP7355256B2/ja active Active
-
2023
- 2023-05-17 US US18/198,475 patent/US12230423B2/en active Active
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